Abstract: A reflow process is provided for multiple units which improves productivity. A reflow furnace is moved along a transport direction of a tape substrate and is fixed at a position matching the product pitch of a circuit substrate. Any of a plurality of heating blocks and cooling blocks are matched to the product pitches of the circuit substrate. By doing so, it is possible to continuously carry out the reflow process for a tape substrate on which circuit substrates having different product pitches are arranged.

Abstract: A method for manufacturing a semiconductor device includes, (a) mounting a plurality of first semiconductor chips in a manner not to overlap with one another on a substrate having a plurality of wiring patterns formed thereon, and electrically connecting each of the first semiconductor chips to any one of the wiring patterns, (b) conducting an electrical examination on a plurality of mounted bodies each including one of the first semiconductor chips and any one of the wiring patterns electrically connected to each other, (c) stacking a second semiconductor chip on the first semiconductor chip of any one of the mounted bodies that pass the electrical examination, excluding any of the mounted bodies that fail the electrical examination and thereafter, (d) cutting the substrate so as to divide the wiring patterns.

Abstract: A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK1 and PK2 are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK1 and PK2. The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.

Abstract: A first semiconductor ship is mounted on a first surface of an interposer in such a manner that a first electrode overlaps with a penetrating-hole, and a second semiconductor chip is stacked on the first semiconductor chip. A first wire is disposed on a second surface side and bonded to the first electrode and a second wiring pattern. A second wire is disposed on the first surface side and bonded to a second electrode and a first wiring pattern. A sealing section includes a first portion on the first surface, a second portion on the second surface, and a third portion linking the first and second portions through the penetrating-hole.

Abstract: A method of manufacturing a semiconductor device includes providing resin on at least a partial area on a first semiconductor package and coupling a second semiconductor package to the first semiconductor package electrically while the resin maintains its fluidity.

Abstract: To shorten the time required to clean a printing mask used in printing solder paste pattern, an unused surface of a cotton cleaning sheet is brought into contact with a transfer surface of a printing mask while a feed roller, suction roller, take-up roller, solvent dispenser and air blower are moved horizontally in an integral fashion in a direction perpendicular to the direction in which a tape substrate is conveyed, thereby cleaning the printing mask along the shorter, widthwise direction of the tape substrate.

Abstract: A method is provided to suppress detachment between semiconductor packages while preventing dislocation at the time of mounting a stacked semiconductor package on a motherboard. Semiconductor packages PK1 and PK2 are bonded to each other through protruding electrodes and resin is provided between the semiconductor packages PK1 and PK2. The resin is provided in the peripheries of the protruding electrodes so as to contact each of the protruding electrodes while not contacting a semiconductor chip.

Abstract: A reflow process is provided for multiple units which improves productivity. A reflow furnace is moved along a transport direction of a tape substrate and is fixed at a position matching the product pitch of a circuit substrate. Any of a plurality of heating blocks and cooling blocks are matched to the product pitches of the circuit substrate. By doing so, it is possible to continuously carry out the reflow process for a tape substrate on which circuit substrates having different product pitches are arranged.

Abstract: Quality control of product manufacturing is performed with a simple structure and, in addition, damage of a product when a production line is stopped is avoided. A preheating block approaches a circuit substrate having a predetermined length along a tape substrate from a predetermined position by gradual upward movements to carry out preheating and is then returned to the predetermined position, a main heating block arranged close to the preheating block is made to contact the circuit substrate on which the preheating has been carried out and which is transported in a predetermined tact to apply peak heating and is then restored to the predetermined position, and a cooling block accesses the circuit substrate to which the peak heating has been applied to cool the circuit substrate and is then returned to the predetermined position.

Abstract: A mounting zone and a reflow zone are arranged in parallel between a loader and an unloader, and mounting and reflow processes are performed simultaneously.

Abstract: A conductive-member adsorbing device has an adsorber having adsorption portions for adsorbing conductive members and a force supply unit. The force supply unit is operative to apply a force which can maintain one conductive member adsorbed by one adsorption portion, but can release two conductive members adsorbed by one adsorption portion.

Abstract: A method of applying an adhesive material comprising the steps of: providing the adhesive material on an interconnect substrate; and pressure-bonding the adhesive material to the interconnect substrate. A base has a plurality of first regions to be punched out and second regions located between the first regions. An interconnect pattern is formed at least in the first regions. Part of the adhesive material located within the first regions is pressurized to flow toward the second regions to move air bubbles to the second regions.

Abstract: A conductive-member adsorbing device has an adsorber having adsorption portions for adsorbing conductive members and a force supply unit. The force supply unit is operative to apply a force which can maintain one conductive member adsorbed by one adsorption portion, but can release two conductive members adsorbed by one adsorption portion.

Abstract: A conductive-member adsorbing device has an adsorber having adsorption portions for adsorbing conductive members and a force supply unit. The force supply unit is operative to apply a force which can maintain one conductive member adsorbed by one adsorption portion, but can release two conductive members adsorbed by one adsorption portion.

Abstract: A method of applying an adhesive material comprising the steps of: providing the adhesive material on an interconnect substrate; and pressure-bonding the adhesive material to the interconnect substrate. A base has a plurality of first regions to be punched out and second regions located between the first regions. An interconnect pattern is formed at least in the first regions. Part of the adhesive material located within the first regions is pressurized to flow toward the second regions to move air bubbles to the second regions.

Abstract: A method of applying an adhesive material comprising the steps of: providing the adhesive material on an interconnect substrate; and pressure-bonding the adhesive material to the interconnect substrate. A base has a plurality of first regions to be punched out and second regions located between the first regions. An interconnect pattern is formed at least in the first regions. Part of the adhesive material located within the first regions is pressurized to flow toward the second regions to move air bubbles to the second regions.