Abstract: A drive device includes plural moving portions, piezoelectric motors that move the moving portions, at least one drive circuit that drives the piezoelectric motors, and a connection/disconnection portion that connects and disconnects the piezoelectric motors and the drive circuit. The number of drive circuits is fewer than the number of piezoelectric motors.

Abstract: An electronic component testing device includes a first imaging device for imaging an upper-surface electrode of an electronic component before the electronic component is held by a holding part, a second imaging device for imaging a contact terminal provided to a testing head, a third imaging device for imaging a lower-surface electrode of the electronic component held by the holding part, and a fourth imaging device for imaging a testing socket. A control device controls the position adjustment part of the testing head to adjust the position of the holding part, and thereby controlling, based on images captured by the first and second imaging devices, a holding orientation when the holding part holds the electronic component, and controlling, based on the images captured by the third and fourth imaging devices, a holding orientation of the holding part in relation to the testing socket.

Abstract: A component transport apparatus includes: a transport hand including a plurality of index units each one of which is capable of holding a component; a movable body that moves the transport hand; and a plurality of functional stations on which the components are mounted. The index units function to mount the components on the functional stations. The functional stations are spaced apart at intervals along a movement direction of the transport hand. The index units are spaced apart at intervals equal to the intervals at which the functional stations are spaced apart along the movement direction of the transport hand.

Abstract: A first imaging unit forming a first image by imaging a first surface of an electronic component having the first surface and a second surface, a second imaging unit forming a second image by imaging the second surface, a grasping unit grasping the electronic component, a movable unit moving the grasping unit, and a control unit detecting a position of the first surface using the first image, detecting a position of the second surface using the second image, and controlling the grasping unit and the movable unit are provided. The grasping unit brings relative positions between the grasping unit and the first surface into predetermined relative positions and grasps the electronic component using position information of the first surface detected by the control unit, and the movable unit moves the second surface to a predetermined position using position information of the second surface detected by the control unit.

Abstract: An electronic component testing device includes a first imaging device for imaging an upper-surface electrode of an electronic component before the electronic component is held by a holding part, a second imaging device for imaging a contact terminal provided to a testing head, a third imaging device for imaging a lower-surface electrode of the electronic component held by the holding part, and a fourth imaging device for imaging a testing socket. A control device controls the position adjustment part of the testing head to adjust the position of the holding part, and thereby controlling, based on images captured by the first and second imaging devices, a holding orientation when the holding part holds the electronic component, and controlling, based on the images captured by the third and fourth imaging devices, a holding orientation of the holding part in relation to the testing socket.

Abstract: A component transport apparatus includes: a transport hand including a plurality of index units each one of which is capable of holding a component; a movable body that moves the transport hand; and a plurality of functional stations on which the components are mounted. The index units function to mount the components on the functional stations. The functional stations are spaced apart at intervals along a movement direction of the transport hand. The index units are spaced apart at intervals equal to the intervals at which the functional stations are spaced apart along the movement direction of the transport hand.

Abstract: A component test apparatus performing a test on an electronic component is disclosed. The component test apparatus includes a component loading device, a transport hand, and a component unloading device. A plurality of functional stations have mutually different functions and are spaced apart at equal intervals along a movement direction of the transport hand. The transport hand has a plurality of index units that are capable of holding the electronic component independently from one another and operating independently from one another. The index units are spaced apart at intervals equal to the intervals at which the functional stations are spaced apart along a transport direction of the electronic component from a loading position toward a test position.

Abstract: A component test apparatus performing a test on an electronic component is disclosed. The component test apparatus includes a component loading device, a transport hand, and a component unloading device. The transport hand includes a plurality of index units each one of which is capable of holding the electronic component and operating independently from the other ones of the index units. The index units are aligned adjacently in a transport direction of the electronic component extending from a loading position at which the component loading device loads the electronic component toward a test position at which a test socket is provided.

Abstract: A component test apparatus performing a test on an electronic component is disclosed. The component test apparatus includes a component loading device, a transport hand, and a component unloading device. A plurality of functional stations have mutually different functions and are spaced apart at equal intervals along a movement direction of the transport hand. The transport hand has a plurality of index units that are capable of holding the electronic component independently from one another and operating independently from one another. The index units are spaced apart at intervals equal to the intervals at which the functional stations are spaced apart along a transport direction of the electronic component from a loading position toward a test position.

Abstract: A component test apparatus performing a test on an electronic component is disclosed. The component test apparatus includes a component loading device, a transport hand, and a component unloading device. The transport hand includes a plurality of index units each one of which is capable of holding the electronic component and operating independently from the other ones of the index units. The index units are aligned adjacently in a transport direction of the electronic component extending from a loading position at which the component loading device loads the electronic component toward a test position at which a test socket is provided.

Abstract: A reflow process is provided for multiple units which improves productivity. A reflow furnace is moved along a transport direction of a tape substrate and is fixed at a position matching the product pitch of a circuit substrate. Any of a plurality of heating blocks and cooling blocks are matched to the product pitches of the circuit substrate. By doing so, it is possible to continuously carry out the reflow process for a tape substrate on which circuit substrates having different product pitches are arranged.

Abstract: A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously.

Abstract: A method of manufacturing a semiconductor device includes mounting a first semiconductor chip on each partitioned region of a frame substrate partitioned for each first semiconductor package; mounting a second semiconductor package, where a second semiconductor chip is mounted, on each partitioned region of the frame substrate so as to be arranged above the first semiconductor chip; and cutting the frame substrate, where the second semiconductor package is mounted, for each partitioned region of the frame substrate.

Abstract: A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK1 and PK2 are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK1 and PK2. The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.

Abstract: A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK1 and PK2 are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK1 and PK2. The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.

Abstract: A method for manufacturing a semiconductor device includes, (a) mounting a plurality of first semiconductor chips in a manner not to overlap with one another on a substrate having a plurality of wiring patterns formed thereon, and electrically connecting each of the first semiconductor chips to any one of the wiring patterns, (b) conducting an electrical examination on a plurality of mounted bodies each including one of the first semiconductor chips and any one of the wiring patterns electrically connected to each other, (c) stacking a second semiconductor chip on the first semiconductor chip of any one of the mounted bodies that pass the electrical examination, excluding any of the mounted bodies that fail the electrical examination and thereafter, (d) cutting the substrate so as to divide the wiring patterns.

Abstract: A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK1 and PK2 are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK1 and PK2. The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.

Abstract: A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously.

Abstract: A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously.

Abstract: A reflow process is provided for multiple units which improves productivity. A reflow furnace is moved along a transport direction of a tape substrate and is fixed at a position matching the product pitch of a circuit substrate. Any of a plurality of heating blocks and cooling blocks are matched to the product pitches of the circuit substrate. By doing so, it is possible to continuously carry out the reflow process for a tape substrate on which circuit substrates having different product pitches are arranged.