Abstract: A substrate processing apparatus includes a plasma generation unit that generates a plasma from a process gas in a plasma generation space in which a substrate is placed. The substrate processing apparatus also includes a cooling unit opposed to the substrate with a cooling space located in between. The cooling unit includes a supply port that supplies the process gas to the cooling space. The substrate processing apparatus also includes a process gas supply unit that supplies the process gas to the cooling unit. The substrate processing apparatus further includes a communication portion that communicates the cooling space and the plasma generation space to supply the process gas, which has been supplied to the cooling space, to the plasma generation space.

Abstract: Objects of the present invention are to provide a compound which is highly active against pests, to provide a pest control agent comprising the compound, and to provide a method for controlling a pest by applying the compound. The present invention provides a 4-(arylethynyl)pyridine or a salt thereof, a pest control agent which comprises the 4-(arylethynyl)pyridine or salt thereof as an active ingredient, and a method for controlling a pest by applying the 4-(arylethynyl)pyridine or salt thereof in an effective amount.

Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.

Abstract: A flow rate measuring device with high precision is provided. The flow rate measuring device includes a sub-passage that takes a part of the fluid flowing in a main passage, first temperature measuring means for measuring a temperature of the fluid flowing in the passage, second temperature measuring means for measuring a temperature of a fluid flowing in the sub-passage, detecting means for detecting a flow rate of the fluid flowing in the sub-passage, and measuring means for measuring a flow rate of the fluid flowing within the main channel on the basis of an output of the first temperature measuring means, an output of the second temperature measuring means, and an output of the detecting means.

Abstract: A touch panel of the present invention includes a touch panel substrate, a cover substrate provided to overlap the touch panel, and a connection part including a scattering layer laminated from the cover substrate side toward the touch panel substrate side and is provided between the touch panel substrate and the cover substrate in an area other than a display area.

Abstract: A fluid measurement device includes a circuit unit into which a first signal output from a first detection element and a second signal output from a second detection element are input. The circuit unit includes a signal processing part, a state deciding part, and a controller. The controller controls an amount of change that a change of the first signal imparts to the third signal in accordance with a result of decision by the state deciding part that determines that the state of the first signal is not within the predetermined range. The predetermined range is based on the second signal.

Abstract: In a related art sensor device, an output voltage of the sensor device is fixed not to a power supply voltage or a ground potential but to an intermediate potential upon disconnection of a power supply line or a ground line. A sensor device 1 is composed of: a detection element 8 whose voltage Vsen changes depending on a detected physical quantity; an output circuit configured by MOS switches 4 to 6, 7, 9, 10 and 12 to 17, capacitors 2, 11 and 18, an operational amplifier 19, a reference voltage source 20, and output NMOS transistor 21; a series circuit of the MOS switch 4 and the capacitor 2, the series circuit being arranged in a negative feedback part of the output circuit; and a diode 3 that connects a well electrode of the MOS switch 4 and a power supply terminal Vcc.

Abstract: Provided is a method for fabricating a microchip for nucleic acid amplification reaction that is capable of simple and highly accurate analysis. Provided is a method for fabricating a microchip for nucleic acid amplification reaction, the method including a solidification step of drying a reagent solution including at least a part of substances required for a nucleic acid amplification reaction, and a containment step of arranging the reagent solution including the solidified substance in wells that serve as a reaction site for a nucleic acid amplification reaction. In the microchip for nucleic acid amplification reaction fabricated by the fabrication method, since substances required for the nucleic acid amplification reaction are contained by being solidified, non-specific amplification is suppressed in a nucleic acid amplification reaction, which enables highly accurate analysis.

Abstract: A thin substrate processing device includes a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.

Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.

Abstract: A biological information acquisition method for acquiring information on a living body on a basis of a quantified value of a physiologically active substance originated from the living body, includes a step of collecting the physiologically active substance from a body surface of the living body.

Abstract: Provided is a sensor device that suppresses a malfunction caused by a negative surge or a voltage drop. A sensor device includes a sensor element having an electrical characteristic varying according to a physical amount, a signal processing circuit configured to process an output signal of the sensor element, a transistor element interposed between a power source terminal and the signal processing circuit, a resistive element configured to connect a drain and a gate of the transistor element, or a collector and a base of the transistor element, and an element having threshold voltage for connecting the gate or the base of the transistor element to a GND. The element regulates current flowing from the resistive element in a direction of the GND, in a case in which supply voltage to the signal processing circuit falls below the threshold voltage.

Abstract: A semiconductor device in which reliability of a bonding pad to which a conductive wire is bonded is achieved. A bonding pad having an OPM structure is formed of an Al—Cu alloy film having a Cu concentration of 2 wt % or more. By increasing the Cu concentration, the Al—Cu alloy film forming the bonding pad is hardened. Therefore, the bonding pad is difficult to be deformed by impact in bonding of a Cu wire, and deformation of an OPM film as following the deformation of the bonding pad can be reduced. In this manner, concentration of a stress on the OPM film caused by the impact from the Cu wire can be reduced, and therefore, the breakage of the OPM film can be prevented.

Abstract: A thermal flow sensor with improved measurement accuracy is provided. The thermal flow sensor includes: an air flow rate detection element with a diaphragm having a thin-film portion in a semiconductor substrate; at least one heat generating resistor on the diaphragm; at least one temperature measuring resistor that detects temperature on each of an upstream side and a downstream side of the heat generating resistor; and a correction circuit portion that processes an output signal of the air flow rate detection element on the basis of temperature difference information of at least the two temperature measuring resistors on the upstream side and the downstream side, wherein a waveform of the output signal processed by the correction circuit portion is a waveform obtained by cutting a part of a mountain part or a valley part constituting a peak value by outputting of an arbitrary predetermined value when the peak value of the waveform exceeds the arbitrary predetermined value.

Abstract: A gas sensor device of the present invention, aiming sufficient correction results of an internal combustion engine under different operation conditions, includes a concentration sensor for measuring the concentration of gas and a pressure sensor for measuring the pressure of the gas. The gas sensor device also includes a measuring chamber incorporating the concentration sensor and the pressure sensor, and a processing circuit unit that adjusts a signal of the concentration sensor using a signal of the pressure sensor. The processing circuit unit may preferably be provided with a response speed adjusting unit that brings the response speed of a detected signal of the pressure sensor close to the response speed of a detected signal of the concentration sensor.

Abstract: In order to provide a thermal mass flowmeter which makes higher accuracy of gas flowrate measurement possible while reliability in the thermal mass flowmeter is ensured (while deterioration or breakage caused by droplet adhesion is prevented), the thermal mass flowmeter according to the present invention has a heating element for generating heat by conduction, a temperature detection bridge circuit for detecting a temperature of the heating element, and a sensor element driving circuit portion connected to the heating element and the temperature detection bridge circuit and executing conduction control to the heating element, in which the sensor element driving circuit portion has an output mechanism and an output impedance adjustment mechanism and the output impedance adjustment mechanism is disposed between the output mechanism and the heating element and its output impedance is higher than an electric resistance value of the heating element and less than 1 M?.

Abstract: The present invention makes it possible to improve the reliability of a semiconductor device. The semiconductor device has, over a semiconductor substrate, a pad electrode formed at the uppermost layer of a plurality of wiring layers, a surface protective film having an opening over the pad electrode, a redistribution line being formed over the surface protective film and having an upper surface and a side surface, a sidewall barrier film comprising an insulating film covering the side surface and exposing the upper surface of the redistribution line, and a cap metallic film covering the upper surface of the redistribution line. Then the upper surface and side surface of the redistribution line are covered with the cap metallic film or the sidewall barrier film and the cap metallic film and the sidewall barrier film have an overlapping section.

Abstract: To provide a gas sensor apparatus capable of preventing clogging of a gas intake port due to particles, droplets, or the like, of a gas and maintaining measurement accuracy for a long time, a gas sensor apparatus 1 includes a housing 3. The housing 3 includes an expansion chamber 6 communicating with an air intake passage 2 via an air intake port 8, and a measurement chamber 5 communicating with the expansion chamber 6 via a communicating portion 7. A double squeezing structure including the gas intake port 8 and the communicating portion 7 is provided, and two stages of regions where the volume expands between the gas intake port 8 and the measurement chamber 5 are provided. As a result, the movement of the air in the measurement chamber 5 is decreased. It is possible to provide a structure in which the capacity of the gas intake port 8 is increased to avoid clogging of the gas intake port due to particles or droplets.

Abstract: A touch panel of the present invention includes: a cover substrate; a connector being provided on an area of the cover substrate other than a display area, and including a color layer and a shield layer, the shield layer being formed from a multilayer structure, the multilayer structure being configured so that a metal layer and a dielectric layer which is thicker than the metal layer are alternately laminated; and a touch panel substrate being arranged to face the cover substrate with the connector interposed therebetween.

Abstract: In order to prevent deterioration and a breakdown of a sensor element when the sensor element is activated in a state where liquid is attached thereto, and to remove the liquid in a short period of time with lower power consumption, there is provided a gas sensor including a first heating element and a second heating element that is formed around the periphery of the first heating element and has a wider forming area than the first heating element, and measuring a gas amount by heating the first heating element to a predetermined temperature, in which the second heating element is heated when the gas sensor is activated, and the first heating element is heated to the predetermined temperature after a heat value of the first heating element is restricted for a predetermined period of time.