Patents by Inventor Masaharu Shirai
Masaharu Shirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8446734Abstract: The invention relates to a circuit board having high density circuit and excellent connection reliability and lamination reliability. A resin fabric cloth (4) is provided by arranging single fibers (4a) or fiber bundles composed of a plurality of single fibers, which single fiber has a linear thermal expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin fabric cloth is covered with a resin portion (5) made of a resin material having a linear thermal expansion coefficient larger than that of silicon.Type: GrantFiled: March 30, 2007Date of Patent: May 21, 2013Assignee: Kyocera CorporationInventors: Katsura Hayashi, Yutaka Tsukada, Kimihiro Yamanaka, Masaharu Shirai, Isamu Kirikihira
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Patent number: 8129623Abstract: The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).Type: GrantFiled: January 29, 2007Date of Patent: March 6, 2012Assignee: Kyocera CorporationInventors: Tadashi Nagasawa, Masaharu Shirai, Kenji Kume, Yutaka Tsukada
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Patent number: 8012561Abstract: A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.Type: GrantFiled: March 26, 2008Date of Patent: September 6, 2011Assignee: Kyocera CorporationInventors: Masaaki Harazono, Masaharu Shirai, Katsura Hayashi
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Patent number: 7945191Abstract: An image forming apparatus includes: an image holder; a charging unit that charges the image holder; a latent image forming unit; a developing unit that forms a toner image; a transfer unit that transfers the toner image formed on the surface of the image holder onto a recording medium; a toner-particle removal unit that removes toner particles remaining on the surface of the image holder after the transfer of the toner image by the transfer unit; and an external-additive removal unit that includes a conductive blade disposed to contact the surface of the image holder and removes, after the transfer of the toner image by the transfer unit, external additive remaining on the surface of the image holder using the conductive blade while applying a voltage to the surface of the image holder via the conductive blade.Type: GrantFiled: August 27, 2009Date of Patent: May 17, 2011Assignee: Fuji Xerox Co., Ltd.Inventor: Masaharu Shirai
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Publication number: 20100259910Abstract: The invention relates to a circuit board having high density circuit and excellent connection reliability and lamination reliability. A resin fabric cloth (4) is provided by arranging single fibers (4a) or fiber bundles composed of a plurality of single fibers, which single fiber has a linear thermal expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin fabric cloth is covered with a resin portion (5) made of a resin material having a linear thermal expansion coefficient larger than that of silicon.Type: ApplicationFiled: March 30, 2007Publication date: October 14, 2010Applicant: KYOCERA CORPORATIONInventors: Katsura Hayashi, Yutaka Tsukada, Kimihiro Yamanaka, Masaharu Shirai, Isamu Kirikihira
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Publication number: 20100247190Abstract: An image forming apparatus includes: an image holder; a charging unit that charges the image holder; a latent image forming unit; a developing unit that forms a toner image; a transfer unit that transfers the toner image formed on the surface of the image holder onto a recording medium; a toner-particle removal unit that removes toner particles remaining on the surface of the image holder after the transfer of the toner image by the transfer unit; and an external-additive removal unit that includes a conductive blade disposed to contact the surface of the image holder and removes, after the transfer of the toner image by the transfer unit, external additive remaining on the surface of the image holder using the conductive blade while applying a voltage to the surface of the image holder via the conductive blade.Type: ApplicationFiled: August 27, 2009Publication date: September 30, 2010Applicant: FUJI XEROX CO., LTD.Inventor: Masaharu SHIRAI
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Publication number: 20100136284Abstract: A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.Type: ApplicationFiled: March 26, 2008Publication date: June 3, 2010Applicant: KYOCERA CORPORATIONInventors: Masaaki Harazono, Masaharu Shirai, Katsura Hayashi
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Patent number: 7715777Abstract: An image forming apparatus includes an image carrier; a charger that electrically charges the image carrier; an image forming section that forms an electrostatic latent image on the image carrier and develops the electrostatic latent image; a transferring-fixing section that transfers the image from the image carrier and fix the image onto a recording medium; a cleaning member; and a cleaning member moving section. The cleaning member cleans an unnecessary substance adhering onto a surface of the image carrier by abutting against the surface of the image carrier, and is capable of moving between an abutment position and a separation position where the cleaning member is separated from the image carrier. The cleaning member moving section moves the cleaning member from the separation position to the abutment position in accordance with a surface resistance of the surface of the image carrier.Type: GrantFiled: March 27, 2008Date of Patent: May 11, 2010Assignee: Fuji Xerox Co., Ltd.Inventors: Masaharu Shirai, Nobuhide Inaba, Ryo Sekiguchi, Toshie Furuya
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Publication number: 20090314526Abstract: The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).Type: ApplicationFiled: January 29, 2007Publication date: December 24, 2009Applicant: KYOCERA CORPORATIONInventors: Tadashi Nagasawa, Masaharu Shirai, Kenji Kume, Yutaka Tsukada
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Publication number: 20090035036Abstract: An image forming apparatus includes an image carrier; a charger that electrically charges the image carrier; an image forming section that forms an electrostatic latent image on the image carrier and develops the electrostatic latent image; a transferring-fixing section that transfers the image from the image carrier and fix the image onto a recording medium; a cleaning member; and a cleaning member moving section. The cleaning member cleans an unnecessary substance adhering onto a surface of the image carrier by abutting against the surface of the image carrier, and is capable of moving between an abutment position and a separation position where the cleaning member is separated from the image carrier. The cleaning member moving section moves the cleaning member from the separation position to the abutment position in accordance with a surface resistance of the surface of the image carrier.Type: ApplicationFiled: March 27, 2008Publication date: February 5, 2009Applicant: FUJI XEROX CO., LTD.Inventors: Masaharu Shirai, Nobuhide Inaba, Ryo Sekiguchi, Toshie Furuya
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Patent number: 6612028Abstract: Methods are provided for the manufacture of a conductive layer on an insulating layer and for the manufacture of a built-up circuit board, each include an innovative step of irradiating the surface of an insulating (resin) layer with ultraviolet light, so that a conventional swelling process can be eliminated or simplified.Type: GrantFiled: October 30, 2000Date of Patent: September 2, 2003Assignee: International Business Machines CorporationInventor: Masaharu Shirai
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Patent number: 6338937Abstract: The method of producing a wiring board comprises the steps of: preparing a photosensitive resin layer; pressing the photosensitive resin layer; exposing the pressed photosensitive resin layer to light by using a exposure mask on which a predetermined pattern is formed; and developing the exposed photosensitive resin layer.Type: GrantFiled: December 9, 1999Date of Patent: January 15, 2002Assignee: International Business Machines CorporationInventors: Masaharu Shirai, Shinji Yamada
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Patent number: 6048465Abstract: Short circuiting in printed circuit boards made by processes in which a continuous metal layer applied by electroless deposition is etched to form the conductor pattern is eliminated by subjecting the board to an oxidation treatment after etching but before removal of the etching agent.Type: GrantFiled: March 25, 1998Date of Patent: April 11, 2000Assignee: International Business Machines CorporationInventor: Masaharu Shirai
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Patent number: 5998739Abstract: Short circuiting in printed circuit boards made by processes in which a continuous metal layer applied by electroless deposition is etched to form the conductor pattern is eliminated by subjecting the board to an oxidation treatment after etching but before removal of the etching agent. A circuit board is thereby formed having an insulating material substrate and a conductor formed thereon.Type: GrantFiled: November 6, 1995Date of Patent: December 7, 1999Assignee: International Business Machines CorporationInventor: Masaharu Shirai
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Patent number: 5784781Abstract: A manufacturing process for an organic chip carrier is disclosed which permits one to form a substantially bowl-shaped via hole in the substrate of the chip carrier, which makes it easy to deposit a conductive layer having a substantially uniform thickness on the sidewall of the via hole. In accordance with the manufacturing process, photosensitive resin 3 is provided on a substrate 1 in a thickness which is the thickness necessary for a final insulating layer plus a thickness to be removed by, for example grinding, the photosensitive resin 3. Cavities are then formed in the photosensitive resin 3 in a predetermined pattern by exposure and development. The photosensitive resin 3 formed with the cavities 8 is heat-cured. Subsequently, when the photo-cured layer 6a and a part of the heat-cured layer 3a are removed, e.g., ground off, a substantially bowl-shaped via hole 9 is formed.Type: GrantFiled: November 16, 1995Date of Patent: July 28, 1998Assignee: International Business Machines CorporationInventors: Masaharu Shirai, Kenji Terada, Yutaka Tsukada, Shuhei Tsuchita
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Patent number: 5776662Abstract: To inhibit the migration of conductive layers in a multilayer chip carrier, e.g., a multilayer printed circuit board, an optically cured layer 13, which is an anti-migration layer, is formed in an insulating layer 12 located between a first conductive layer 8 and a second conductive layer 6. Such a structure is formed by thinning, e.g., grinding down, a first insulating layer, leaving about half the thickness of the first insulating layer. This first insulating layer is selectively optically irradiated with actinic radiation to form an optically cured layer. Via holes are etched into the non-irradiated portions of the first insulating layer. Thereafter, a second insulating layer is formed on the first insulating layer, and it too is selectively optically irradiated with actinic radiation. Via holes are etched into the non-irradiated portions of the second insulating layer, directly over the via holes in the first insulating layer, and the second insulating layer is also thinned.Type: GrantFiled: May 14, 1996Date of Patent: July 7, 1998Assignee: International Business Machines CorporationInventors: Masaharu Shirai, Yutaka Tsukada
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Patent number: 5766825Abstract: A method of forming a surface laminated circuit printed circuit board (SLC) where a photosensitive thermosetting resin in solution is applied atop a circuitized substrate. The method starts with the step of concentrating and solidifying the photosensitive thermosetting resin to build up a hardness therein high enough to withstand abrasion. This is done by first dissolving the photosensitive thermosetting resin in a solvent and then applying the solution to a substantially uneven surface. This is followed by evaporating solvent at a temperature below the curing temperature of the photosensitive thermosetting resin. Next, the surface of said resin layer is abraded to form a substantially even surface, and the resin layer is cured by heating the resin high enough to cross link and polymerize the resin.Type: GrantFiled: October 11, 1995Date of Patent: June 16, 1998Assignee: International Business Machines Corp.Inventors: Masaharu Shirai, Shuhichi Okabe, Yoshiteru Kohno
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Patent number: 5537740Abstract: A blind hole extending from upper or surface wiring of a printed circuit board to inner or lower wiring, and having an opening larger than the bottom, is formed on a substrate, and a conductor pattern is formed on the bottom and the internal wall of the blind hole to connect the inner wiring with the surface wiring.Type: GrantFiled: November 22, 1995Date of Patent: July 23, 1996Assignee: International Business Machines CorporationInventors: Masaharu Shirai, Shuhei Tsuchita
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Patent number: 5517756Abstract: In a substrate member (e.g., circuit board), a plurality of openings (15) are formed in an insulating film (14) which covers electric lines (12) formed on a substrate 11, with pad constructing (contacting) portions (13) of selected ones of the electric lines being exposed. In one example, the pad constructing portion (that portion of the pad to which final connection is to occur, e.g., by solder to a semiconductor device), is set to a first dimension (e.g., length) having a dimension less than a corresponding dimension of the original length. The film openings are also set to another dimension having an allowance size larger than a corresponding dimension of the pad constructing portion. The opening is thus of sufficiently large size in comparison to the respective pad being exposed so as to assure effective tolerance compensation for film positioning deviations in at least two (e.g., X and Y) directions as might occur during production of the substrate member.Type: GrantFiled: May 23, 1994Date of Patent: May 21, 1996Assignee: International Business Machines CorporationInventors: Masaharu Shirai, Kimihiro Yamanaka
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Patent number: 5510580Abstract: A blind hole extending from upper or surface wiring of a printed circuit board to inner or lower wiring, and having an opening larger than the bottom, is formed on a substrate, and a conductor pattern is formed on the bottom and the internal wall of the blind hole to connect the inner wiring with the surface wiring.Type: GrantFiled: March 30, 1995Date of Patent: April 23, 1996Assignee: International Business Machines CorporationInventors: Masaharu Shirai, Shuhei Tsuchita