Abstract: A semiconductor memory device according to the invention has an active state where data can be read and written and a standby state where the data are retained. It has a memory cell array including a plurality of memory cells arranged in a matrix, and a refresh controller which refreshes data stored in the plurality of memory cells. In the refresh controller, a first refresh cycle generator generates a first refresh cycle, while a second refresh cycle generator generates a second refresh cycle having a period shorter than the first refresh cycle. A refresh processor performs refresh operation when the refresh operation becomes possible after the first refresh cycle and, when refresh operation is not performed for a longer period than the first refresh cycle, it performs refresh operations successively based on the second refresh cycle in the longer period or after the end of the longer period.

Abstract: A first reference current having a first temperature characteristic is generated by a first reference current generating circuit (1) while a second reference current having a second temperature characteristic is generated by a second reference current generating circuit (2). A temperature characteristic multiplying circuit (3) amplifies the first reference current by using a current difference between the first and second reference currents to generate a reference current having a third temperature characteristic higher than the first temperature characteristic, so that a ring oscillator (X) determines a refresh period on the basis of the reference current.

Abstract: The semiconductor integrated circuit incudes an input circuit which receives a signal, an internal circuit which applies a predetermined function to the received signal, and an output circuit which outputs the signal applied with the predetermined function. An external power supply voltage VDD and an IO power supply voltage VDDQ which is lower than the voltage VDD are supplied to the semiconductor integrated circuit. A voltage VIO obtained by decreasing the external power supply voltage VDD is supplied to the input circuit. The IO power supply voltage VDDQ is supplied to the output circuit.

Abstract: When address signal bits and/or data bits in a predetermined pattern are accessed a predetermined number of times successively, a test mode can be set. By using address signal bits and/or data bits as a test command for designating a test content, a test content is specified. A semiconductor memory device with an interface compatible with an interface of a normal static random access memory is provided.

Abstract: In a semiconductor memory device, a refresh circuit outputs a refresh command signal for executing refresh operation. The refresh circuit includes a command-signal activating circuit for activating the refresh command signal, and a determination circuit for determining whether the activated refresh command signal is to be output. The determination circuit determines that the activated refresh command signal is to be output when the semiconductor memory device is in a standby state. Thereby, the semiconductor memory device enables stable refresh operation to be executed.

Abstract: A semiconductor memory device such as a pseudo SRAM or the like is provided with a memory cell array being refreshed in accordance with a refresh timing signal having a predetermined refresh period and generated by a refresh timing signal generator circuit. A selector selects a block to hold data in the memory cell array divided into a plurality of blocks in accordance with a predetermined command signal, and a signal generator changes the refresh period according to a number of blocks selected by said selecting means, and generates a refresh timing signal having a changed refresh period and outputs a generated refresh signal.

Abstract: A variable impedance power supply line and a variable impedance ground line supplying voltages VCL1 and VSL1, respectively, are set to a low impedance state in a stand-by cycle and in a row related signal set period, and to a high impedance state in a column circuitry valid time period. Variable impedance power supply line and variable impedance ground line supplying voltages VCL2 and VSL2, respectively, are set to a high impedance state in the stand-by cycle, and low impedance state in the active cycle and in the row related signal reset time period. Inverters operate as operating power supply voltage of voltages VCL1 and VSL2 or voltages VCL2 and VSL1, in access with a logic level of an output signal in the stand-by cycle and in the active cycle. Thus a semiconductor memory device is provided in which subthreshold current in the stand-by cycle and active DC current in the active cycle can be reduced.

Abstract: Activation/inactivation of an internal normal row activation signal for controlling a memory cell selecting operation is controlled in response to leading and trailing edges of an address transition detection signal. When an internal normal row activating signal is activated, generation of an address transition detection signal is masked by mask circuitry. Conflict between an activating operation and an inactivating operation of the normal row activating signal can be prevented and an internal operation can be performed stably. A refresh-control-free dynamic semiconductor memory device having an interface compatible with a static random access memory and capable of stably performing an internal operation is provided.

Abstract: A semiconductor memory device is provided with a memory cell array including memory cells being arranged in a shape of matrix and requiring a refresh operation. In the semiconductor memory device, a control circuit controls a timing of the refresh operation in accordance with an internal signal independently of an external signal and controlling the memory cell array in a non-normal operation mode different from a normal operation mode for writing data into the memory cell array and reading out data from the memory cell array. The control circuit starts the non-normal operation mode in response to a sequence of entry into the non-normal operation mode based on a predetermined first command signal, sets the non-normal operation mode in response to a sequence of setting the non-normal operation mode based on a predetermined second command signal, and thereafter, executes operation of the corresponding non-normal operation mode which is set.

Abstract: A semiconductor memory device such as a pseudo SRAM or the like is provided with a memory cell array being refreshed in accordance with a refresh timing signal having a predetermined refresh period and generated by a refresh timing signal generator circuit. A selector selects a block to hold data in the memory cell array divided into a plurality of blocks in accordance with a predetermined command signal, and a signal generator changes the refresh period according to a number of blocks selected by said selecting means, and generates a refresh timing signal having a changed refresh period and outputs a generated refresh signal.

Abstract: In a freeze reset circuit in a semiconductor memory device, when a row act signal is not activated in a predetermined period determined by a trailing edge delay circuit after a chip enable signal is set to the H level during a write or read operation, a freeze reset signal is output from a logic gate after a predetermined period. As a result, the semiconductor memory device terminates the write or read operation. Therefore, the semiconductor memory device can ensure the stability of the write or read operation.

Abstract: A semiconductor integrated circuit which is supplied with a first power supply voltage and a second power supply voltage from outside so as to operate incorporated circuits, and outputs data at an output terminal, includes an internal circuit that carries out a predetermined function for an input signal, an output circuit which includes a first circuit for converting the signal from the internal circuit into an output signal and a second circuit containing a final stage buffer circuit which outputs, depending on the signal from the first circuit, data to the output terminal; and a switching circuit that switches a power supply voltage supplied to the second circuit, to either the first power supply voltage or the second power supply voltage. A voltage obtained by decreasing the first power supply voltage is supplied to the internal circuit. The first power supply voltage is supplied to the second circuit.

Abstract: The semiconductor integrated circuit incudes an input circuit which receives a signal, an internal circuit which applies a predetermined function to the received signal, and an output circuit which outputs the signal applied with the predetermined function. An external power supply voltage VDD and an IO power supply voltage VDDQ which is lower than the voltage VDD are supplied to the semiconductor integrated circuit. A voltage VIO obtained by decreasing the external power supply voltage VDD is supplied to the input circuit. The IO power supply voltage VDDQ is supplied to the output circuit.

Abstract: A variable impedance power supply line and a variable impedance ground line supplying voltages VCL1 and VSL1, respectively, are set to a low impedance state in a stand-by cycle and in a row related signal set period, and to a high impedance state in a column circuitry valid time period. Variable impedance power supply line and variable impedance ground line supplying voltages VCL2 and VSL2, respectively, are set to a high impedance state in the stand-by cycle, and low impedance state in the active cycle and in the row related signal reset time period. Inverters operate as operating power supply voltage of voltages VCL1 and VSL2 or voltages VCL2 and VSL1, in accordance with a logic level of, an output signal in the stand-by cycle and in the active cycle. Thus a semiconductor memory device is provided in which subthreshold current in the stand-by cycle and active DC current in the active cycle can be reduced.

Abstract: A composite gate detects whether an internal array is in a selected state and an internal row activation signal is activated in accordance with a timing relationship between an output signal of the composite gate and an address transition detection signal. When the address transition detection signal is applied, the internal row activation signal is deactivated in accordance with generation timings of delayed restore period signal indicating whether the internal array is in a selected state and of the address transition detection signal to permit the next row access. With such a configuration, the next operation is allowed to start after an internal state is surely restored to an initial state. When the next address transition detection signal is applied during a period of a restoration operation, a column recovery operation, or a refreshing operation, data access is correctly performed without causing data destruction.

Abstract: A DRAM performs data writing if a column activation signal ZCOLRE is activated with changing of an internal address Add and then an internal write control signal WDRV is activated by generation of a write signal WE from an outside. However, in order to solve a problem that data writing does not performed in some cases when the data writing is performed at optional timing, a semiconductor memory device according to the present invention includes a delay unit, thereby delaying an output of the internal write control signal WDRV until the column activation signal ZCOLRE is activated, even when the write signal WE is generated.

Abstract: A semiconductor memory device according to the invention has an active state where data can be read and written and a standby state where the data are retained. It has a memory cell array including a plurality of memory cells arranged in a matrix, and a refresh controller which refreshes data stored in the plurality of memory cells. In the refresh controller, a first refresh cycle generator generates a first refresh cycle, while a second refresh cycle generator which generates a second refresh cycle having a period shorter than the first refresh cycle. A refresh processor performs refresh operation when the refresh operation becomes possible after the first refresh cycle and, when refresh operation is not performed for a longer period than the first refresh cycle, it performs refresh operations successively based on the second refresh cycle in the longer period or after the end of the longer period.

Abstract: A plurality of semiconductor chips are mounted in the same package, and a power supply is shared by the output circuits of the chips. In this case, even though the internal circuit power supplies of the chips are turned off, since an output circuit is in an ON state, a through current may flow from another chip. Therefore, a circuit for setting transistors constituting the output circuits of the chips in high-impedance states when the power supplies for the internal circuits of the respective semiconductor chips are turned off is added.

Abstract: A first reference current having a first temperature characteristic is generated by a first reference current generating circuit (1) while a second reference current having a second temperature characteristic is generated by a second reference current generating circuit (2). A temperature characteristic multiplying circuit (3) amplifies the first reference current by using a current difference between the first and second reference currents to generate a reference current having a third temperature characteristic higher than the first temperature characteristic, so that a ring oscillator (X) determines a refresh period on the basis of the reference current.

Abstract: The semiconductor memory device of the invention has a refresh timer for generating a refresh clock, a refresh executing circuit for sequentially refreshing a plurality of memory cells part by part on the basis of the cycle of the refresh clock, and a refreshing control circuit disposed between the refresh timer and the refresh executing circuit, for stopping transmission of the refresh clock from the refresh timer to the refresh executing circuit in a predetermined period during which the cycle of the refresh clock is easy to become unstable. With the configuration, an erroneous operation of the refresh executing circuit can be prevented.