Abstract: A power conversion device has semiconductor modules, a cooling unit, a capacitor module, a discharge resistance substrate, a control circuit substrate and a casing. The semiconductor modules from a power conversion circuit. The capacitor module is electrically connected to the semiconductor module. The discharge resistance is arranged on the discharge resistance substrate, and electrically discharges the capacitor module. The control circuit substrate controls operation of the semiconductor modules. The casing accommodates the semiconductor module, the cooling unit, the capacitor module, the discharge resistance substrate and the control circuit substrate.

Abstract: A power conversion device has semiconductor modules, a cooling unit, a capacitor module, a discharge resistance substrate, a control circuit substrate and a casing. The semiconductor modules from a power conversion circuit. The capacitor module is electrically connected to the semiconductor module. The discharge resistance is arranged on the discharge resistance substrate, and electrically discharges the capacitor module. The control circuit substrate controls operation of the semiconductor modules. The casing accommodates the semiconductor module, the cooling unit, the capacitor module, the discharge resistance substrate and the control circuit substrate.

Abstract: An automatic analyzer has a washing tank providing water for washing a reagent or sample probe is. The washing water from a washing nozzle spreads from a throttle portion and is divided into right and left flows after colliding with a vent plate provided in an overflow portion of the washing tank. The washing water flows between the vent plate and the inner wall of the overflow portion, and the flows join behind the vent plate. After joining, the washing water flows downward along the vent plate and the inner wall of the overflow portion and then is drained. Because a space is created between the washing water which has collided with the vent plate and the washing water joined behind the vent plate, the washing water is prevented from completely covering the overflow portion, and the airflow can be secured during the drainage.

Abstract: A needle for forming a cut in a reagent bottle lid is shaped such that an expansion portion which pushes and opens a cut and a piercing portion which forms the cut are integrated with each other. Consequently, only a single operation for moving the needle downwardly will form a cut using the needle and expand the cut using the expansion portion. Further, the smaller diameter of the expansion portion than the diameter of a circumscribed circle of a cross section of the piercing portion but equal to or greater than the diameter of the reagent probe can form cuts uniformly.

Abstract: An automatic analyzer has a washing tank providing water for washing a reagent or sample probe is. The washing water from a washing nozzle spreads from a throttle portion and is divided into right and left flows after colliding with a vent plate provided in an overflow portion of the washing tank. The washing water flows between the vent plate and the inner wall of the overflow portion, and the flows join behind the vent plate. After joining, the washing water flows downward along the vent plate and the inner wall of the overflow portion and then is drained. Because a space is created between the washing water which has collided with the vent plate and the washing water joined behind the vent plate, the washing water is prevented from completely covering the overflow portion, and the airflow can be secured during the drainage.

Abstract: A marker for detecting pancreatic cancer, said marker comprising a glycoprotein C4BPA or PIGR, whereby a pancreatic cancer patient can be distinguished from a chronic pancreatitis patient or a normal subject and thus specifically diagnosed. Also, the marker is usable in monitoring the postoperative prognosis of a pancreatic cancer patient. When the aforesaid marker is used in combination with another pancreatic cancer marker such as CA19-9, furthermore, a pancreatic cancer patient can be distinguished from a chronic pancreatitis patient or a normal subject and diagnosed more specifically.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

Abstract: A method of manufacturing a semiconductor device has a first exposure to the photoresist by using a first mask having a first portion of a monitor pattern, a second exposure to the photoresist by using a second mask having a second portion of the monitor pattern so that a first image of the first portion and a second image of the second portion are connected.

Abstract: A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

Abstract: A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

Abstract: A bimorph switch electrically connecting a traveling contact and a fixed contact. The switch comprises a substrate having a front face, a rear face, and a through hole penetrating from the front face to the rear face; a fixed contact extending from an edge portion of the aperture of the through hole towards the inside of the aperture; and a bimorph section holding the traveling contact at a position facing the aperture and driving the traveling contact. One end of the bimorph section may be formed on a silicon oxide layer formed on a front face of the substrate.

Abstract: The micro-switch couples electrically a first terminal to a second terminal. The micro-switch includes: a first supporting member where the first terminal is provided; a moving unit where the second terminal corresponding to the first terminal is provided; a driving unit for bringing the second terminal into contact with the first terminal by driving the moving unit in a direction of the first terminal by supplying power; an electrode provided in the first supporting member, and for supplying power to the driving unit; an elastic terminal including the elastic unit having elasticity in a predetermined direction; and a pushing terminal contacting the elastic terminal by pushing the elastic unit, the pushing terminal being electrically coupled to the electrode.

Abstract: There is provided a switch 10 for connecting a first terminal with a second terminal electrically. The switch 10 includes: the first terminal 46; the second terminal 26 and a third terminal 28 confronting said first terminal 46; driving means 70 for driving the first terminal 46 in the direction of the second terminal 26 and the third terminal 28; and an electrostatic coupling section 72 including a first electrode 50 and a second electrode 30 confronting each other for attracting the first terminal 46 in the direction of the second terminal 26 and the third terminal 28 by electrostatic force.

Abstract: There is provided a switch 10 for connecting a first terminal with a second terminal electrically. The switch 10 includes: the first terminal 46; the second terminal 26 and a third terminal 28 confronting said first terminal 46; driving means 70 for driving the first terminal 46 in the direction of the second terminal 26 and the third terminal 28; and an electrostatic coupling section 72 including a first electrode 50 and a second electrode 30 confronting each other for attracting the first terminal 46 in the direction of the second terminal 26 and the third terminal 28 by electrostatic force.

Abstract: The micro-switch couples electrically a first terminal to a second terminal. The micro-switch includes: a first supporting member where the first terminal is provided; a moving unit where the second terminal corresponding to the first terminal is provided; a driving unit for bringing the second terminal into contact with the first terminal by driving the moving unit in a direction of the first terminal by supplying power; an electrode provided in the first supporting member, and for supplying power to the driving unit; an elastic terminal including the elastic unit having elasticity in a predetermined direction; and a pushing terminal contacting the elastic terminal by pushing the elastic unit, the pushing terminal being electrically coupled to the electrode.

Abstract: An integrated type microswitch with high durability is provided. The integrated type microswitch is of the construction through micro-machining process in which a movable plate is provided above a fulcrum means movable in seesaw movement by means of either electrostatic or magnetic force, so that either one of movable contacts mounted on opposite free ends thereof is on-off connected to fixed contact disposed in opposite relation due to seesaw movement of the movable plate.

Abstract: Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thickness integrated circuit (312) are extremely thin, the resulting semiconductor device is strong to bending and highly reliable at a low cost.

Abstract: Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thickness integrated circuit (312) are extremely thin, the resulting semiconductor device is strong to bending and highly reliable at a low cost.