Abstract: Provided are a resin composition for element encapsulation for organic electronic devices and other things, which have excellent long-term reliability and excellent visibility by capturing not only the moisture on the front surface or lateral surfaces of the resin composition for element encapsulation for organic electronic devices, but also the moisture permeating through the interior of the resin composition for element encapsulation for organic electronic devices. The resin composition includes a polyisobutylene resin (A) containing a polyisobutylene skeleton in a main chain or in a side chain and having a weight average molecular weight (Mw) of 300,000 or more; and a tackifying agent (B) as main components, includes an organometallic compound (C) having hygroscopic properties, and has a water content of 1000 ppm or less.

Abstract: Provided are an element sealing resin composition for organic electronic devices, which promotes a balance between the water vapor barrier properties and adhesiveness, decreases the water content, and sufficiently suppresses the generation of outgases, so that consequently the service life of an element for organic electronic devices can be lengthened, and which gives a satisfactory external appearance when used to seal an organic electronic device; an element sealing resin sheet for organic electronic devices; an organic electroluminescent element; and an image display apparatus. Disclosed is an element sealing resin composition for organic electronic devices, comprising a polyisobutylene resin (A) having a weight average molecular weight (Mw) of 10,000 to 300,000 and a hydrogenated cyclic olefin-based polymer (B), and having a water content according to the Karl-Fischer method of 500 ppm or less and an amount of outgas generation of 500 ppm or less when heated at 85° C. for 1 hour.

Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

Abstract: A sealant composition being adhesive for used in electronic devices, the sealant composition including an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/?-olefin copolymer and an ethylene/?-olefin/non-conjugated diene copolymer, and the content of the tackifier is 10% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.

Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value except the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.

Abstract: The adhesive sheet wound into a roll includes: a long release film; an adhesive layer provided in a label form on the release film; and a pressure-sensitive adhesive film having a label part covering the adhesive layer and provided so as to be in contact with the release film around the adhesive layer and a peripheral part surrounding an outside of the label part, wherein a through hole penetrating the pressure-sensitive adhesive film is provided outside a portion corresponding to a part of the adhesive layer intended to be attached to an adherend and inside the label part, and wherein outer circumference of the adhesive layer×1/43?maximum width of the through hole×number of the through holes per label part of the pressure-sensitive adhesive film?outer circumference of the adhesive layer is satisfied.

Abstract: An adhesive sheet 10 wound into a roll includes: a long release film 11; an adhesive layer 12 provided in a label form on the release film 11; and a pressure-sensitive adhesive film 13 having a label part 13a covering the adhesive layer 12 and provided so as to be in contact with the release film 11 around the adhesive layer 12 and a peripheral part 13b surrounding an outside of the label part 13a, wherein a through hole 14 penetrating the release film 11 is provided in a place including a portion corresponding to an outside of a part 15 of the adhesive layer 12 intended to be attached to an adherend and an inside of the label part 13a.

Abstract: The adhesive sheet 10 wound into a roll includes: a long release film 11; an adhesive layer 12 provided in a label form on the release film 11; and a pressure-sensitive adhesive film 13 having a label part 13a covering the adhesive layer 12 and provided so as to be in contact with the release film 11 around the adhesive layer 12 and a peripheral part 13b surrounding an outside of the label part 13a, wherein a through hole 14 penetrating the pressure-sensitive adhesive film 12 is provided in a place that is outside a portion corresponding to a part c of the adhesive layer 12 intended to be attached to an adherend and inside the label part 13a and that includes a part R of the pressure-sensitive adhesive film 13 intended to be attached to an adherend.

Abstract: A roll has a structure in which a film is wound around a hollow core. The film is a dicing die bonding film having a surface where depressions and protrusions are formed. The roll is placed in a storage bag. Side plates are provided to both end portions of the roll being placed in the storage bag. Protruded portions of the side plates are attached by being inserted into both end portions of a follow portion of the core. With a pair of the side plates being attached to top and bottom ends of the roll, the side plates and the roll are secured with two to four bands. The bands are provided all around the outer portions of the side plates and the roll (storage bag) such that at least two bands cross, whereby the side plates and the roll are secured.