DICING DIE BONDING FILM PACKING STRUCTURE AND PACKING METHOD

Abstract

A roll has a structure in which a film is wound around a hollow core. The film is a dicing die bonding film having a surface where depressions and protrusions are formed. The roll is placed in a storage bag. Side plates are provided to both end portions of the roll being placed in the storage bag. Protruded portions of the side plates are attached by being inserted into both end portions of a follow portion of the core. With a pair of the side plates being attached to top and bottom ends of the roll, the side plates and the roll are secured with two to four bands. The bands are provided all around the outer portions of the side plates and the roll (storage bag) such that at least two bands cross, whereby the side plates and the roll are secured.

Description

TECHNICAL FIELD OF THE INVENTION

The present invention relates to structures and methods for packing dicing die bonding films for use in manufacturing semiconductor devices.

BACKGROUND ART

Conventionally, dicing die bonding films have been developed that possess two functions: a function as a dicing tape for securing a semiconductor wafer during cutting and separation of the semiconductor wafer into individual chips; and a function as a die bonding film for bonding the semiconductor chips thus cut to a lead frame, a package substrate or the like. Generally, pre-cut processing is conducted on such dicing die bonding films.

FIG. 8 illustrates a film 100 as an example of a dicing die bonding film; FIG. 8(a) is a front view, and FIG. 8(b) is a cross sectional view along the line D-D indicated in FIG. 8(a). The film 100 includes a release film 103, an adhesive layer 105, a pressure-sensitive adhesive film 107 including a circular label portion 107a and a peripheral portion 107b, and other components.

The adhesive layer 105 has been processed into a circular shape corresponding to the shape of a wafer and is placed on the release film 103. The pressure-sensitive adhesive film 107 is prepared by removing a portion around a circular portion that corresponds to the shape of a ring frame for dicing. The circular label portion 107a of the pressure-sensitive adhesive film 107 covers the adhesive layer 105, and its outer periphery portion is in contact with the release film 103.

As illustrated in FIG. 8(b), a portion where the circular label portion 107a is stacked on the adhesive layer 105 is thicker than the peripheral portion 107b of the pressure-sensitive adhesive film 107. Hence, when the film 100 is rolled to be a final product, differences in level between the portions where the circular label portion 107a is stacked on the adhesive layer 105 and the peripheral portion 107b overlap and may be transferred onto a surface of the adhesive layer 105, which is flexible. If such a transfer mark is generated, the adhesive layer 105 and the semiconductor wafer may be bonded inadequately to cause a problem during wafer processing.

Meanwhile, generation of such a transfer mark can be prevented by a method in which a tape winding force is reduced. This method, however, may cause weaving of a final product due to shaking and the like during transportation.

In response to this problem, a method for preventing such a label mark by contriving a pre-cut shape has been suggested (for example, Patent Document 1).

PRIOR ART DOCUMENT

Patent Document

• Patent Document 1: Japanese Patent Publication No. 2007-002173 A

SUMMARY OF THE INVENTION

Technical Problem

However, in the method of Patent Document 1 in which the pre-cut shape is contrived, it is difficult to adjust the shape and, furthermore, it is not possible to prevent generation of label marks when the film winding tension increases. Hence, adjustment of the winding tension becomes necessary. Further, the conventional packing methods may cause damage on a final product as a result of application of force to a part of the final product or a fall of the final product due to slippage through fingers when a coil is held and carried.

In view of the above problems, the present invention is aimed at providing structures and methods for packing dicing die bonding films that reliably prevent weaving and are also excellent in handling property.

Technical Solution

In order to achieve the above aim, a first aspect of the invention is directed to a structure for packing a dicing die bonding film, comprising: a roll including a hollow core and a long dicing die bonding film which is wound around the core and pre-cut into a predetermined shape, side plates each having a protruded portion corresponding to a hollow portion of the core, and two to four bands for securing the roll and the side plates, wherein: the protruded portions are attached to be inserted into both ends of the core, at least two of the bands cross each other at a portion of the side plates, and an amount of change in a distance between a pair of the side plates disposed vertically at a time when the side plate on an upper side is lifted upward is equal to or lower than 1% of a distance between the side plates before the side plate on the upper side is lifted.

Two or more sets of the side plates and the roll which are secured by the bands may be aligned and packed in the packing box.

A depressed portion may be formed in a surface of the side plates that is opposite to a surface having the protruded portion, and the at least two of the bands may cross at the depressed portion. The at least two of the bands may be secured to each other at the portion where the at least two of the bands cross each other.

In the first aspect of the invention, the roll is sandwiched by the pair of side plates so that weaving of the film can be avoided during transportation or the like. Further, since the side plates and the roll are secured such that at least two bands cross, deviation of the side plates can be avoided. Furthermore, the amount of change in the distance between the side plates during handling is set to equal to or lower than 1%, whereby weaving of the film can reliably be prevented during handling.

Further, two or more rolls are aligned and placed in the packing box to obtain excellent stacking property of the packing box. Further, the depressed portion is formed in the outer surface of the side plate, and the bands are arranged to cross at the depressed portion so that the bands can be held with ease; handling property in removal of the roll from the packing box and the like is excellent. Furthermore, the portion where the bands cross each other is secured so that deviation of the bands can be prevented.

A second aspect of the invention is a method for packing a dicing die bonding film, comprising: winding a long dicing die bonding film having been pre-cut into a predetermined shape around a hollow core to form a roll; attaching to the roll a pair of side plates each having a protruded portion corresponding to a hollow portion of the core such that the protruded portions are inserted into both ends of the core; and securing the roll and the side plates with two to four bands such that the two to four bands cross at the side plates and an amount of change in a distance between a pair of the side plates disposed vertically at a time when the side plate on an upper side is lifted upward is equal to or lower than 1% of a distance between the side plates before the side plate on the upper side is lifted.

After the bands are provided, at least two of the bands may be secured to each other at a portion where the at least two of the bands cross each other.

The second aspect of the invention reliably prevents weaving of films, is excellent in handling property and prevents generation of transfer marks.

Advantageous Effect of the Invention

The present invention can provide structures and methods for packing dicing die bonding films that reliably prevent weaving and are excellent in handling property.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 An exploded perspective view showing a packing structure 1.

FIG. 2 A perspective view showing the packing structure 1.

FIG. 3 A figure showing a side plate 3; (a) is a plan view, and (b) is a cross sectional view along the line A-A indicated in (a).

FIG. 4 A schematic view showing a method of compressive strength test of the side plate 3.

FIG. 5 An exploded perspective view showing the packing structure 1.

FIG. 6 A figure showing a state in which the packing structure 1 is being lifted.

FIG. 7 A figure showing a roll 5 being packed.

FIG. 8 A figure showing a film 100; (a) shows a front view, and (b) shows a cross sectional view along the line D-D indicated in (a).

EMBODIMENTS

Embodiments of the present invention will be described below, with reference to the drawings. FIG. 1 is an exploded perspective view illustrating a packing structure 1, and FIG. 2 is a perspective view illustrating the packing structure 1. The packing structure 1 mainly includes a roll 5, a side plate 3, a storage bag 11, a band 15, a packing box 13 and the like.

The roll 5 has a structure in which a film 9 is wound around a hollow core 7. The film 9 is substantially the same as the film 100 illustrated in FIG. 8 and is a dicing die bonding film having a surface where depressions and protrusions are formed.

The winding tension of the film 9 with respect to the core 7 is preferably about, for example, 10 N to 20 N. When the winding tension of the film 9 exceeds 20 N, a transfer mark due to shapes of the depressions and protrusions is generated. On the other hand, when the winding tension of the film 9 is lower than 10 N, weaving and the like may occur in the film 9. Generally, the winding tension of the film is set to about 15 N in view of weaving; since the present invention adopts a packing structure that was conventionally not available, weaving would not occur even when the film is wound at a lower tension of about 8 N. Details will be described below.

The roll 5 is placed in the storage bag 11. In a case of using a light (ultraviolet) curable composition or the like in the tackifier agent or the adhesive agent constituting the film 9, a storage bag that does not transmit such light and the like can be used as the storage bag 11.

The side plates 3 are provided to both end portions of the storage bag 11 containing the roll 5 and having been degassed and heat sealed. FIG. 3 is a figure showing the side plates 3; FIG. 3(a) is a plan view, and FIG. 3(b) is a cross sectional view along the line A-A indicated in FIG. 3(a).

The side plate 3 is a component that is substantially rectangular and has ribs formed radially from the center. A depressed portion 17 is formed at a substantially central part of an upper surface of the side plate 3. Further, a protruded portion 19 is provided at a substantially central part of a lower surface of the side plate 3. The protruded portion 19 is a substantially cylindrical portion protruding downward from the side plate. A rib is formed along an outer edge portion of the side plate 3 in the same direction as the direction in which the protruded portion 19 is formed. Portions between the ribs may be in the shape of a continuous plate, or through holes may be formed between the ribs as illustrated in FIG. 3. Further, each corner of the substantially rectangular shape of the side plate 3 may have an angle or may be curved as illustrated in FIG. 3(a). In order to reduce a vertically applied force to avoid cracking, it is preferable that holes should be formed and/or each corner of the substantially rectangular shape of the side plate 3 should be curved. The shape of the side plate 3 is not limited to the example illustrated in the figure, and the outer shape of the side plate 3, the shapes and sizes of the depressed portion 17 and the protruded portion 19, the rib shape and the like may be determined as appropriate. Further, the side plate 3 may be prepared by integral molding using a mold or by separately preparing parts such as a substantially rectangular plate and a protruded portion 19 and then combining the parts together. A final product prepared by preparing parts separately is easy to handle because it can be divided and then stored.

Further, the film 9 is used to manufacture a semiconductor apparatus; hence, the film 9 is generally handled in a clean room. Thus, the core 7, the side plate 3, the storage bag 11, the band 15 and other components that constitute the packing structure 1 are made of resin that can be handled in a clean room. In other words, materials such as paper, cardboard and fiber are inappropriate. As to the resin, use of a biodegradable resin is especially preferred from the point of view of reduction of environmental burden.

Preferably, the amount of deformation of the side plate 3 due to a compression force of 1500 N applied laterally is equal to or lower than 2%. FIG. 4 is a schematic view showing a method of compressive strength test of the side plate 3. As illustrated in FIG. 4, a jig 21 was disposed at each side (in a direction perpendicular to the direction in which the depressed portion 17 and the protruded portion 19 are formed) of the side plate 3, and a compression force of 1500 N was applied to the jig 21 (in a direction of arrow C indicated in the figure); the amount of compressive deformation at that time was measured. When the amount of deformation with respect to the initial width exceeds 2%, the side plate 3 may be deformed during transportation or when being secured with a band, which will be described below, to cause weaving and the like in the film 9.

As illustrated in FIGS. 1 and 2, the protruded portions 19 of the side plates 3 are attached by being inserted into both end portions of a hollow portion of the core 7. With the side plates 3 being attached to the roll 5, the roll 5 (film 9) is sandwiched by the side plates 3. Accordingly, both side portions of the film 9 in a rolled state are secured by the side plates 3.

To prevent side end portions of the film from being damaged by the side plates 3 when the side plates 3 are pushed into the core 7, the width of the core 7 is preferably either substantially the same as or slightly smaller than the width of the film 9. Further, in order to securely hold both side end portions of the film 9 with the side plates 3 when the side plates 3 are inserted in the core 7, an elastic buffer component and the like may be disposed as necessary in spaces between the side plates 3 and both end portions of the film 9. Further, the size of the side plate 3 may be set slightly larger than the outer diameter of the roll 5 to accommodate the roll 5 inside the rib provided along the outer edge portion of the side plate 3, whereby an inner surface of the packing box and the roll 5 can be prevented from coming into contact with each other.

As illustrated in FIG. 2, with a pair of the side plates 3 being attached to top and bottom ends of the roll 5, the side plates 3 and the roll 5 are secured with two bands 15. The bands 15 are provided all around the outer portions of the side plates 3 and the roll 5 (storage bag 11) such that at least two bands 15 cross, whereby the side plates 3 and the roll 5 are secured.

In a case of using two bands, the two bands 15 cross at a substantially central part of the side plate 3. In other words, a crossing portion of the two bands 15 is positioned at the depressed portion 17 (FIG. 3). Hence, a portion near the crossing portion of the two bands 15 is not in contact with the side plate 3, and a space is formed between the crossing portion and the side plate 3 (depressed portion 17). This allows a hand (finger) to be inserted into the space formed at the depressed portion 17 to hold and lift the crossing portion of the roll 5 at a time of lifting the roll 5. Thus, the roll 5 can be lifted with ease when being removed from the packing box or when being picked from a plurality of rolls 5 being aligned.

Further, the number of bands may be increased to four as in the packing structure 1a illustrated in FIG. 5. In this case, the four bands are used such that two of the bands are disposed parallel to each other and cross the other two bands disposed parallel to each other. This makes it difficult for the bands to cross at the central portion, making it slightly difficult to lift the roll 5 with ease; however, it is still possible to take out the roll 5 with a good balance by inserting fingers or the like under a cater-cornered crossing portion. Further, in the case of using four bands, the four bands may be provided such that one of the bands crosses the other three bands. In any case, one or more crossing portions are provided so that the roll 5 can be lifted with ease.

The crossing portion of the two bands 15 may be secured to each other. For example, the bands 15 may be secured by fusion, bonding or using other binding components. Further, shallow grooves may be formed in outer edge portions of the side plates 3 so that the bands fit therein to fix the positions of the bands to be placed, whereby the crossing portion is guided to come to the position of the depressed portion 17 (FIG. 3). By doing so, deviation of the position of the crossing portion can be avoided, and handling becomes easier.

Further, the band 15 is preferably made of resin that can be brought in a clean room. Especially, use of a biodegradable resin is preferred because environmental burden can be reduced. Further, as described above, the tensile fracture strength or 5% modulus is preferably equal to or greater than 200 N to avoid breakage of the band 15 when the band 15 is held to lift the roll 5.

FIG. 6(a) is a front view illustrating the packing structure 1 (excluding packing box). The roll 5 is disposed such that the pair of side plates 3 are positioned vertically. In this state, the side plates 3 are both rigidly secured to the roll 5 by the band 15. The distance between the side plates 3 in this state is defined as H1.

Then, as illustrated in FIG. 6(b), the side plate 3 on the upper side is lifted from the above state (in a direction of arrow B indicated in the figure). The distance between the side plates 3 at the time when the roll 5 is lifted completely is defined as H2. In other words, (H2−H1) is the amount of change in distance that is generated due to elongation of the band 15 and an allowance of the side plate 3 associated with the weight of the packing structure.

In the present invention, the amount of change (H2−H1) in the distance between the side plates is preferably set to equal to or lower than 1% of H1 in view of the weight of the packing structure, the strength of the band 15, the allowance of the side plate 3 and the like. In other words, once the weight of the packing structure is set, the strength of the band 15 and the allowance of the side plate 3 are set so as to satisfy the above relationship. Further, since the dicing die bonding film is placed in an environment of 5° C. or below during transportation and storage and at room temperature when being handled, the effect of temperature change is preferably small. Specifically, the ratio of expansion and contraction of the band 15 in the longitudinal direction at 0 to 30° C. is preferably within ±1%.

The roll 5 and the like thus formed are inserted into the packing box 13, as illustrated in FIGS. 1 and 2. The packing box 13 is used for protection during transportation and storage, and the roll 5 and the like in the packing box 13 are removed before being handed in a clean room. Hence, the packing box 13 may be made of cardboard.

Although the figures show an example in which two rolls 5 are packed in the packing box 13, the present invention is not limited to this example. However, in view of stacking property of the packing box during transportation and handling property, it is preferable to place two or four rolls 5 in a single packing box 13. With a single roll 5, the area of the base of the packing box 13 is so small that the packing box 13 becomes unstable, making it difficult to stack multiple boxes. With six or more rolls 5, on the other hand, the packing box 13 becomes large and heavy, making it difficult to handle. Hence, it is preferable to place two or four rolls 5 in the packing box 13.

In the present invention, the roll 5 is sandwiched between the side plates 3, as described above. Thus, occurrence of weaving can be prevented even when the winding tension is lower than usual. Moreover, since the protruded portions 19 of the side plates 3 are inserted in the core 7, deviation of the side plates 3 during transportation and the like can be avoided. Furthermore, since the side plates 3 have adequate strength, positional deviation due to deformation and the like can also be prevented.

Further, since the depressed portion is formed in the side plate 3 and the bands 15 cross at the depressed portion 17, the crossing portion of the bands 15 can be held with ease to lift the roll 5. Furthermore, if the crossing portion is secured to each other or if the positions of the bands to be placed are fixed, deviation of the position of the crossing portion can be avoided.

Further, the amount of change in the distance between the side plates 3 at the time when the side plates 3 are disposed vertically and the side plate 3 on the upper side is lifted is set to equal to or lower than 1% of the original distance between the side plates 3, whereby occurrence of weaving during handling can be prevented.

Particular embodiments of the present invention have been described with reference to the attached drawings, but the technical scope of the present invention is not restricted by the embodiments described above. It should be apparent to those skilled in the art that many more changes and modifications besides those already described are possible without departing from the inventive concepts defined in the appended claims, and it is to be understood that such changes and modifications are automatically encompassed within the scope of the invention.

EXAMPLES

Evaluation was conducted on various types of packing forms. As to films to be evaluated, dicing die bonding films as illustrated in FIG. 8 were prepared and used. Methods of preparing respective constituents will be described below.

<Preparation of Bonding Film>

To 400 g of toluene as a solvent, a mixed solution of 128 g of n-butyl acrylate, 307 g of 2-ethylhexyl acrylate, 67 g of methyl methacrylate, 1.5 g of methacrylic acid and benzoyl peroxide as a polymeric initiator was added by dropping with appropriate adjustment of the amount of dropping, the reaction temperature and the reaction time, whereby a solution of compound (1) having a functional group was obtained.

To this polymeric solution, 2.5 g of 2-hydroxyethyl methacrylate, which had been prepared separately from methacrylic acid and ethylene glycol as a compound (2) having a radiation curable carbon-carbon double bond and a functional group, and hydroquinone as a polymerization inhibitor were added with appropriate adjustment of the amount of dropping, the reaction temperature and the reaction time, whereby a solution of a compound (A) having a radiation curable carbon-carbon double bond was obtained. Thereafter, 1 part by mass of CORONATE L manufactured by Nippon Polyurethane Industry as a polyisocyanate (B) with respect to 100 parts by mass of the compound (A) contained in the solution of compound (A), 0.5 parts by mass of IRGACURE 184 manufactured by Nihon Ciba-Geigy as a photoinitiator and 150 parts by mass of ethyl acetate as a solvent were added to the solution of the compound (A) and mixed together, whereby a radiation curable tackifier agent composition was prepared.

Then, the tackifier agent composition thus prepared was applied to an ethylene-vinyl acetate copolymer base film having a thickness of 100 μm so as to obtain a dried coating with a thickness of 20 μm, followed by drying at 110° C. for 3 minutes to prepare a pressure-sensitive adhesive film 1A.

<Release Film>

A release-layer-treated polyethylene terephthalate film with a thickness of 25 μm was used as a release film 2A.

<Preparation of Adhesive Film>

To a composition of 50 parts by mass of cresol novolac epoxy resin (epoxy equivalent: 197, molecular weight: 1200, softening point: 70° C.) as an epoxy resin, 1.5 parts by mass of γ-mercaptopropyltrimethoxysilane as a silane coupling agent, 3 parts by mass of γ-ureidopropyltriethoxysilane and 30 parts by mass of silica filler having an average particle size of 16 nm, cyclohexanon was added and mixed by stirring, and then the mixture was kneaded with a bead mill for 90 minutes.

To the resulting product, 100 parts by mass of acrylic resin (mass average molecular weight: 800000, glass transition temperature: −17° C.), 5 parts by mass of dipentaerythritol hexaacrylate as an acrylate monomer with a functionality of 6, 0.5 parts by mass of an adduct of hexamethylene diisocyanate as a curing agent and 2.5 parts by mass of CUREZOL 2PZ (trade name, manufactured by Shikoku Chemicals Corporation, 2-phenylimidazole) were added and mixed by stirring, followed by vacuum degassing to obtain an adhesive agent. The adhesive agent was applied onto the release film 2A and dried by heating at 110° C. for 1 minute to form a coating in the state of stage B (intermediate curing state of heat curable resin) with a thickness of 20 μm, whereby an adhesive layer 3A was formed on the release film 2A, followed by refrigeration storage.

<Pre-Cut Processing>

The refrigeration-stored release film 2A on which the adhesive layer 3A was formed was returned to ambient temperature, and the adhesive layer was subjected to pre-cut processing into a circle with a diameter of 220 mm while the depth of a cut into the release film was adjusted to 10 μm or smaller. Thereafter, unnecessary portions of the adhesive layer were removed, and the pressure-sensitive adhesive film 1A was laminated with the release film 2A at room temperature such that the tackifier agent layer of the pressure-sensitive adhesive film 1A came into contact with the adhesive layer. Then, the pressure-sensitive adhesive film 1A was subjected to pre-cut processing concentrically with the adhesive layer into a circle having a diameter of 290 mm and being concentric with the adhesive layer while the depth of a cut into the release film was adjusted to 10 μm or smaller, whereby a tape 4A for wafer processing was prepared.

The films thus prepared were packed by respective methods.

Example 1

Three hundred sheets of the tape 4A for wafer processing that had been subjected to pre-cut processing were wound at 10 N such that a portion of about 1.2 m without a label was provided at the beginning and end of the winding. This roll was placed in a polyethylene bag, followed by degassing and then heat sealing. Thereafter, side plates that were made of polypropylene and had the shape illustrated in FIG. 3 were attached to both end portions of the roll. Further, two PP bands were placed to cross and then fusion bonded. The amount of change in the distance between the side plates (H2−H1 indicated in FIG. 6) was set to 0.3% of the distance (H1) between the side plates. Two same rolls were prepared and placed in a packing box 13, which was a cardboard box, as illustrated in FIG. 7(a), whereby a pack of tapes for wafer processing of Example 1 was obtained.

Example 2

The same process as in Example 1 was conducted, except that four rolls were packed in the packing box 13a as illustrated in FIG. 7(b), whereby a pack of tapes for wafer processing of Example 2 was obtained.

Example 3

The same process as in Example 1 was conducted, except that PP bands were placed such that the amount of change in the distance between the side plates was 1%, whereby a pack of tapes for wafer processing of Example 3 was obtained.

Example 4

The same process as in Example 1 was conducted, except that four bands were placed such that two of the bands disposed parallel to each other crossed the other two bands disposed parallel to each other, whereby a pack of tapes for wafer processing of Example 4 was obtained.

Example 5

The same process as in Example 1 was conducted, except that the two PP bands were not fused and that grooves were formed in outer edge portions of four sides of the side plates and the bands were placed, whereby a pack of tapes for wafer processing of Example 5 was obtained.

Comparative Example 1

The same process as in Example 1 was conducted, except that the winding tension was 40 N, whereby a pack of tapes for wafer processing of Comparative Example 1 was obtained.

Comparative Example 2

The same process as in Example 1 was conducted, except that a single roll was packed in the packing box 13b as illustrated in FIG. 7(c), whereby a pack of tapes for wafer processing of Comparative Example 2 was obtained.

Comparative Example 3

The same process as in Example 1 was conducted, except that the side plates were made of cardboard, whereby a pack of tapes for wafer processing of Comparative Example 3 was obtained.

Comparative Example 4

The same process as in Example 1 was conducted, except that the PP bands were placed such that the amount of change in the distance between the side plates was 2%, whereby a pack of tapes for wafer processing of Comparative Example 4 was obtained. The results are shown in Table 1.

	TABLE 1
						Comparative	Comparative	Comparative	Comparative
	Example 1	Example 2	Example 3	Example 4	Example 5	Example 1	Example 2	Example 3	Example 4
Weaving	good	good	good	good	good	good	good	good	poor
Transfer mark	good	good	good	good	good	poor	good	good	good
Stacking property	good	good	good	good	good	good	poor	good	good
Handling property	excellent	excellent	good	good	excellent	excellent	good	poor	poor

The “weaving” and “transfer mark” in the table were evaluated as follows. First, each pack was stored in a refrigerator (5° C.) for 1 month and thereafter placed on a transportation truck for a return trip between Hiratsuka and Kobe (about 1000 km) while being kept in the refrigeration state. Then, each pack was unpacked, and the rolls were returned to ambient temperature. Thereafter, the packing bag was opened, and the rolls were allowed to stand with natural load for 1 minute while only the core was secured, followed by observation to determine whether weaving occurred. Those with weaving of 2 mm or smaller were determined as “good.” Those with weaving of 2 mm or larger were determined as “poor.”

Next, the rolls were unwound and visually observed to evaluate whether there was any transfer mark. Those in which neither a transfer mark nor a void was found during visual observation from various angles were determined as “excellent.” Those in which a slight transfer mark or void was found from a certain angle were determined as “good.” Those in which a transfer mark or void was found on the film from every angle during visual observation were determined as “poor.”

Further, each pack was stacked to form a stack of three packs, and then the stack was stored in a refrigerator (5° C.) for 1 month and thereafter placed on a transportation cart, followed by observation to determine whether the stack collapsed at a rate of acceleration of 0.01 to 0.25 m/sec². Those without any collapse of the stack were determined as “good.” Those with a collapse of the stack were determined as “poor.”

Further, each pack was unpacked, and handling property during removal of the rolls was evaluated. Those that were significantly easy to handle and excellent in handling property and productivity were determined as “excellent.” Those that were easy to handle and had good handling property and productivity were determined as “good.” Those that were difficult to handle and inferior in handling property and productivity were determined as “poor.”

In Examples 1 to 3 and Comparative Examples 1 to 3 in which the side plates were used, no weaving occurred. On the contrary, weaving occurred in Comparative Example 4 in which the amount of change in the distance between the side plates was large. This indicates that weaving can be prevented by reducing the amount of change in the distance between the side plates.

As to transfer marks, it was not possible to completely prevent transfer marks in any of the Examples and the Comparative Examples. Comparative Example 1 in which the winding tension was high, 40 N, was determined as “poor.” This indicates that generation of transfer marks differs depending on the winding tension.

As to stacking property, a collapse of the stack occurred in Comparative Example 2 in which a single roll was packed in the packing box. This indicates that high stability in stacking is obtained when two or more rolls are packed in the packing box.

As to handling property, removal of the final product was easy in Examples 1, 2 and 5 and Comparative Example 1 in which the packs were rigidly secured with the bands. In Example 3, since the bands were slightly loose, removal property of the final product was slightly inferior. In Example 4, handling property was inferior because it was difficult to find a handle due to lack of a depression in the portion where the bands crossed. In Comparative Example 2, although removal of the final product was easy, since a single roll was packed in a single packing box, it was necessary to unpack one by one; hence, productivity was slightly inferior. In Comparative Example 3, since the side plates used were made of cardboard, the final product could not be brought directly into a clean room, and the side plates had to be removed outside the clean room in order to handle the final product; hence, handling property was inferior. In Comparative Example 4, since the band strength was low, it was difficult to hold; hence, handling property was inferior.

EXPLANATION OF REFERENCE NUMERALS

• 1 . . . Packing structure
• 3 . . . Side plate
• 5 . . . Roll
• 7 . . . Core
• 9 . . . Film
• 11 . . . Storage bag
• 13, 13a, 13b . . . Packing box
• 15 . . . Band
• 17 . . . Depressed portion
• 19 . . . Protruded portion
• 21 . . . Jig
• 100 . . . Film
• 101 . . . Core
• 103 . . . Release film
• 105 . . . Adhesive layer
• 107 . . . Pressure-sensitive adhesive film
• 107a . . . Circular label portion
• 107b . . . Peripheral portion

Claims

1. A dicing die bonding film packing structure, comprising:

a roll including a hollow core and a long dicing die bonding film which is wound around the core and pre-cut into a predetermined shape,

side plates each having a protruded portion corresponding to a hollow portion of the core, and

two to four bands for securing the roll and the side plates, wherein:

the protruded portions are attached to be inserted into both ends of the core,

at least two of the bands cross each other at a portion of the side plates, and

an amount of change in a distance between a pair of the side plates disposed vertically at a time when the side plate on an upper side is lifted upward is equal to or lower than 1% of a distance between the side plates before the side plate on the upper side is lifted.

2. The dicing die bonding film packing structure of claim 1, wherein two or more sets of the side plates and the roll which are secured by the bands are aligned and packed in the packing box.

3. The dicing die bonding film packing structure of claim 1, wherein a depressed portion is formed in a surface of the side plates that is opposite to a surface having the protruded portion, and the at least two of the bands cross at the depressed portion.

4. The dicing die bonding film packing structure of claim 1, wherein the at least two of the bands are secured to each other at the portion where the at least two of the bands cross each other.

5. A dicing die bonding film packing method, comprising:

winding a long dicing die bonding film having been pre-cut into a predetermined shape around a hollow core to form a roll;

attaching to the roll a pair of side plates each having a protruded portion corresponding to a hollow portion of the core such that the protruded portions are inserted into both ends of the core; and

securing the roll and the side plates with two to four bands such that the two to four bands cross at the side plates and an amount of change in a distance between a pair of the side plates disposed vertically at a time when the side plate on an upper side is lifted upward is equal to or lower than 1% of a distance between the side plates before the side plate on the upper side is lifted.

6. The dicing die bonding film packing method of claim 5, wherein after the bands are provided, at least two of the bands are secured to each other at a portion where the at least two of the bands cross each other.