Patents by Inventor Masakazu Sugimoto

Masakazu Sugimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5876983
    Abstract: A phosphoenolpyruvate carboxylase gene, which has mutation such as mutation to replace 625th glutamic acid from the N-terminus of phosphoenolpyruvate carboxylase with lysine, mutation to replace 438th arginine from the N-terminus with cysteine and the like, is introduced into Escherichia coli or coryneform bacteria, so as to produce a phosphoenolpyruvate carboxylase which is not substantially inhibited by aspartic acid, thereby amino acid is efficiently produced.
    Type: Grant
    Filed: April 29, 1996
    Date of Patent: March 2, 1999
    Assignee: Ajinomoto Co., Inc.
    Inventors: Masakazu Sugimoto, Tomoko Suzuki, Hiroshi Matsui, Katsura Izui
  • Patent number: 5848465
    Abstract: A method for fabrication of a probe includes the steps of: (1) forming a structure wherein a contact part formed on one side of an insulating flexible substrate and a conductor formed on either side or the inside of the flexible substrate are electrically continued, and (2) joining the flexible substrate and a rigid frame substrate capable of supporting the tension in the planar direction of the flexible substrate at the outer periphery thereof, by bonding them by lamination pressing after heating, or by heating after lamination pressing, thereby applying a planar tension to the flexible substrate enclosed by the rigid substrate.
    Type: Grant
    Filed: October 29, 1996
    Date of Patent: December 15, 1998
    Assignee: Nitto Denko Corporation
    Inventors: Atsushi Hino, Shoji Morita, Masakazu Sugimoto
  • Patent number: 5821626
    Abstract: A film carrier comprising, on a laminate of an insulating layer and a conductive circuit, a conductive part to be connected to an external substrate and an energy introduction part to supply an energy to connect a semiconductor element, a semiconductor device, and a method for mounting a semiconductor element. The present invention has enabled provision of fine-pitched or highly dense wiring of a semiconductor element, and assures easy and dependable electric construction of the present invention wherein an energy for connection is supplied from the energy introduction part to make a connection of a film carrier to semiconductor element is advantageous in that attenuation of the energy for connection due to an insulating layer occurs less, since the energy for connection can be directly introduced into conductive circuit, thus enabling efficient utilization of the energy, which in turn permits easy and efficient mounting of a semiconductor element.
    Type: Grant
    Filed: June 25, 1996
    Date of Patent: October 13, 1998
    Assignee: Nitto Denko Corporation
    Inventors: Kazuo Ouchi, Shoji Morita, Atsushi Hino, Masakazu Sugimoto
  • Patent number: 5804414
    Abstract: A method of amplifying a desired gene in a chromosome of a coryneform bacterium, which comprises forming an artificial transposon in which a drug resistance gene and the desired gene are inserted into an insertion sequence of the coryneform bacterium, and introducing said artificial transposon into the coryneform bacterium. In accordance with the method of the present invention, a desired gene can be amplified in a chromosome in coryneform bacteria which are used in the industrial production of amino acids or nucleic acids.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: September 8, 1998
    Assignee: Ajinomoto Co., Inc.
    Inventors: Mika Moriya, Hiroshi Matsui, Kenzo Yokozeki, Seiko Hirano, Atsushi Hayakawa, Masako Izui, Masakazu Sugimoto
  • Patent number: 5766925
    Abstract: A coryneform bacterium having high L-lysine productivity is provided by integrating a gene coding for aspartokinase originating from coryneform bacteria with desensitized feedback inhibition by L-lysine and L-threonine, into chromosomal DNA of a coryneform bacterium harboring leaky type homoserine dehydrogenase or a coryneform bacterium deficient in homoserine dehydrogenase gene.
    Type: Grant
    Filed: October 8, 1996
    Date of Patent: June 16, 1998
    Assignee: Ajinomoto Co., Inc.
    Inventors: Masakazu Sugimoto, Yoshihiro Usuda, Tomoko Suzuki, Akiko Tanaka, Hiroshi Matsui
  • Patent number: 5756347
    Abstract: A plasmid having a temperature-sensitive replication origin which has the following properties:a) capable of autonomous replication in Corynebacterium and being retained in Corynebacterium; and,b) when a cell containing said plasmid is cultured at 31.degree. to 37.degree. C., replication of the plasmid is inhibited and at the same time, the plasmid is removed from the cell body; and a method for performing homologous recombination in Corynebacterium using the plasmid.
    Type: Grant
    Filed: December 13, 1996
    Date of Patent: May 26, 1998
    Assignee: Ajinomoto Co., Inc.
    Inventors: Masakazu Sugimoto, Hiroyuki Kojima, Akiko Tanaka, Hiroshi Matsui, Katsuaki Sato, Tsuyoshi Nakamatsu
  • Patent number: 5688671
    Abstract: Recombinant DNA replicable in microorganisms belonging to the genus Corynebacterium, which contains a DNA fragment coding for an aspartokinase .alpha.-subunit protein originating from a bacterium belonging to the genus Corynebacterium, in which synergistic feedback inhibition by L-lysine and L-threonine is substantially desensitized, and a DNA fragment coding for an aspartokinase .beta.-subunit protein originating from a bacterium belonging to the genus Corynebacterium, in which synergistic feedback inhibition by L-lysine and L-threonine is substantially desensitized, is introduced into a microorganism belonging to the genus Corynebacterium. Thus a transformant having enhanced production and excretion speeds of L-lysine is obtained. The transformant is cultivated in an appropriate medium, and produced L-lysine is separated.
    Type: Grant
    Filed: October 27, 1995
    Date of Patent: November 18, 1997
    Assignee: Ajinomoto Co., Inc.
    Inventors: Masakazu Sugimoto, Yuri Ogawa, Tomoko Suzuki, Akiko Tanaka, Hiroshi Matsui
  • Patent number: 5616480
    Abstract: A plasmid having a temperature-sensitive replication origin which has the following properties:a) capable of autonomous replication in Corynebacterium and being retained in Corynebacterium; and,b) when a cell containing said plasmid is cultured at 31.degree. to 37.degree. C., replication of the plasmid is inhibited and at the same time, the plasmid is removed from the cell body; and a method for performing homologous recombination in Corynebacterium using the plasmid.
    Type: Grant
    Filed: March 22, 1995
    Date of Patent: April 1, 1997
    Assignee: Ajinomoto Co., Inc.
    Inventors: Masakazu Sugimoto, Hiroyuki Kojima, Akiko Tanaka, Hiroshi Matsui, Katsuaki Sato, Tsuyoshi Nakamatsu
  • Patent number: 5431863
    Abstract: A method of mounting a semiconductor device including a film carrier having an insulating film having on one side thereof a connecting lead and a semiconductor element junctioned with the film carrier on an outer substrate, which includes forming an opening for adhesive forcing or adhesive injection in the insulating film within its bonding area to be in contact with a land part on the outer substrate and in an area near the bonding area, connecting the connecting lead to the land part on the outer substrate, and forcing or injecting an adhesive through the opening formed in the insulating film into the space between the film carrier and the outer substrate.
    Type: Grant
    Filed: August 4, 1993
    Date of Patent: July 11, 1995
    Assignee: Nitto Denko Corporation
    Inventors: Amane Mochizuki, Masako Maeda, Masakazu Sugimoto, Munekazu Tanaka, Tetsuya Terada
  • Patent number: 5374469
    Abstract: A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.
    Type: Grant
    Filed: September 17, 1992
    Date of Patent: December 20, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Atsushi Hino, Amane Mochizuki, Kazuo Ouchi, Shoji Morita, Toshiki Naito, Kazumi Higashi, Masako Maeda, Masayuki Kaneto, Munekazu Tanaka, Masakazu Sugimoto
  • Patent number: 5330825
    Abstract: A printed circuit substrate with projected electrode and a connection method using the same are disclosed. The printed circuit substrate comprises an insulating substrate having formed on one surface or both surfaces thereof an electrically conductive circuit, wherein at least one projected electrode comprising a metallic substance is formed at the side of the end portion of the electrically conductive circuit.
    Type: Grant
    Filed: February 24, 1993
    Date of Patent: July 19, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Kazuo Ouchi, Masakazu Sugimoto
  • Patent number: 5188702
    Abstract: An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.
    Type: Grant
    Filed: April 23, 1992
    Date of Patent: February 23, 1993
    Assignee: Nitto Denko Corporation
    Inventors: Yoshinari Takayama, Amane Mochizuki, Atsushi Hino, Kazuo Ouchi, Masakazu Sugimoto
  • Patent number: 5136359
    Abstract: An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.
    Type: Grant
    Filed: December 19, 1990
    Date of Patent: August 4, 1992
    Assignee: Nitto Denko Corporation
    Inventors: Yoshinari Takayama, Amane Mochizuki, Atsushi Hino, Kazuo Ouchi, Masakazu Sugimoto
  • Patent number: 5072289
    Abstract: A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.
    Type: Grant
    Filed: November 8, 1989
    Date of Patent: December 10, 1991
    Assignee: Nitto Denko Corporation
    Inventors: Masakazu Sugimoto, Kazuo Ouchi, Mikio Aizawa, Atsushi Hino, Kazuto Shinozaki, Tetsuya Terada, Takanori Miyoshi, Munekazu Tanaka, Shoji Morita, Amane Mochizuki, Yoshinari Takayama
  • Patent number: 4470937
    Abstract: In a screw-type cold feed extrusion molding apparatus is provided a size control device adapted to control the sizes of extrusion molded articles through detection of the load current of the motor for driving the feed screw and take-off conveyor of the extrusion molding apparatus at speeds which vary in such a manner as to enable a molding material to be fed smoothly from the inlet toward the extrusion die of the apparatus so that fluctuations which would otherwise be caused in the sizes of the extrusion molded articles due to the presence of a molding material stagnant in the inlet of the apparatus are precluded reliably.
    Type: Grant
    Filed: July 8, 1982
    Date of Patent: September 11, 1984
    Assignee: Bridgestone Tire Company, Limited
    Inventors: Masakazu Sugimoto, Shuji Kuhara, Takeshi Kusaba
  • Patent number: 4276499
    Abstract: A rotary actuator comprise a stator defining a cylindrical space and formed with a pair of diametrically opposite main magnetic poles adapted to be magnetized to the same polarity, a pair of drive coils disposed on the main poles, a drive circuit for energizing the drive coils, and a rotor having a plurality of pairs of magnetized zones separated by non-magnetized zones, all disposed around the circumference of the rotor, adjacent magnetized zones being of opposite polarities.
    Type: Grant
    Filed: May 29, 1979
    Date of Patent: June 30, 1981
    Assignee: Denki Onkyo Company, Limited
    Inventors: Noboru Masuda, Masakazu Sugimoto