Abstract: A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.

Abstract: The invention relates to a selective ammonia oxidation catalysts comprising a platinum group metal and a support comprising TiO2 doped with 0-10% by weight of SiO2, WO3, ZrO2, Y2O3, La2O3, or a mixture thereof. The invention further comprises methods for the manufacture of the selective ammonia oxidation catalysts, and integrated catalyst systems comprising the selective ammonia oxidation catalysts for treating an exhaust gas stream.

Abstract: The present invention relates to a selective catalytic reduction catalyst for the treatment of an exhaust gas of a diesel engine comprising (i) a flow-through substrate comprising an inlet end, an outlet end, a substrate axial length extending from the inlet end to the outlet end and a plurality of passages defined by internal walls of the flow-through substrate extending therethrough; (II) a coating disposed on the surface of the internal walls of the substrate, where-in the surface defines the interface between the passages and the internal walls, wherein the coating comprises a vanadium oxide supported on an oxidic material comprising titania, and further comprises a mixed oxide of vanadium and one or more of iron, erbium, bismuth, cerium, europium, gadolinium, holmium, lanthanum, lutetium, neodymium, praseodymium, promethium, samarium, scandium, terbium, thulium, ytterbium, yttrium, molybdenum, tungsten, manganese, cobalt, nickel, copper, aluminum and antimony.

Abstract: A household dishwasher includes a dishwasher cavity which includes a base having a first connection flange, a dishwasher cavity casing connected to the base, and a rear wall connected to both the base and the dishwasher cavity casing. The rear wall includes a second connection flange having at least one section resting against the first connection flange. The second connection flange has a deformation region which projects beyond the first connection flange and is bent in a direction oriented away from the first connection flange in such a way that the deformation region rests against the second connection flange.

Abstract: The present invention relates to a selective catalytic reduction catalyst for the treatment of an exhaust gas of a diesel engine comprising (i) a flow-through substrate comprising an inlet end, an outlet end, a substrate axial length extending from the inlet end to the outlet end and a plurality of passages defined by internal walls of the flow-through substrate extending therethrough; (II) a coating disposed on the surface of the internal walls of the substrate, where-in the surface defines the interface between the passages and the internal walls, wherein the coating comprises a vanadium oxide supported on an oxidic material comprising titania, and further comprises a mixed oxide of vanadium and one or more of iron, erbium, bismuth, cerium, europium, gadolinium, holmium, lanthanum, lutetium, neodymium, praseodymium, promethium, samarium, scandium, terbium, thulium, ytterbium, yttrium, molybdenum, tungsten, manganese, cobalt, nickel, copper, aluminum and antimony.

Abstract: A method for undetachably introducing a guiding aid element into at least one joining location of at least one component is provided. The method includes the acts of: a) perforating the at least one component at the at least one joining location in a first press stroke of a tool press, wherein a preliminary hole is formed at the at least one joining location; b) inserting a joining aid element into the at least one preliminary hole; and c) pressing the at least one joining aid element with the at least one component in a subsequent press stroke or working step to form a material-bonding, form-fitting and/or force-fitting connection between the at least one component and the at least one joining aid element. A component and a composite component produced by such a method are also provided.

Abstract: A rotor, for a turbomachine, in particular a gas turbine, having a first flange and a second flange with recesses that are distributed in a direction of distribution, in particular in the peripheral direction, wherein the second flange is fastened to the first flange, in particular detachably, by at least one fastener, which engage in the first of these recesses of the first and second flanges, wherein second ones of these recesses of the first flange, which are free of a fastener, are covered by the second flange.

Abstract: An SCR catalyst for treating diesel exhaust gas has: a flow-through substrate with an inlet end, an outlet end, a substrate axial length extending from the inlet end to the outlet end and a plurality of passages defined by internal walls of the flow through substrate extending therethrough; a first coating disposed on the internal wall surface of the substrate, the surface defining the interface between the internal walls and passages, the first coating extending over 40 to 100% of the substrate axial length, the first coating having an 8-membered ring pore zeolitic material with copper and/or iron; a second coating extending over 20 to 100% of the substrate axial length, the second coating having a first oxidic material with titania, wherein at least 75 wt. % of the second coating is titania, calculated as TiO2, and 0 to 0.01 wt. % of the second coating is vanadium oxides, calculated as V2O5.

Abstract: A dishwasher cavity for a household dishwasher includes a bottom panel having a bottom portion, and a U-shaped dishwasher cavity jacket arranged on the bottom panel and fixedly connected thereto, with the bottom panel and the dishwasher cavity jacket configured to form an attachment flange that encircles the dishwasher cavity. A back panel is attached to the bottom panel and to the dishwasher cavity jacket via the attachment flange. The bottom panel includes a stamped step, which faces in a direction of a top panel of the dishwasher cavity jacket and protrudes out of the bottom portion of the bottom panel, with the attachment flange having a part formed on the stamped step.

Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).

Abstract: The invention relates to a blade for a turbomachine, comprising a blade element with a suction side and a pressure side, which extend between a leading edge and a trailing edge of the blade element, as well as a blade root for connection of the blade at a main rotor body, wherein the blade comprises a crack-affecting device, which, in the radial direction, has an altered cross-sectional geometry in comparison to an aerodynamically optimized blade profile. The invention further relates to a rotor for a turbomachine having at least one such blade, a turbomachine having at least one such blade, and/or with such a rotor as well as a method for producing a blade.

Abstract: Tool (10) for the lower die of a sintering device, the tool (10) having a rest (20) for an electronic subassembly (30) comprising a circuit carrier, to be sintered, where the rest (20) is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly (30).

Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).

Abstract: The invention relates to a laser material processing system comprising a collimation optic (K) having a total collimation focal length (fK), consisting of: a beam supply (Z) for divergent beams (D); a first and second optical device (Ll, L2) having a positive or negative focal length (fl, f2), wherein the divergent beams (D) first pass through the first optical device (Ll) and subsequently pass through the second optical device (L2), and leave the second optical device (L2) in a collimated state; a third optical device (0) arranged downstream of the collimation optic (K) and having a positive focal length (fO) that focuses the beams (P) leaving the collimation optic (K) in a collimated state to a focus (F); a first and second adjusting element (Al, A2) for independently moving the first or the second optical device (LI, L2) away from one another along a beam propagation direction (R), wherein a total beam path (gs) between the beam supply (Z) and an image-side focal plane (B) of the third optical device (0) i

Abstract: A household dishwasher includes a dishwasher cavity which includes a base having a first connection flange, a dishwasher cavity casing connected to the base, and a rear wall connected to both the base and the dishwasher cavity casing. The rear wall includes a second connection flange having at least one section resting against the first connection flange. The second connection flange has a deformation region which projects beyond the first connection flange and is bent in a direction oriented away from the first connection flange in such a way that the deformation region rests against the second connection flange.

Abstract: One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.

Abstract: A method for manufacturing semiconductor chips (2, 3) having arranged thereon metallic shaped bodies (6), having the following steps: arranging a plurality of metallic shaped bodies (6) on a processed semiconductor wafer while forming a layer arranged between the semiconductor wafer and the metallic shaped bodies (6), exhibiting a first connection material (4) and a second connection material (5), and processing the first connection material (4) for connecting the metallic shaped bodies (6) to the semiconductor wafer without processing the second connecting material (5), wherein the semiconductor chips (2, 3) are separated either prior to arranging the metallic shaped bodies (6) on the semiconductor wafer or after processing the first connection material (4).

Abstract: Sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die. The lower die forms a support for the assembly to be sintered and the upper die includes a receptacle for a pressure pad for exerting pressure directed towards the lower die, and a delimitation wall which laterally surrounds the pressure pad. The delimitation wall having an outer delimitation wall and an inner delimitation wall surrounded by the outer delimitation wall, the inner delimitation wall mounted so as to be slidable towards the outer delimitation wall and so as to be slid in the direction of the lower die such that, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die.

Abstract: A method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module by sintering, the method comprising the steps of: applying a layer of unsintered sinter material to a predetermined bonding surface of the first component, arranging the second component on the surface layer of unsintered sinter material, attaching the second component to the first component by applying pressure and/or temperature on a locally delimited partial area within the predetermined bonding surface, processing the first and/or second component and/or other components of the power semiconductor module, and complete-area sintering of the sinter material.

Abstract: An electronic sandwich structure which has at least a first and a second part to be joined, which are sintered together by means of a sintering layer. The sintering layer is formed as a substantially uninterrupted connecting layer, the density of which varies in such a way that at least one region of higher density and at least one region of lower density alternate with one another. A method for forming a sintering layer of an electronic sandwich structure, in which firstly a sintering material layer is applied substantially continuously to a first part to be joined as a connecting layer, this sintering material layer is subsequently dried and, finally, alternating regions of higher density and of lower density of the connecting layer are produced by sintering the first part to be joined with the sintering layer on a second part to be joined.