Abstract: A wiring forming system comprises: maskless exposure unit which directly exposes an unexposed board by using exposure data generated based on design data relating to an wiring board; post-development inspect unit which tests the board after development, by using the exposure data and the image data of the board exposed and developed by the maskless exposure unit; etching unit which etches the developed board; and post-etching inspect unit which tests an etching pattern formed on the etched board, by using etching inspect data generated based on the design data and the image data of the board etched by the etching unit.

Abstract: A wiring forming system comprises: maskless exposure unit which directly exposes an unexposed board by using exposure data generated based on design data relating to an wiring board; post-development inspect unit which tests the board after development, by using the exposure data and the image data of the board exposed and developed by the maskless exposure unit; etching unit which etches the developed board; and post-etching inspect unit which tests an etching pattern formed on the etched board, by using etching inspect data generated based on the design data and the image data of the board etched by the etching unit.

Abstract: A component-embedded board fabrication method includes detecting, before the board is covered with a first insulating layer, the actual position of a first electronic component formed on a surface of the board, calculating a displacement between the design position of the first electronic component on the surface of the board and holding the displacement as first displacement data, and correcting, based on the first displacement data, design data to be used for processing the board after the board is covered with the first insulating layer.

Abstract: A method of fabricating a component-embedded board including detecting, before the board is covered with an insulating layer, the actual position of an electronic component formed on the surface of the board, calculating a displacement between the design position of the electronic component and the actual position of the electronic component on the surface of the board, and for holding the displacement as displacement data, and correcting, based on the displacement data, design data to be used for processing the board after the board is covered with the insulating layer.

Abstract: A patterning method performed by a direct patterning apparatus, and a computer readable medium for controlling a computer of the direct patterning apparatus to perform the pattering method. The patterning method forms a desired pattern on the surface of the object by exposing the surface of the object to light by using a plurality of spatial light modulation elements installed in a direction perpendicular to the relative moving direction of the object, so that a defective resolution does not occur on the surface of the object.

Abstract: A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.

Abstract: An exposing apparatus for irradiating desired spots on a substrate to be exposed relatively moving with respect to two or more light sources arranged along the direction of the relative movement to form a desired exposure pattern using the light sources comprises a control means for controlling the turning-on of only specific light sources out of the two or more light sources at a specific timing.

Abstract: In a patterning apparatus for forming a desired pattern on a surface of an object by exposing the surface of the object to light by using a plurality of spatial light modulation elements assigned to respective exposure areas defined along a relative moving direction of the object, predetermined areas which are on the surface of the object and are to be positioned in the vicinity of borders of the respective exposure areas exposed to light by the spatial light modulation elements are exposed to light by the spatial light modulation elements corresponding to the exposure areas, after the object is shifted in a direction perpendicular to the relative moving direction, such that the predetermined areas are positioned in the vicinity of the center parts of the exposure areas.

Abstract: An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23.

Abstract: A direct exposure system comprises: a data mask that is a data object including drawing data; and a control mask that is a data object including at least one logical layer in which information about exposure conditions applied according to regions on a substrate is specified, and performs a direct exposure process using integrated data generated by combining the data mask with the control mask.

Abstract: A pattern drawing apparatus for forming patterns, that have a mirror image relationship to each other with respect to a substrate, on both sides of the substrate forms the patterns on both sides of the substrate by drawing the patterns directly on both sides of the substrate in accordance with prescribed data by using a direct drawing means such as a maskless exposure means or an inkjet patterning means.

Abstract: An optical exposure method and a device are used for forming patterns on a printed board wiring or semiconductor board. A single exposing region of a surface to be exposed is irradiated with a plurality of optical beams having different irradiating areas and different scanning pitches, such as, a peripheral area is irradiated with an optical beam having a smaller irradiating area and an inner area is irradiated with an optical beam having a larger irradiating area.

Abstract: A billing apparatus, for a direct drawing apparatus in which drawing data generated based on layout design data and necessary for drawing is supplied to a drawing engine in real time during the drawing and, based on the drawing data, the drawing engine forms a drawing pattern on a drawing target moving relative to the drawing engine, comprises: counting means for counting the number of frames in the drawing data supplied to the drawing engine, one drawing data frame being constructed by packetizing data of an amount necessary for a drawing head in the drawing engine to perform one drawing operation; and billing charge determining means for determining a billing charge based on the number of frames counted by the counting means.

Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

Abstract: An object of the present invention is to make it possible to effect a reliable and compact configuration for a semiconductor device when mounting a plurality of semiconductor elements in a single package, and achieve higher integration and higher functionality more effectively. In a multi-layer wiring board 20 in which wiring patterns (conductor layers) 22, 24, and 26, and insulating layers 23, 25, and 27, are formed alternately in multiple layers on a base substrate, and electrically connections are made between the wiring patterns through via holes VH1 and VH2, semiconductor elements 30 are imbedded and mounted inside the insulating layers 23, 25, and 27, and the semiconductor elements 30 are deployed so that they are electrically connected to wiring patterns that are covered by the insulating layers, and so that they are stacked up in a direction perpendicular to the planar dimension of the multi-layer wiring board 20.

Abstract: Method for manufacturing a semiconductor device wherein thin semiconductor chips having a thickness of 50 ?m or so are imbedded and mounted inside a package, and multi-level stacking is facilitated by forming external connection terminals on both surfaces of the package, or, alternatively, exposing the terminal formation portions of the wiring pattern, to which the external conncetion terminals are to be connected, out of a solder resist layer.

Abstract: A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.

Abstract: A direct exposure system comprises: a data mask that is a data object including drawing data; and a control mask that is a data object including at least one logical layer in which information about exposure conditions applied according to regions on a substrate is specified, and performs a direct exposure process using integrated data generated by combining the data mask with the control mask.

Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

Abstract: An exposing apparatus for irradiating desired spots on a substrate to be exposed relatively moving with respect to two or more light sources arranged along the direction of the relative movement to form a desired exposure pattern using the light sources comprises a control means for controlling the turning-on of only specific light sources out of the two or more light sources at a specific timing.