Abstract: A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

Abstract: In a resin coating used for manufacturing an LED package including an LED element coated with resin containing phosphor, a light-transmitting member test-coated with resin for an emission characteristic measurement on a light-transmitting member placing section including a light source unit, a deviation between a measurement result of an emission characteristic of light emitted from the resin coated on the light-transmitting member measured by an emission characteristic measurement unit by irradiating the resin with excitation light emitted from the light source unit and a prescribed emission characteristic is obtained, and an appropriate resin coating amount of the resin to be coated on the LED element for an actual production is derived based on the deviation.

Abstract: In resin coating used for manufacturing the LED package in which the LED elements is covered with a resin containing a phosphor, a translucent member 43 coated with a resin 8 on trial as light emitting characteristic measurement is mounted on a translucent member mounting unit 41 having a light source unit, and an excitation light emitted from the light source unit is irradiated onto the resin 8 coated on the translucent member 43, and a deviation between a measurement result obtained by measuring the light emitting characteristics of a light emitted by the resin 8 by a light emitting characteristic measurement unit 39 and light emitting characteristics specified in advance is obtained, and an appropriate resin coating amount of the resin to be coated on the LED elements as real production is calculated on the basis of the deviation.

Abstract: A plasma processing apparatus includes a vacuum chamber, a plasma processing execution portion, a discharge state detecting unit, a window portion, a camera, a first storing portion, a second storing portion and an image data extracting unit. When an abnormal discharge is detected, the image data extracting unit extracts at least moving image data showing a generation state of the abnormal discharge from the first storing portion and stores the extracted moving image data in the second storing portion. When plasma processing is ended without the detection of the abnormal discharge, the image data extracting unit extracts, from the first storing portion, moving image data of a predetermined specific period or still image data of a specific period derived from the moving image data of the first storing portion and stores the extracted moving image data or the extracted still image data in the second storing portion.

Abstract: A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

Abstract: There are preliminarily prepared element characteristic information 12 that is obtained by individually, previously measuring emission characteristics of a plurality of LED elements and resin coating information 14 that makes a coating quantity of resin appropriate for obtaining an LED package exhibiting a specified emission characteristic correlated with the element characteristic information. A map preparation processing section 74 prepares, for each substrate, map data 18 that correlate mounting position information 71a showing positions of LED elements mounted on the substrate by a component mounting device M1 with the element characteristic information 12. An emission characteristic inspection device M7 inspects finished products coated with a resin, and inspection results are fed back to the resin coating device M4. Resin coating information M14 is updated according to the inspection results.

Abstract: There are preliminarily prepared element characteristic information 12 that is obtained by individually, previously measuring emission characteristics of a plurality of LED elements and resin coating information 14 that makes a coating quantity of resin appropriate for obtaining an LED package exhibiting a specified emission characteristic correlated with the element characteristic information. A map preparation processing section 74 prepares, for each substrate, map data 18 that correlate populating position information 71a showing a position of an LED element populated on the substrate by a component populating machine M1 with the element characteristic information 12. According to the map data 18 and the resin coating information 14, a resin coating machine M4 coats the respective LED elements populated on the substrate with an appropriate coating quantity of resin.

Abstract: There are prepared element characteristic information 12 obtained by previously, individually measuring light emission characteristics of a plurality of LED elements and resin coating information 14 that correlates an appropriate amount of resin to be applied for acquiring an LED package exhibiting a specified light emission characteristic and the element characteristic information 12. A map preparation processing section 74 prepares, for each board, map data 18 correlating mounting position information 71a showing position of the LED element mounted on the board by a component mounting device M1 and the element characteristic information 12. There is updated the resin coating information 14 on the basis of an inspection result fed back to a resin coating device M4 as a result of a completed product coated with a resin being inspected by a light emission characteristic inspection device M7.

Abstract: There are preliminarily prepared element characteristic information 12 that is obtained by individually, previously measuring emission characteristics of a plurality of LED elements and resin coating information 14 that makes a coating quantity of resin appropriate for obtaining an LED package exhibiting a specified emission characteristic correlated with the element characteristic information. A map preparation processing section 74 prepares, for each substrate, map data 18 that correlate populating position information 71 a showing a position of an LED element populated on the substrate by a component populating machine Ml with the element characteristic information 12. According to the map data 18 and the resin coating information 14, a resin coating machine M4 coats the respective LED elements populated on the substrate with an appropriate coating quantity of resin.

Abstract: According to the plasma treatment on an object accommodated in the processing room, the plasma treatment is carried out as follows. The discharge detecting sensor detects a signal of potential change caused with change in plasma discharge. Receiving the signal, the signal recording section temporarily records the signal as signal data indicating potential change. Referencing the signal data, the signal analysis section extracts index data. The index data shows a condition of plasma discharge, for example, as a count value for discharge-start waves, a count value for abnormal discharge, a count value for feeble arc discharge. The device control section judges a condition of plasma discharge by monitoring the index data and carries out the retry process, the accumulative plasma process, and the maintenance judgment process for performing plasma treatment operations properly.

Abstract: A plasma processing apparatus includes: a vacuum chamber; a plasma processing execution portion; a discharge state detecting unit; a window portion; a camera; a first storing portion; a second storing portion; and an image data extracting unit. The image data extracting unit extracts at least moving image data, which show the generation state of the abnormal discharge, from the first storing portion and stores the extracted moving image data in the second storing portion when the discharge state detecting unit detects the abnormal discharge.

Abstract: A plasma processing apparatus includes: a discharge state detecting unit; a history information storing portion; a date-and-time data creating portion; an object specifying data output portion; a data recording portion; and a production history file creating portion. The data recording portion reads out date-and-time data, object specifying data, machine output data representing an operation state of a plasma processing execution portion, and judgment data representing a judgment result of the discharge state, and stores the data in the history information storing portion in time series, each time the plasma processing for the object to be processed is ended. The production history file creating portion that reads out the date-and-time data, the object specifying data, the machine output data, and the judgment result of the discharge state from the history information storing portion based on a designated period or date and time, and creates a production history file.

Abstract: A plasma processing apparatus includes a vacuum chamber, a plasma processing execution portion, a discharge state detecting unit, a window portion, a camera, a first storing portion, a second storing portion and an image data extracting unit. When an abnormal discharge is detected, the image data extracting unit extracts at least moving image data showing a generation state of the abnormal discharge from the first storing portion and stores the extracted moving image data in the second storing portion. When plasma processing is ended without the detection of the abnormal discharge, the image data extracting unit extracts, from the first storing portion, moving image data of a predetermined specific period or still image data of a specific period derived from the moving image data of the first storing portion and stores the extracted moving image data or the extracted still image data in the second storing portion.

Abstract: An object is to provide a plasma processing device capable of properly monitoring a state of plasma discharge and detecting a precursor to abnormal discharge, and a method of monitoring the state of discharge in the plasma processing device.

Abstract: According to the plasma treatment on an object accommodated in the processing room, the plasma treatment is carried out as follows. The discharge detecting sensor detects a signal of potential change caused with change in plasma discharge. Receiving the signal, the signal recording section temporarily records the signal as signal data indicating potential change. Referencing the signal data, the signal analysis section extracts index data. The index data shows a condition of plasma discharge, for example, as a count value for discharge-start waves, a count value for abnormal discharge, a count value for feeble arc discharge. The device control section judges a condition of plasma discharge by monitoring the index data and carries out the retry process, the accumulative plasma process, and the maintenance judgment process for performing plasma treatment operations properly.

Abstract: An object is to provide a plasma processing device capable of rightly monitoring existence of plasma discharge and also rightly monitoring existence of abnormal discharge. Another object of the present invention is to provide a method of monitoring a state of plasma discharge in the plasma processing device. A discharge detection sensor 23, in which a dielectric member 21 and a probe electrode unit 22 are combined with each other, is attached to an opening portion 2a provided in a lid portion 2 composing a vacuum chamber.

Abstract: An object is to provide a plasma processing device capable of accurately judging whether or not the proper maintenance time has come which is necessary for maintaining an operation state of a device in the best condition. A discharge detection sensor 23, in which a dielectric member 21 and a probe electrode unit 22 are combined with each other, is attached to an opening portion 2a provided in a lid portion 2 composing a vacuum chamber.

Abstract: An object is to provide a plasma processing device capable of highly accurately monitoring an operation state including whether or not the plasma discharge is executed, whether the discharge is normal or abnormal and whether or not the maintenance work of the vacuum chamber is necessary. A discharge detection sensor 23, in which a dielectric member 21 and a probe electrode unit 22 are combined with each other, is attached to an opening portion 2a provided in a lid portion 2 composing a vacuum chamber. A change in electric potential induced according to a change in plasma discharge in a probe electrode is received by a plurality of wave-form detecting portions and a detection signal is outputted each time a change in electric potential agreeing with a predetermined different condition appears. The detection signal outputted from the corresponding wave-form detecting portion is counted by the plurality of wave-form detecting portions and the counted value is held.

Abstract: A heating characteristic value at any measuring point of an object at any measuring location of a heating furnace is determined as a single invariable by using temperature (Tint and Ts) measured at the measuring point of the object and heating temperature (Ta) and heating time (t) at the measuring location of the heating furnace. The heating characteristic value (m-value) may be calculated without using physical characteristics of the object. By using the m-value, a temperature profile of the object heated under a modified heating condition may be simulated in a short period of time without actually heating and measuring the temperature of the object at a high accuracy level. By using such a simulation, an appropriate heating condition for heating an object in accordance with a desired heating condition may easily be determined.

Abstract: It is an object of the invention to provide a component bonding method and a component laminating method that can improve productivity in the heat pressing process. Provided is a component bonding method of bonding a semiconductor component (13) having a thermosetting adhesive layer (13a) formed on a lower surface thereof to a circuit board (5) having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface (5a) of the circuit board (5), the semiconductor component (13) is held by a component holding nozzle (12) having a heater, the adhesive layer (13c) is contacted to the surface-modified resin layer, and the adhesive layer (13c) is heated and thermally cured by the heater.