Abstract: A condenser, a coil and a thin-thickness integrated circuit are placed between an upper cover sheet and a lower cover sheet, and adhesive is filled into the space between them, whereby a card is fabricated. Because the condenser, the coil and the thin-thickness integrated circuit are extremely thin, the resulting semiconductor device is highly resistant to bending and highly reliable at a low cost.

Abstract: A hetero junction bipolar transistor provides a contact area an area between an emitter (or collector) electrode and a wiring formed on the electrode that is larger than that of the emitter (or collector). A variation in voltage applied to an emitter (or collector)-base junctions is prevented and a stable operation of the transistor is attained. In addition, when an etching operation is carried out, an insulation film is formed on a side part of a mask. A patterning of the emitter (or collector) is then carried out and thus an emitter (or collector) having a size approximate to that of the mask is formed.

Abstract: A waveguide type light merging and branching device, in which a resistance layer is disposed on a surface of a substrate or at least on one side therein and a low refractive index layer (refractive index n.sub.b), a core waveguide layer (refractive index n.sub.c, n.sub.c >n.sub.b), and a cladding layer (refractive index n.sub.n, n.sub.n >n.sub.c) superposed thereon on each other, the resistance layer having electrode terminals at the two extremities thereof, to which a voltage is applied.

Abstract: This invention is related to the method for production of semiconductor devices suitable for increasing the integration density of semiconductor integrated circuits, especially GaAs semiconductor IC devices.This invention uses no third wiring metal, contact hole or through hole for connection between the Schottky junction and ohmic electrodes formed on the GaAs semiconductor substrate required in the conventional technology, but provides the method for direct connection between the two electrodes stated above by means of vapor deposition, ion implantation, sputtering, CVD, plasma CVD, dry etching and wet etching.Since the application of this invention enables the two electrodes stated above to be directly connected with high yield, the element area at the connecting portion can be reduced to less than half as compared with the same required in the conventional method, the total element area can be reduced greatly.

Abstract: A device for automatically stripping and delivering a fore end of a paper roll, in which the fore end of the paper roll, which is wound on a bobbin, is gripped by both a stripping lever and a pawl member when the paper roll fore end gets on the fore end portion of the stripping lever, the stripping lever being capable of coming into contact with and moving away from the paper roll, the pawl member being mounted on a fore end side of the stripping member so as to be capable of coming into contact with and moving away from the fore end of the stripping member. The fore end of the paper roll after being stripped and drawn out by both the stripping member and the pawl member is sucked and delivered to the next step.

Abstract: An automatic wrapping material change-over apparatus having a plurality of bobbins each with a wrapping material wound thereon and functioning to change-over from one bobbin from which the wrapping material is being drawn out, to another bobbin and cut simultaneously the wrapping material from the one bobbin and that from the another bobbin upon detection of a mark register between both wrapping materials, in which the thus-cut end of the wrapping material from the another bobbin follows the thus-cut end of the wrapping material from the one bobbin.

Abstract: An apparatus for controlling the amount of delivery in a wrapping material feed system, including a rotation drive means for rotating a bobbin with a wrapping material wound thereon; a winding diameter detecting means for detecting a winding diameter of the wrapping material; an adjusting means for changing torque and brake forces of the bobbin to adjust the amount of delivery of the wrapping material, and a control means for controlling the adjusting means. The control means has a memory section which stores optimum torque and brake forces for winding diameters of the wrapping material as well as increment and decrement patterns of torque and brake forces for various operation modes of the wrapping material feed system, and upon receipt of a signal from the winding diameter detecting means the control means provides a signal to the adjusting means in accordance with the contents of the memory section.

Abstract: An information recording method is provided, in which a p- or n-type semiconductor wafer is irradiated with an energetic particle beam such as an electron beam thereby to control, e.g., decreased or increased generation of the surface photovoltage at the irradiated area so that information may be recorded on the wafer.

Abstract: In manufacturing a field effect transistor, a pattern which has a wider upper layer and a narrower lower layer is formed at a gate electrode position. Using the pattern as a mask, first and second impurity regions are formed on both the sides of a gate region by ion implantation. Subsequently, at least the lower layer is buried in a material, such as an organic high polymer material, having a selectivity in etching characteristics with respect to the pattern material. After removing the lower layer, an electrode material is embedded in the resulting hole so as to form a gate electrode.

Abstract: With the invention an electron beam scans reference marks formed on a sample so as to determine the positions of the reference marks. The sample is scanned by the electron beam with respect to the positions of the reference marks thereby to form a desired pattern on the sample. The accelerating voltage for the electron beam is changed to a lower value upon scanning the sample for generation of a pattern than upon scanning the reference marks.

Abstract: Combination stamp comrpises a plurality of independent stamp elements joined together for use in combination. The stamp element includes a stamp frame having a stamp plate at its lower end and a top wall and four side walls. A dovetail-like vertical projection is formed on one of the opposing side walls and a dovetail-like vertical groove in the other side wall. Engagement of the projection in the groove joins adjacent stamp elements together against horizontal displacement. Each of the other opposing side walls has a horizontal groove in its upper portion. The joined stamp elements are so adjusted that the horizontal grooves therein are in alignment with each other, and a cover having inward projections along the opposite side edges thereof is fitted over the stamp elements, with the inward projections engaged in the aligned horizontal grooves, whereby the stamp elements are prevented from vertical displacement.