Abstract: In an optical fiber cable in which an optical fiber ribbon formed by parallelly arranging a plurality of optical fibers is packaged in an internal space, a core portion of each optical fiber is made of pure quartz and an effective cross-sectional area of the core portion at a wavelength of 1,550 nm is 110 ?m2 or more and 150 ?m2 or less. The optical fiber ribbon is an optical fiber ribbon in which the optical fibers are connected by continuously applying an adhesive resin between adjacent optical fibers. An occupation ratio of the optical fiber ribbon to the internal space calculated from a ratio of a cross-sectional area of the internal space to a cross-sectional area of the packaged optical fiber ribbon is 25% or more and 55% or less.

Abstract: An arylamine-fluorene alternating copolymer having a structural unit (A) is represented by Chemical Formula (1): wherein Chemical Formula (1) is the same as described in the detailed description.

Abstract: A thermoplastic fluororesin tube that, during the production of a catheter, can prevent a gap or air bubbles from being formed in the connection part of the catheter, and can be suitably used for the production of a catheter. The thermoplastic fluororesin tube includes a tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether copolymer (FEP), the thermoplastic fluororesin tube having tearability in a longitudinal direction, wherein a thermal expansion coefficient in the longitudinal direction upon heating in a gaseous phase at a temperature of 100° C. for 5 minutes is 0% or more.

Abstract: There is provided a thermoplastic fluororesin tube that, during the production of a catheter, can prevent a gap or air bubbles from being formed in the connection part of the catheter, and can be suitably used for the production of a catheter. A thermoplastic fluororesin tube, the thermoplastic fluororesin tube having tearability in a longitudinal direction, wherein a thermal expansion coefficient in the longitudinal direction upon heating in a gaseous phase at a temperature of 100° C. for 5 minutes is 0% or more.

Abstract: An electrostatic chuck according to an embodiment includes a fixing plate on which a wafer is fixed, an electrostatic plate located under the fixing plate and configured to generate an electrostatic force to fix the wafer on the fixing plate, a plurality of heating elements located under the electrostatic plate and separated to locally control a temperature of the electrostatic plate, and a cooling plate located under the plurality of separated heating elements and configured to emit heat transferred by the plurality of separated heating elements.

Abstract: An optical fiber cable 100 includes at least one optical fiber core 140 and a sheath containing the optical fiber core. The optical fiber core 140 includes optical fibers 130. A total length of the optical fiber core 140 is longer than that of the sheath 160. The optical fiber core 140 is contained in the sheath 160 so that bending occurs in the optical fibers 130.

Abstract: An intermittent tape core wire (140) of an optical fiber cable is assembled into a cable core so that in a k core wire, an l core wire, and an m core wire composed of a multi-core optical fibers continuously adjacent in the width direction of the intermittent tape core wire (140), a difference ? between a core wire twisting direction D2km of the k core wire at a bonding portion (142) connecting the k core wire and the l core wire and a core wire twisting direction D2kl of the k core wire at a bonding portion (142) connecting the k core wire and the m core wire is different from when manufactured.

Abstract: A wafer stage includes an electrostatic chuck (ESC) plate, an upper supporting plate, a lower supporting plate and a temperature controller. The ESC plate includes a first surface that supports a wafer. The upper supporting plate is bonded to a second surface of the ESC plate opposite to the first surface. The lower supporting plate overlaps the upper supporting plate. The temperature controller is disposed between the upper supporting plate and the lower supporting plate. The ESC plate includes ceramics. The upper supporting plate includes a composite material of aluminum or aluminum alloy and ceramics or carbon. The ESC plate and the upper supporting plate are directly bonded to each other by a room temperature solid bonding process. Thus, the wafer stage has sufficient strength to withstand pressure differences between a vacuum and atmospheric pressure, improved temperature response by minimizing heat capacity, and prevents warpage of the ESC plate.

Abstract: A method for producing the fluororesin tube, the method including a step of subjecting a thermoplastic fluororesin to melt extrusion molding at a temperature of about 260 to 450° C., wherein the thermoplastic fluororesin is selected from the group consisting of a tetrafluoroethylene-hexafluoropropylene copolymer and a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, wherein in the melt extrusion molding, a flow path of the molten thermoplastic fluororesin is temporarily branched to form a weld line in a lengthwise direction in the fluororesin tube. In some cases, the fluororesin tube has tearing property in a lengthwise direction and the method includes subjecting the thermoplastic fluororesin, a filler and/or a contrast agent to the melt extrusion molding.

Abstract: An intermittent tape core wire (140) of an optical fiber cable is assembled into a cable core so that in a k core wire, an l core wire, and an m core wire composed of a multi-core optical fibers continuously adjacent in the width direction of the intermittent tape core wire (140), a difference ? between a core wire twisting direction D2km of the k core wire at a bonding portion (142) connecting the k core wire and the l core wire and a core wire twisting direction D2kl of the k core wire at a bonding portion (142) connecting the k core wire and the m core wire is different from when manufactured.

Abstract: An optical fiber cable 100 includes at least one optical fiber core 140 and a sheath containing the optical fiber core. The optical fiber core 140 includes optical fibers 130. A total length of the optical fiber core 140 is longer than that of the sheath 160. The optical fiber core 140 is contained in the sheath 160 so that bending occurs in the optical fibers 130.

Abstract: There is provided a thermoplastic fluororesin tube that, during the production of a catheter, can prevent a gap or air bubbles from being formed in the connection part of the catheter, and can be suitably used for the production of a catheter. A thermoplastic fluororesin tube, the thermoplastic fluororesin tube having tearability in a longitudinal direction, wherein a thermal expansion coefficient in the longitudinal direction upon heating in a gaseous phase at a temperature of 100° C. for 5 minutes is 0% or more.

Abstract: A wafer loading apparatus capable of making a temperature distribution in a surface of a wafer more uniform is provided. The wafer loading apparatus includes a stage on which a wafer is loaded, and a heater installed in the stage to heat a wafer loaded on a loading surface of the stage. The stage includes a top plate providing the loading surface. The heater includes first heater coils disposed on a surface of the top plate opposite to the loading surface, electrode portions electrically connected to the first heater coils and arranged side by side along an outer peripheral portion of the top plate, and a second heater coil disposed outside the first heater coils. The second heater coil generates heat in such a way that a heat distribution in a circumferential direction is varied corresponding to the arrangement of the electrode portions.

Abstract: A wafer stage includes an electrostatic chuck (ESC) plate, an upper supporting plate, a lower supporting plate and a temperature controller. The ESC plate includes a first surface that supports a wafer. The upper supporting plate is bonded to a second surface of the ESC plate opposite to the first surface. The lower supporting plate overlaps the upper supporting plate. The temperature controller is disposed between the upper supporting plate and the lower supporting plate. The ESC plate includes ceramics. The upper supporting plate includes a composite material of aluminum or aluminum alloy and ceramics or carbon. The ESC plate and the upper supporting plate are directly bonded to each other by a room temperature solid bonding process. Thus, the wafer stage has sufficient strength to withstand pressure differences between a vacuum and atmospheric pressure, improved temperature response by minimizing heat capacity, and prevents warpage of the ESC plate.

Abstract: An electrostatic chuck according to an embodiment includes a fixing plate on which a wafer is fixed, an electrostatic plate located under the fixing plate and configured to generate an electrostatic force to fix the wafer on the fixing plate, a plurality of heating elements located under the electrostatic plate and separated to locally control a temperature of the electrostatic plate, and a cooling plate located under the plurality of separated heating elements and configured to emit heat transferred by the plurality of separated heating elements.

Abstract: A wafer loading apparatus capable of making a temperature distribution in a surface of a wafer more uniform is provided. The wafer loading apparatus includes a stage on which a wafer is loaded, and a heater installed in the stage to heat a wafer loaded on a loading surface of the stage. The stage includes a top plate providing the loading surface. The heater includes first heater coils disposed on a surface of the top plate opposite to the loading surface, electrode portions electrically connected to the first heater coils and arranged side by side along an outer peripheral portion of the top plate, and a second heater coil disposed outside the first heater coils. The second heater coil generates heat in such a way that a heat distribution in a circumferential direction is varied corresponding to the arrangement of the electrode portions.

Abstract: Provided is a film forming apparatus that can be used for an ultrahigh temperature film forming process. A film forming apparatus for forming a film on a wafer in a chamber may include a rotary stage configured to rotate in a circumferential direction, the rotary stage having a loading surface, on which the wafer may be loaded, a heater provided in the rotary stage to heat the wafer loaded on the loading surface, and a power supply part configured to supply electric power to the heater. The rotary stage includes a rotary shaft, which may be provided to penetrate the chamber and may be supported to be rotatable, the power supply part may be electrically coupled to the heater and may have a wire, which may be extended to an outside of the chamber through a penetration hole penetrating the rotary shaft in an axis direction, the heater may be configured to heat the wafer loaded on the loading surface of the rotary stage, to a temperature of 600° C. to 2000° C.

Abstract: The objective of the present invention is to provide a tube which is formed from a fluororesin and has excellent tearability and inner surface smoothness. A tube formed from a fluororesin according to the present invention is tearable in the longitudinal direction, and is formed from one thermoplastic fluororesin that is different from polytetrafluoroethylenes.

Abstract: A method for manufacturing an all solid-state lithium-ion rechargeable battery includes forming a first active material layer on a base, forming a solid electrolyte layer connected to the first active material layer, forming a second active material layer connected to the solid electrolyte layer, and repairing a short-circuit defect produced between the first active material layer and the second active material layer by supplying a repair current between the first active material layer and the second active material layer.

Abstract: A method for manufacturing a thin film lithium-ion rechargeable battery includes forming a first active material layer on a base, forming an electrolyte layer on the first active material layer, forming a second active material layer on the electrolyte layer, and annealing including emitting a laser beam to at least one amorphous layer among the first active material layer, the electrolyte layer, and the second active material layer to reform the amorphous layer to a crystalline or crystal precursor state.