Patents by Inventor Markus Lutz
Markus Lutz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11909354Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: GrantFiled: May 25, 2022Date of Patent: February 20, 2024Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
-
Publication number: 20240056054Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.Type: ApplicationFiled: August 14, 2023Publication date: February 15, 2024Inventors: Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Aaron Patridge, Markus Lutz
-
Patent number: 11897757Abstract: The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 1019 cm?3, and preferably between 1019 cm?3 and 1021 cm?3.Type: GrantFiled: July 23, 2021Date of Patent: February 13, 2024Assignee: SiTime CorporationInventors: Renata M. Berger, Ginel C. Hill, Paul M. Hagelin, Charles I. Grosjean, Aaron Partridge, Joseph C. Doll, Markus Lutz
-
Patent number: 11871369Abstract: In various time-transfer systems, one or more fixed-position time beacons broadcast radio-frequency (RF) time-transfer messages to time-keeping modules disposed in remote radio heads and other strategic locations to achieve highly reliable and accurate synchronized time, phase, and frequency transfer over a metropolitan or other wide-field area.Type: GrantFiled: November 22, 2021Date of Patent: January 9, 2024Assignee: SiTime CorporationInventors: Markus Lutz, Sassan Tabatabaei, Charles I. Grosjean, Paul M. Hagelin, Aaron Partridge
-
Publication number: 20240002218Abstract: A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.Type: ApplicationFiled: April 4, 2023Publication date: January 4, 2024Inventors: Aaron Partridge, Markus Lutz, Pavan Gupta
-
Publication number: 20230391611Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: ApplicationFiled: June 6, 2023Publication date: December 7, 2023Inventors: Pavan Gupta, Aaron Partridge, Markus Lutz
-
Patent number: 11807518Abstract: The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 1019 cm-3, and preferably between 1019 cm-3 and 1021 cm-3.Type: GrantFiled: June 19, 2017Date of Patent: November 7, 2023Assignee: SiTime CorporationInventors: Renata M. Berger, Ginel C. Hill, Paul M. Hagelin, Charles I. Grosjean, Aaron Partridge, Joseph C. Doll, Markus Lutz
-
Patent number: 11770112Abstract: A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.Type: GrantFiled: March 10, 2021Date of Patent: September 26, 2023Assignee: SiTime CorporationInventors: Charles I. Grosjean, Ginel C. Hill, Paul M. Hagelin, Renata Melamud Berger, Aaron Partridge, Markus Lutz
-
Patent number: 11708264Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: GrantFiled: May 27, 2022Date of Patent: July 25, 2023Assignee: SiTime CorporationInventors: Pavan Gupta, Aaron Partridge, Markus Lutz
-
Patent number: 11685650Abstract: A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.Type: GrantFiled: August 3, 2020Date of Patent: June 27, 2023Assignee: SiTime CorporationInventors: Aaron Partridge, Markus Lutz, Pavan Gupta
-
Publication number: 20230143663Abstract: A bearing assembly includes a shaft, a first bearing, and a nut. The nut has a thread, which is screwed onto a threaded region formed on the shaft, and a bearing seat formed on the shaft adjoins the threaded region. The inner ring of the first bearing contacts the bearing seat, and the nut contacts the inner ring of the first bearing. The inner ring of the first bearing is arranged spaced apart from the threaded region of the shaft. A runout region of a thread cut into the threaded region of the shaft is arranged in a subsection of the bearing seat adjoining the threaded region.Type: ApplicationFiled: December 1, 2020Publication date: May 11, 2023Applicant: SEW-EURODRIVE GMBH & CO. KGInventors: Ermalt LAMAJ, Jens BLÖMEKE, Norbert SCHNEIDER, Thomas HUBER, Markus LUTZ, Sven WURZER
-
Publication number: 20220356059Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: ApplicationFiled: May 27, 2022Publication date: November 10, 2022Inventors: Pavan Gupta, Aaron Partridge, Markus Lutz
-
Publication number: 20220360218Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: ApplicationFiled: May 25, 2022Publication date: November 10, 2022Inventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
-
Patent number: 11374535Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).Type: GrantFiled: November 29, 2019Date of Patent: June 28, 2022Assignee: SiTime CorporationInventors: Carl Arft, Aaron Partridge, Markus Lutz, Charles I. Grosjean
-
Patent number: 11370656Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: GrantFiled: January 6, 2021Date of Patent: June 28, 2022Assignee: SiTime CorporationInventors: Pavan Gupta, Aaron Partridge, Markus Lutz
-
Patent number: 11218984Abstract: In various time-transfer systems, one or more fixed-position time beacons broadcast radio-frequency (RF) time-transfer messages to time-keeping modules disposed in remote radio heads and other strategic locations to achieve highly reliable and accurate synchronized time, phase, and frequency transfer over a metropolitan or other wide-field area.Type: GrantFiled: October 17, 2019Date of Patent: January 4, 2022Assignee: SiTime CorporationInventors: Markus Lutz, Sassan Tabatabaei, Charles I. Grosjean, Paul M. Hagelin, Aaron Partridge
-
Patent number: 11146228Abstract: A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.Type: GrantFiled: April 30, 2018Date of Patent: October 12, 2021Assignee: Robert Bosch GmbHInventors: Markus Lutz, Aaron Partridge
-
Publication number: 20210221678Abstract: A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.Type: ApplicationFiled: August 3, 2020Publication date: July 22, 2021Inventors: Aaron Partridge, Markus Lutz, Pavan Gupta
-
Publication number: 20210179421Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: ApplicationFiled: January 6, 2021Publication date: June 17, 2021Inventors: Pavan Gupta, Aaron Partridge, Markus Lutz
-
Patent number: 10913655Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead.Type: GrantFiled: June 16, 2020Date of Patent: February 9, 2021Assignee: SiTime CorporationInventors: Pavan Gupta, Aaron Partridge, Markus Lutz