Abstract: A method for undetachably introducing a guiding aid element into at least one joining location of at least one component is provided. The method includes the acts of: a) perforating the at least one component at the at least one joining location in a first press stroke of a tool press, wherein a preliminary hole is formed at the at least one joining location; b) inserting a joining aid element into the at least one preliminary hole; and c) pressing the at least one joining aid element with the at least one component in a subsequent press stroke or working step to form a material-bonding, form-fitting and/or force-fitting connection between the at least one component and the at least one joining aid element. A component and a composite component produced by such a method are also provided.

Abstract: The invention relates to a blade for a turbomachine, comprising a blade element with a suction side and a pressure side, which extend between a leading edge and a trailing edge of the blade element, as well as a blade root for connection of the blade at a main rotor body, wherein the blade comprises a crack-affecting device, which, in the radial direction, has an altered cross-sectional geometry in comparison to an aerodynamically optimized blade profile. The invention further relates to a rotor for a turbomachine having at least one such blade, a turbomachine having at least one such blade, and/or with such a rotor as well as a method for producing a blade.

Abstract: A description is given of an electronic sandwich structure which has at least a first and a second part to be joined, which are sintered together by means of a sintering layer. The sintering layer is formed as a substantially uninterrupted connecting layer, the density of which varies in such a way that at least one region of higher density and at least one region of lower density alternate with one another. A description is also given of a method for forming a sintering layer of an electronic sandwich structure, in which firstly a sintering material layer is applied substantially continuously to a first part to be joined as a connecting layer, this sintering material layer is subsequently dried and, finally, alternating regions of higher density and of lower density of the connecting layer are produced by sintering the first part to be joined with the sintering layer on a second part to be joined.

Abstract: The present invention relates to a component arrangement, in particular a rotor, for a turbomachine, in particular a gas turbine, having a first flange and a second flange with recesses that are distributed in a direction of distribution, in particular in the peripheral direction, wherein the second flange is fastened to the first flange, in particular detachably, by at least one fastener, which engage in the first of these recesses of the first and second flanges, wherein second ones of these recesses of the first flange, which are free of a fastener, are covered by the second flange.

Abstract: A power semiconductor contact structure for power semiconductor modules, which has at least one substrate 1 and a metal molded body 2 as an electrode, which are sintered one on top of the other by means of a substantially uninterrupted sintering layer 3a with regions of varying thickness. The metal molded body 2 takes the form here of a flexible contacting film 5 of such a thickness that this contacting film is sintered with its side 4 facing the sintering layer 3a onto the regions of varying thickness of the sintering layer substantially over the full surface area. A description is also given of a method for forming a power semiconductor contact structure in a power semiconductor module that has a substrate and a metal molded body.

Abstract: A method for manufacturing semiconductor chips (2, 3) having arranged thereon metallic shaped bodies (6), having the following steps: arranging a plurality of metallic shaped bodies (6) on a processed semiconductor wafer while forming a layer arranged between the semiconductor wafer and the metallic shaped bodies (6), exhibiting a first connection material (4) and a second connection material (5), and processing the first connection material (4) for connecting the metallic shaped bodies (6) to the semiconductor wafer without processing the second connecting material (5), wherein the semiconductor chips (2, 3) are separated either prior to arranging the metallic shaped bodies (6) on the semiconductor wafer or after processing the first connection material (4).

Abstract: The invention relates to a laser material processing system comprising a collimation optic (K) having a total collimation focal length (fK), consisting of: a beam supply (Z) for divergent beams (D); a first and second optical device (Ll, L2) having a positive or negative focal length (fl, f2), wherein the divergent beams (D) first pass through the first optical device (Ll) and subsequently pass through the second optical device (L2), and leave the second optical device (L2) in a collimated state; a third optical device (0) arranged downstream of the collimation optic (K) and having a positive focal length (fO) that focuses the beams (P) leaving the collimation optic (K) in a collimated state to a focus (F); a first and second adjusting element (Al, A2) for independently moving the first or the second optical device (LI, L2) away from one another along a beam propagation direction (R), wherein a total beam path (gs) between the beam supply (Z) and an image-side focal plane (B) of the third optical device (0) i

Abstract: A description is given of a power semiconductor module 10 which can be transferred from a normal operating mode to an explosion-free robust short-circuit failure mode. Said power semiconductor module 10 comprises a power semiconductor 1 having metallizations 3 which form potential areas and are separated by insulations and passivations on the top side 2 of said power semiconductor. Furthermore, an electrically conductive connecting layer is provided, on which at least one metal shaped body 4 which has a low lateral electrical resistance and is significantly thicker than the connecting layer is arranged, said at least one metal shaped body being applied by sintering of the connecting layer such that said metal shaped body is cohesively connected to the respective potential area.

Abstract: A method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module by sintering, the method comprising the steps of: applying a layer of unsintered sinter material to a predetermined bonding surface of the first component, arranging the second component on the surface layer of unsintered sinter material, attaching the second component to the first component by applying pressure and/or temperature on a locally delimited partial area within the predetermined bonding surface, processing the first and/or second component and/or other components of the power semiconductor module, and complete-area sintering of the sinter material.

Abstract: A power semiconductor contact structure for power semiconductor modules, which has at least one substrate 1 and a metal moulded body 2 as an electrode, which are sintered one on top of the other by means of a substantially uninterrupted sintering layer 3a with regions of varying thickness. The metal moulded body 2 takes the form here of a flexible contacting film 5 of such a thickness that this contacting film is sintered with its side 4 facing the sintering layer 3a onto the regions of varying thickness of the sintering layer substantially over the full surface area. A description is also given of a method for forming a power semiconductor contact structure in a power semiconductor module that has a substrate and a metal moulded body.

Abstract: The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal molded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal molded bodies, and applying the metal molded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the molded body.

Abstract: Systems, methods, and apparatus embodiments are described herein for designing, implementing, and maintaining energy systems, such as microgrids for example.

Abstract: A bearing housing (1) of an exhaust-gas turbocharger, having a compressor-side housing flange (2), a central housing section (3) which is integrally connected to the housing flange (2) and in which a first partial section (4) of an oil chamber (5) is arranged; and a turbine-side housing section (6) which has a turbine-side housing flange (7) and in which a second partial section (8) of the oil chamber (5) is formed. The central housing section (3) and the turbine-side housing section (6) are formed in one piece. A bearing housing (9) which forms a separate component is inserted into the central housing section (3) and into the turbine-side housing section (6), with these delimiting the oil chamber (5).

Abstract: Sintering device (10) for sintering at least one electronic assembly (BG), having a lower die (20) and an upper die (30) which is slidable towards the lower die (20), or a lower die (20) which is slidable towards the upper die (30), wherein the lower die (20) forms a support for the assembly (BG) to be sintered and the upper die (30) comprises a receptacle which receives a pressure pad (32) for exerting pressure directed towards the lower die (20) and which comprises a delimitation wall (34) which laterally surrounds the pressure pad (32), and wherein the delimitation wall (34) has an outer delimitation wall (34a) and an inner delimitation wall (34b) which is surrounded in an adjacent manner by the outer delimitation wall (34a), and wherein the inner delimitation wall (34b) is mounted so as to be slidable towards the outer delimitation wall (34a) and, when pressure in the direction of the upper die (30) is exerted on the pressure pad (32), is mounted so as to be slid in the direction of the lower die (20), wh

Abstract: Tool (10) for the lower die of a sintering device, the tool (10) having a rest (20) for an electronic subassembly (30) comprising a circuit carrier, to be sintered, where the rest (20) is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly (30).

Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).

Abstract: An exhaust-gas turbocharger (1) having a compressor (2), which has a compressor housing (3); a turbine (4), which has a turbine housing (5): and a bearing housing (6), which is arranged between the compressor housing (3) and the turbine housing (5) and is connected to the compressor housing (3) by way of a compressor-side connecting device and to the turbine housing (5) by way of a turbine-side connecting device (7). The turbine housing-side and/or compressor-side connecting device (7) is in the form of a taper key bolted joint having bolts (8, 9, 10) which are arranged at least substantially perpendicularly to an exhaust-gas turbocharger longitudinal axis (L).

Abstract: A dishwasher includes a wash container for receiving items to be washed and a front frame which has an open bottom and an upper frame run and is disposed in surrounding relationship to a front loading opening of the wash container. The front frame has a cross-sectional profile and is provided with at least one height stop that projects beyond the cross-sectional profile in height and is configured as a tab in the upper frame run.

Abstract: In the generic exhaust-gas turbocharger, the turbine-side and compressor-side radial bearing bush are of identical design. A more compact bearing space, and improvements in acoustics and rotor dynamics, are achieved by providing different bearings on the turbine and compressor sides.

Abstract: The invention relates to a power semiconductor chip (10) having at least one upper-sided potential surface and contacting thick wires (50) or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal molded body (24, 25) on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires (50) or strips arranged on the upper side of the molded body used according to the method for contacting are selected corresponding to the magnitude.