Abstract: A radiation detection apparatus includes a first sensor panel that generates a signal in accordance with incident radiation, a second sensor panel that generates a signal in accordance with incident radiation, and an adhesive member that couples together the first sensor panel and the second sensor panel. When a stimulation is applied to the adhesive member, an adhesive force of the adhesive member is lowered to a strength at which the first sensor panel and the second sensor panel can be separated without causing damage.

Abstract: An apparatus includes: a first pixel for acquiring an image, the first pixel including a first conversion element and a first thin-film transistor and connected to a first signal line; and a second pixel for correcting an output of the first pixel, the second pixel including an element and a second thin-film transistor and connected to a second signal line, in which a ratio between a plurality of capacitances related to the first signal line and a ratio between a plurality of capacitances related to the second signal line are approximately equivalent.

Abstract: A manufacturing method of a radiation imaging apparatus in which a sensor substrate and a scintillator are bonded by a bonding member, is provided. The method includes: forming, on a support substrate, a functional layer including a moisture preventing layer configured to suppress permeation of water; forming the scintillator on the support substrate with the functional layer arranged thereon; and separating, from the support substrate, at least a part of the scintillator together with the functional layer.

Abstract: A manufacturing method of a radiation imaging apparatus is provided. The radiation imaging apparatus includes a sensor substrate and a scintillator that are bonded by a bonding member. The manufacturing method includes: preparing a support substrate on which the scintillator has been formed; bonding the sensor substrate and the scintillator via the bonding member; and separating the support substrate after the bonding. The bonding is performed under reduced pressure.

Abstract: A difference in wiring capacitance between bias lines is reduced by equalizing, for pixels A connected to a signal line from a first direction and pixels B connected to the signal line from a second direction, the numbers of the pixels A and the pixels B where the pixels A and the pixels B are each connected to the corresponding bias line.

Abstract: A sensor board comprising a substrate comprising a pixel region where pixels are arranged on a first surface of two surfaces, a scintillator arranged on one of the first surface and a second surface of the two surfaces and a light shielding member arranged on the surface on which the scintillator is arranged, is provided. The pixel region comprises a first region where a signal for radiation image is generated and a second region where a signal for correcting a signal output from the first region is generated. The scintillator is arranged to overlap the first region but not to overlap the second region. The light shielding member is arranged to cover the scintillator and overlap the second region. A portion of the light shielding member overlapping the second region is bonded to the surface on which the scintillator is arranged.

Abstract: A method of operating a radiation imaging apparatus including a sensor substrate which includes a plurality of pixels arranged in a matrix, each pixel including a conversion element configured to convert radiation or light into an electric charge and accumulate the electric charge and a switch element. The method includes, supplying a first driving potential to set the switch element in a non-conductive state, changing a bias potential supplied to a second terminal of the conversion element to remain a charge in the conversion element, supplying a second driving potential to the switch element to readout a remaining charge, and calculating a threshold voltage of the switch element based on the remaining charge.

Abstract: A difference in wiring capacitance between bias lines is reduced by equalizing, for pixels A connected to a signal line from a first direction and pixels B connected to the signal line from a second direction, the numbers of the pixels A and the pixels B where the pixels A and the pixels B are each connected to the corresponding bias line.

Abstract: An imaging apparatus includes a pixel region including a plurality of pixels, and bias wiring laid on a light incident side of pixels to supply a bias from a power supply to the pixels in the pixel region via a second side defining the pixel region. The bias wiring includes first wiring portions and second wiring portions laid around the pixels. The first wiring portions are laid in a Y direction away from the second side, and the second wiring portions are laid in an X direction orthogonal to the Y direction. The first wiring portions include a light non-transmissive member. A resistance of the first wiring portion per pixel is smaller than that of the second wiring portion per pixel. A loss of light due to the second wiring portion is smaller than that of the light incident due to the first wiring portion.

Abstract: A method of manufacturing a radiation imaging apparatus includes electrically connecting a first surface of a flexible insulating layer to a conductive portion of a circuit substrate, covering an exposed portion of the conductive portion with a protection layer, and separating the flexible insulating layer from a substrate in contact with a second surface of the flexible insulating layer. The circuit substrate includes an integrated circuit mounted on the circuit substrate. The flexible insulating layer includes, on the first surface, a plurality of pixels arranged in a two-dimensional matrix to convert radiation into an electrical signal. The second surface of the flexible insulating layer is opposite to the first surface of the flexible insulating layer. The flexible insulating layer is separated from the substrate by irradiating the second surface with light transmitting through the substrate.

Abstract: There is provided a light emitting display apparatus including at least a light emitting element and a thin film transistor (TFT) for driving the light emitting element, characterized in that a mechanism is provided in which a semiconductor constituting the TFT is irradiated with at least a part of light whose wavelength is longer than a predetermined wavelength among the light emitted by the light emitting element.

Abstract: An apparatus comprises a plurality of pixels each including a conversion element and a switch, a driving circuit configured to control the switches via drive lines, a bias power supply unit configured to supply a bias potential to the conversion element via a bias line, column signal lines to which signals are output from the plurality of pixels, and a detection unit. The plurality of pixels include a first pixel and a second pixel, which are adjacent to each other in the row direction and are connected to a common column signal line. The switch of the first pixel and the switch of the second pixel are connected to drive lines different from each other. The detection unit determines presence/absence of radiation irradiation based on a current flowing to the bias line.

Abstract: A radiation imaging apparatus includes a first detection pixel including a first switch element, a second detection pixel including a second switch element and having sensitivity which is different from that of the first detection pixel, a first signal line, a second signal line, a reading circuit which performs a first operation of reading first and second signals which appear in the first and second signal lines in a state in which the first and second switch elements are in a non-conductive state while the radiation imaging apparatus is irradiated with a radial ray and a second operation of reading third and fourth signals which appear in the first and second signal lines when the first and second switch elements are brought into a conductive state, and an information processing circuit which performs a process of generating information based on the first to fourth signals.

Abstract: A radiation imaging apparatus includes a pixel portion in which a plurality of pixels, each pixel including a conversion element configured to convert radiation into charge, are arranged in a matrix, a driving circuit configured to drive a plurality of driving lines and a processing unit configured to process a signal from the pixel portion. The driving circuit performs a reset operation in which the conversion elements of the plurality of pixels are repetitively reset. The pixel portion includes rows in which the pixels have been divided into a plurality of groups. The conversion elements of the plurality of groups are reset at different timings in the reset operation, and the processing unit corrects, by using a signal of a pixel of another group, a signal of a pixel of a group with data deficiency caused by the reset operation.

Abstract: A radiographic imaging apparatus includes a pixel, a readout unit, and a signal processing unit. The pixel includes a switch configured to connect a conversion element configured to convert radiation into an electric signal to a signal line. The readout unit is configured to perform a first operation of reading out a first signal appearing in the signal line when the switch is not in a conductive state and a second operation of reading out a second signal appearing in the signal line when the switch is in a conductive state. The read out unit is configured to perform the first operation before performing the second operation a plurality of times consecutively. The signal processing unit is configured to perform signal processing for outputting information indicating irradiation of the radiographic imaging apparatus by the radiation based on the first signal and the second signal.

Abstract: An imaging apparatus includes a pixel region including a plurality of pixels, and bias wiring laid on a light incident side of pixels to supply a bias from a power supply to the pixels in the pixel region via a second side defining the pixel region. The bias wiring includes first wiring portions and second wiring portions laid around the pixels. The first wiring portions are laid in a Y direction away from the second side, and the second wiring portions are laid in an X direction orthogonal to the Y direction. The first wiring portions include a light non-transmissive member. A resistance of the first wiring portion per pixel is smaller than that of the second wiring portion per pixel. A loss of light due to the second wiring portion is smaller than that of the light incident due to the first wiring portion.

Abstract: A radiation imaging apparatus comprises a sensor portion including a pixel array configured to acquire an image signal corresponding to radiation, and a plurality of detection elements arranged in the pixel array and configured to detect the radiation, and a readout circuit configured to read out the image signal from the sensor portion, wherein the readout circuit includes a signal processing circuit arranged to combine and process signals from the plurality of detection elements if determining the presence or absence of radiation irradiation, and to process a signal for each detection element or combine and process signals from a number of detection elements from among the plurality of detection elements, the number being less than the number of detection elements that include the plurality of detection elements, if determining a radiation dose.

Abstract: A radiation imaging apparatus is provided. The apparatus comprises pixels arranged in an image sensing region, a first and a second detecting elements configured to obtain radiation irradiation information, a first signal line to which a signal from the first detecting element is to be output and a second signal line to which a signal from the second detecting element is to be output, and a signal processing circuit configured to process the signals output from the first and the second detecting elements. The first the second signal lines are arranged in the image sensing region or arranged adjacent to the image sensing region, the first detecting element has a larger region to detect radiation than the second detecting element. The signal processing circuit generates the radiation irradiation information based on the signals from the first and the second signal lines.

Abstract: An apparatus includes a plurality of detection pixels configured to generate a signal according to a radiation irradiation amount to obtain radiation irradiation information, a detection unit configured to correspond to a region of the plurality of detection pixels and detect one of light, pressure, capacitance, and temperature as two-dimensional information, and a control unit configured to determine a monitoring target detection pixel and a non-monitoring-target detection pixel among the plurality of detection pixels based on the two-dimensional information detected by the detection unit, read the signals of detection pixels of a row in which the monitoring target detection pixel is included.

Abstract: A radiation imaging apparatus includes a first detection pixel including a first switch element, a second detection pixel including a second switch element and having sensitivity which is different from that of the first detection pixel, a first signal line, a second signal line, a reading circuit which performs a first operation of reading first and second signals which appear in the first and second signal lines in a state in which the first and second switch elements are in a non-conductive state while the radiation imaging apparatus is irradiated with a radial ray and a second operation of reading third and fourth signals which appear in the first and second signal lines when the first and second switch elements are brought into a conductive state, and an information processing circuit which performs a process of generating information based on the first to fourth signals.