Abstract: The present invention provides a DNA coding for a protein defined in the following (A) or (B) is obtained from Brevibacterium flavum chromosomal DNA library by cloning a DNA fragment that complicates serB deficiency of Escherichia coli as a open reading frame in the DNA fragment. (A) A protein which comprises an amino acid sequence of SEQ ID: 2 in Sequence Listing; or (B) A protein which comprises an amino acid sequence including substitution, deletion, insertion, addition or inversion of one or several amino acids in the amino acid sequence of SEQ ID NO: 2 in Sequence Listing, and which has phosphoserine phosphatase activity.

Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

Abstract: The present invention provides a DNA coding for a protein defined in the following (A) or (B) is obtained from Brevibacterium flavum chromosomal DNA library by cloning a DNA fragment that complicates serB deficiency of Escherichia coli as a open reading frame in the DNA fragment.

Abstract: A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7.

Abstract: A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.

Abstract: A multilayer wiring substrate which can be produced by a simple method and has a high connection reliability is disclosed.

Abstract: The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other.

Abstract: The object of the present invention is to produce a polymer, which is free from the troubles of the coloration and the decrease in the mechanical properties of molded articles (films, etc.), crosslinkage failure, migration (stain) or the like, by the living radical polymerization method wherein the content of impurities consisting of a transition metal and its ligand employed as a polymerization activator is reduced. A process for producing a polymer is described, comprising: a) the step of performing a polymerization reaction by using a monomer, a transition metal and its ligand and a polymerization initiator to form a polymer; and b) the step of eliminating the transition metal and its ligand contained in the polymer under the condition of a viscosity of 100 Pa•s or below, wherein the step b comprises: b1) the former step of eliminating the transition metal and its ligand insoluble in the polymer; and b2) the latter step of eliminating the transition metal and its ligand dissolved in the polymer.

Abstract: A semiconductive belt comprising a polyimide film having a volume resistivity of 109 &OHgr;cm to 1016 &OHgr;cm and a surface resistivity of 1010 &OHgr; to 1017 &OHgr; at 25° C. and 60% RH, wherein the amount of change of the surface resistivity between 30° C. and 85% RH and 10° C. and 15% RH in terms of common logarithm being is 1.0 or smaller.

Abstract: A low-thermal expansion circuit board comprising an insulating layer made of an organic polymer having thereon a wiring conductor for bare chip mounting, wherein the wiring conductor is an iron-nickel-based alloy layer having a copper layer on at least one side thereof; and a low-thermal expansion multilayer circuit board having a plurality of the low-thermal expansion circuit boards via an adhesive layer, the adhesive layer having through-holes filled with solder to connect the circuits layers.

Abstract: Disclosed is a coryneform bacterium having resistance to azaserine or &bgr;-(2-thienyl)-DL-alanine and having L-serine productivity.

Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

Abstract: A recombinant DNA autonomously replicable in cells of coryneform bacteria, comprising a DNA sequence coding for an aspartokinase in which feedback inhibition by L-lysine and L-threonine is substantially desensitized, and a DNA sequence coding for a diaminopimelate decarboxylase; a coryneform bacterium harboring an aspartokinase in which feedback inhibition by L-lysine and L-threonine is substantially desensitized, and comprising an enhanced DNA sequence coding for a diaminopimelate decarboxylase; and a method for producing L-lysine comprising the steps of cultivating the coryneform bacterium in an appropriate medium to allow L-lysine to be produced and accumulated in a culture of the bacterium, and collecting L-lysine from the culture.

Abstract: A low thermal expansion circuit board 1 on which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an Ni—Fe-based alloy foil or a titanium foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin layer 5 on the side on which a semiconductor element is to be mounted.

Abstract: The present invention relates to a multilayer wiring substrate for mounting a semiconductor chip, etc. The multilayer wiring substrate is comprised of a plurality of double-sided circuit substrates, each comprised of an organic high molecular weight insulating layer and wiring conductor. An adhesive is used for laminating the double-sided circuit substrates. A Ni--Fe based alloy foil or a titanium foil is embedded within the organic high molecular weight insulating layer.

Abstract: A semiconductor device capable of meeting the demand for fine-pitched wiring of semiconductor element and highly dense mounting thereof, as well as the demand for a thin structure thereof, which device being superior in the adhesion property of an insulating resin to be used for sealing a semiconductor element and a film carrier, and thus highly reliable. In FIG. 1, a conductive circuit (5) is embedded so that it will not be exposed at the both surfaces (6a, 6b) of an insulator layer (6), and conductive paths (7, 8) are formed in a pair from the both surfaces (5a, 5b) of the conductive circuit (5), the conductive paths slipping relative to each other in the direction of the surface of the conductive circuit (5). The conductive paths (7, 8) are respectively connected to bumps (9, 10), and the conductive circuit (5) and bumps (9, 10) are conducted via conductive paths (7, 8).

Abstract: A coryneform bacterium in which a DNA coding for a diaminopimelate decarboxylase and a DNA coding for a diaminopimelate dehydrogenase are enhanced is cultivated in a medium to allow L-lysine to be produced and accumulated in a culture, and L-lysine is collected from the culture.

Abstract: L-serine is produced by cultivating in a medium a coryneform bacterium having L-serine productivity in which an activity of at least one of phosphoserine phosphatase and phosphoserine transaminase is enhanced, preferably, further having introduced therein a gene coding for D-3-phosophoglycerate dehydrogenase in which feedback inhibition by L-serine is desensitized, allowing L-serine to accumulate in the medium, and collecting the L-serine from the medium.

Abstract: A coryneform bacterium harboring an aspartokinase in which feedback inhibition by L-lysine and L-threonine is substantially desensitized, and comprising an enhanced DNA sequence coding for a dihydrodipicolinate reductase, an enhanced DNA sequence coding for dihydropicolinate reductase, an enhance DNA sequence coding for dihydropicolinate synthase, an enhanced DNA sequence coding for diaminopimelate decarboxylase and an enhanced DNA sequence coding for aspartate aminotransferase; a method for producing L-lysine comprising the steps of cultivating the coryneform bacterium in an appropriate medium to allow L-lysine to be produced and accumulated in a culture of the bacterium, and collecting L-lysine from the culture; and a recombinant DNA usable for production of the coryneform bacterium.

Abstract: A phosphoenolpyruvate carboxylase gene, which has mutation such as mutation to replace 625th glutamic acid from the N-terminus of phosphoenolpyruvate carboxylase with lysine, mutation to replace 438th arginine from the N-terminus with cysteine and the like, is introduced into Escherichia coli or coryneform bacteria, so as to produce a phosphoenolpyruvate carboxylase which is not substantially inhibited by aspartic acid, thereby amino acid is efficiently produced.