Abstract: A method generates a sampling clock signal in a communication block of a memory device having a plurality of communication blocks which are distributed in the memory device. The method includes receiving an input clock signal in the communication block, generating, only in response to the input clock signal, a local clock signal having a predetermined phase relationship with respect to the input clock signal, and generating the sampling clock signal based on the local clock signal.

Abstract: A method of transmitting data between different clock domains includes receiving data bits on the basis of a receiving clock, sequentially storing the data bits in a ring buffer, simultaneously transmitting a number of the stored data bits from the ring buffer on the basis of a first transmitting clock, and transmitting the stored data bits from the ring buffer on the basis of a second transmitting clock.

Abstract: The invention provides a data handover unit for transferring data from a first clock domain to a second clock domain, comprising: a first clock unit operable to supply a first clock signal; a selector stage operable to sample an incoming data stream with respect to the first clock signal; a second clock unit operable to supply a second clock signal; a storage unit coupled with the selector stage, wherein the storage unit has a first plurality of storage elements each of which is operable to store one bit of data of the sampled data stream, an output unit for parallelly reading out a frame of data from a second plurality of storage elements included in the first plurality of storage elements with respect to the second clock signal, wherein the selector stage is further operable to successively write the data bits of the sampled data stream into the first plurality of storage elements and to store the respective data bits of the sampled data stream in the respective storage elements until they were read out by

Abstract: A method of electrostatic discharge (ESD) protection of an electronic circuit includes coupling a first circuit point of the electronic circuit to a first capacitance, coupling a second circuit point of the electronic circuit to a second capacitance, and substantially diverting an ESD voltage pulse occurring at the first circuit point via the second circuit point with the second capacitance.

Abstract: A digital control loop and a method for clock generation. A control loop includes at least one phase detector configured to detect a phase shift of a feedback signal relative to a reference clock signal and output a correction signal on the basis of the phase shift detected. At least one control loop filter is configured to output, on the basis of the correction signal, a first control signal and a second control signal, the first control signal being substantially the same as the second control signal except that oscillations are suppressed in the second control signal. At least one first phase generator is configured to output a first clock signal on the basis of the first control signal and the first phase reference signal, wherein the first clock signal is transmitted at least partially as feedback signal to the phase detector.

Abstract: A semiconductor memory chip includes: a reception interface section for receiving external data, command, and address signals in form of serial signal frames; an intermediate data buffer for intermediately storing write data and, optionally, write data mask bits to be written to a memory cell array; a memory core having a bank organized memory cell array; a decoder section for decoding an address derived from a signal frame received from the reception interface section for writing/reading data in/from one or more memory banks of the memory cell array in accordance with a write/read command within one or more received signal frames; and a frame decoder provided as an interface between the reception interface section and the memory core for decoding one or more commands included in one or more frames and outputting data addresses, command, and read/write access indication signals to the memory core and to the intermediate data buffer.

Abstract: A method generates a sampling clock signal in a communication block of a memory device having a plurality of communication blocks which are distributed in the memory device. The method includes receiving an input clock signal in the communication block, generating, only in response to the input clock signal, a local clock signal having a predetermined phase relationship with respect to the input clock signal, and generating the sampling clock signal based on the local clock signal.

Abstract: A semiconductor memory chip includes: a reception interface section for receiving external data, command, and address signals in form of serial signal frames; an intermediate data buffer for intermediately storing write data and, optionally, write data mask bits to be written to a memory cell array; a memory core having a bank organized memory cell array; a decoder section for decoding an address derived from a signal frame received from the reception interface section for writing/reading data in/from one or more memory banks of the memory cell array in accordance with a write/read command within one or more received signal frames; and a frame decoder provided as an interface between the reception interface section and the memory core for decoding one or more commands included in one or more frames and outputting data addresses, command, and read/write access indication signals to the memory core and to the intermediate data buffer.

Abstract: A phase locked loop having reduced inherent noise is provided. The phase locked loop comprises a controlled oscillator for outputting a periodic output signal as a result of a control signal; a feedback unit for providing at least two periodic feedback signals having a constant phase shift to each other and each depending on the output signal; a phase/frequency detector for providing difference signals each depending on a periodic input signal and at least one of the feedback signals; and a control circuit for providing the control signal to the controlled oscillator depending on the difference signals.

Abstract: A high-speed interface circuit is implemented in a semiconductor memory chip including a memory core, a first interface circuit section, and a second interface circuit section. The first interface circuit section is connectable to a write data-/command and address signal bus, includes a write data-/command and address re-driver/transmitter path (which may be transparent) and does not include any clock signal synchronizing circuitry, and a main write signal path including a serial-to-parallel converting and synchronizing device to synchronize with a reference clock signal received write data-/command and address signals and delivering the parallel converted write signals to the memory core.

Abstract: A high-speed interface circuit is implemented in a semiconductor memory chip including a memory core, a first interface circuit section, and a second interface circuit section. The first interface circuit section is connectable to a write data-/command and address signal bus, includes a write data-/command and address re-driver/transmitter path (which may be transparent) and does not include any clock signal synchronizing circuitry, and a main write signal path including a serial-to-parallel converting and synchronizing device to synchronize with a reference clock signal received write data-/command and address signals and delivering the parallel converted write signals to the memory core.

Abstract: An ESD protection device diverts an overvoltage present on a semiconductor circuit by a heat conducting arrangement arranged in the ESD protection device. The heat conducting arrangement includes contact holes filled with metal and arranged in the vicinity of a hotspot of the ESD protection device to divert heat from the hotspot. The hotspot is thus a critical point with regard to temperature on a discharge path via which the overvoltage is diverted in the case of an ESD.

Abstract: An ESD protection device for protecting a circuit against electrostatic discharges. The ESD protection device having a series circuit of N diodes, each diode comprising an anode and a cathode. The series circuit being connected between two supply potentials. The diodes being so arranged that a spatial distance between the anode of a first diode and the cathode of an Nth diode of the series circuit is less than a maximum distance between the anode or cathode of a first spatially outer diode of the series circuit and the anode or cathode of a second spatially outer diode of the series circuit.

Abstract: An ESD protective circuit protects an input or output of a monolithically integrated circuit. The ESD protective circuit has at least one bipolar transistor structure and one ESD protective element between two supply networks. The emitter of the bipolar transistor structure is electrically connected to the input or output, while the base is electrically connected to one of the two supply networks. The collector produces a current signal, which is used for triggering of the ESD protective element, when an ESD load occurs at the input or output.

Abstract: Integrated circuit arrangement having first and second signal input pads, to which a differential input signal is applied, and first and second signal outputs, at which a differential output signal is provided. The first signal output is coupled to the first signal input pad and the second signal output is coupled to the second signal input pad. A first capacitance is between the first and second signal input pads. First and second inductances are connected in series, are between the first and second signal input pads, and are connected in parallel with the first capacitance. A first terminal is at a first supply potential and a second terminal is at a second supply potential. A first electrostatic discharge element is between the first and second terminals. A second electrostatic discharge element is between the first terminal, on the one hand, and the first and second inductances, on the other hand.

Abstract: A circuit is described that protects an integrated circuit from electrostatic discharges or electrical over-stress. The circuit arrangement has first and second protective elements connected in series between a connection of the integrated circuit and a supply voltage. When electrostatic discharges or electrical over-stress occurs, current flows through the conductive path formed through the first and second protective elements. A current path that contains a circuit element limits current through the first protective element is connected in parallel with the first protective element. The first protective element has blocking behavior when no electrostatic discharges or electrical over-stress occurs, a limited current flows through the current path and the second protective element.

Abstract: To test the ESD resistance of a semiconductor component, for example of a NOS transistor, which can be used as a PSD protective element in a chip, a direct current characteristic of the semiconductor component is monitored and the ESD resistance of the respective semiconductor component is inferred depending on this. In particular, the direct current failure threshold of the semiconductor component at which an increased leakage current occurs in the non-conducting direction of the semiconductor component can be monitored in operation of the semiconductor component using an applied direct current and the ESD resistance of the semiconductor component inferred depending on a change in this direct current failure threshold.

Abstract: A transistor contains a source region and a drain region. Two or more fill areas are formed such that the fill areas and the source and/or drain region engage in one another. The fill areas have vertical dimensions which are at least of equal size to the vertical dimensions of the source and/or of the drain region. The fill areas and the source and/or drain region extend at least partially over a common vertical section. The fill areas are formed from an oxide and/or a nitride.

Abstract: An ESD protective circuit protects an input or output of a monolithically integrated circuit. The ESD protective circuit has at least one bipolar transistor structure and one ESD protective element between two supply networks. The emitter of the bipolar transistor structure is electrically connected to the input or output, while the base is electrically connected to one of the two supply networks. The collector produces a current signal, which is used for triggering of the ESD protective element, when an ESD load occurs at the input or output.

Abstract: An electrostatic discharge (ESD) protective apparatus for a semiconductor circuit has at least one ESD protective element, which is connected between the substrate contact and a ground potential connection, and is electrically connected to the substrate contact. The ESD protective element may be in the form of an ESD protective diode or an ESD protective transistor. It is also possible to connect a resistor or an ESD protective transistor between the substrate contact and the ground potential connection as an ESD protective element, and additionally to connect an ESD protective diode or an ESD protective transistor between the substrate contact and a supply voltage potential connection.