Abstract: Enhanced, specific nucleic acid targeting complexes comprising endo and exonuclease activity, and related methods that allow both targeted degradation of specific and/or non-specific nucleic acids in vivo and specific temporal regulation of nuclease activity to prevent off-target activity are disclosed herein. Through practice of the disclosure, nucleic acids, and cells harboring them, such as cancer cells or pathogens, are selectively degraded in vivo.

Abstract: A display device includes a substrate including a display area and a non-display area, and pixels disposed in the display area. The pixels each include first electrodes, second electrodes spaced apart from the first electrodes, and light emitting elements disposed between the first electrodes and the second electrodes. The first electrodes each include a closed loop of a polygonal shape in some sections.

Abstract: A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.

Abstract: A display device includes a substrate including a display area and a non-display area, a pixel located in the display area, a pad unit on one side of the non-display area, and a driver connected to the pixel. The pixel includes a first insulating layer, a first light emitting element on the first insulating layer, a second insulating layer on the first light emitting element and exposing one end portion and another end portion of the first light emitting element, a first contact electrode on the second insulating layer and connected to the one end portion of the first light emitting element, and a second contact electrode on the second insulating layer and connected to the other end portion of the first light emitting element. The pad unit includes a pad metal layer, a first pad insulating layer, a second pad insulating layer, and a pad electrode.

Abstract: A light emitting diode display device including: an organic light emitting diode including an anode electrode; a first transistor for providing a current to the anode electrode of the organic light emitting diode; a second transistor for transmitting a voltage to a gate electrode of the first transistor; a first capacitor for storing the voltage transmitted to the gate electrode of the first transistor; and a second capacitor disposed between a first electrode of the second transistor and a data line, wherein the first electrode of the second transistor is directly connected to the anode electrode of the organic light emitting diode,

Abstract: A display device and a method of manufacturing the same are provided. A display device includes: a substrate including a plurality of pixels; a first electrode and a second electrode spaced apart from each other on the substrate; a light emitting element located between the first electrode and the second electrode; and a conductive pattern on the light emitting element. The light emitting element includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, and the conductive pattern overlaps the active layer and does not overlap the first semiconductor layer or the second semiconductor layer.

Abstract: A light emitting diode display device including: an organic light emitting diode including an anode electrode; a first transistor for providing a current to the anode electrode of the organic light emitting diode; a second transistor for transmitting a voltage to a gate electrode of the first transistor; a first capacitor for storing the voltage transmitted to the gate electrode of the first transistor; and a second capacitor disposed between a first electrode of the second transistor and a data line, wherein the first electrode of the second transistor is directly connected to the anode electrode of the organic light emitting diode.

Abstract: A display device includes a first substrate including a plurality of unit light emitting areas; a first electrode and a second electrode in each of the unit light emitting areas of the first substrate; a first insulation layer exposing one region of each of the first electrode and the second electrode; a light emitting element on the first insulation layer and having a first end and a second end in a length direction; light conversion patterns adjacent to the light emitting element, covering a portion of an upper surface of the light emitting element, and exposing the first and second ends of the light emitting element; a first contact electrode on the first electrode and connecting the one region of the exposed first electrode and the first end of the light emitting element; and a second contact electrode on the second electrode.

Abstract: A pharmaceutical composition for treating cancer, containing a crRNA and an endonuclease as active ingredients is disclosed. The composition can be customized according to the needs of patients or cell types by specifically treating cancer cells on the basis of specific binding properties of DNA and RNA. The nuclease activity of a CRISPR PLUS system, containing both an endonuclease and an exonuclease can be activated by means of the binding between crRNA and a gene specifically found in cancer cells. Therefore, the cancer treatment effect of the composition is more specific than that of other anti-cancer agents that have been developed up till now.

Abstract: A display device includes a substrate including a display area and a non-display area, and pixels disposed in the display area. The pixels each include first electrodes, second electrodes spaced apart from the first electrodes, and light emitting elements disposed between the first electrodes and the second electrodes. The first electrodes each include a closed loop of a polygonal shape in some sections.

Abstract: A display device includes a substrate including a display area and a non-display area, a pixel located in the display area, a pad unit on one side of the non-display area, and a driver connected to the pixel. The pixel includes a first insulating layer, a first light emitting element on the first insulating layer, a second insulating layer on the first light emitting element and exposing one end portion and another end portion of the first light emitting element, a first contact electrode on the second insulating layer and connected to the one end portion of the first light emitting element, and a second contact electrode on the second insulating layer and connected to the other end portion of the first light emitting element. The pad unit includes a pad metal layer, a first pad insulating layer, a second pad insulating layer, and a pad electrode.

Abstract: A method of manufacturing a display device includes: forming a first electrode on a substrate; forming an insulating layer on the substrate and on the first electrode; providing light emitting elements in the insulating layer, each of the light emitting elements having a long axis and a short axis crossing the long axis and being configured to emit light; aligning the light emitting elements such that one end of each of the light emitting elements faces the substrate and the long axis of each of the light emitting elements is arranged in a direction from the substrate toward the insulating layer; patterning the insulating layer to form an insulating pattern exposing another end of each of the light emitting elements; and forming a second electrode electrically connected to the exposed other end of each of the light emitting elements.

Abstract: Enhanced, specific nucleic acid targeting complexes comprising endo and exonuclease activity, and related methods that allow both targeted degradation of specific and/or non-specific nucleic acids in vivo and specific temporal regulation of nuclease activity to prevent off-target activity are disclosed herein. Through practice of the disclosure, nucleic acids, and cells harboring them, such as cancer cells or pathogens, are selectively degraded in vivo.

Abstract: A light emitting diode display device including: an organic light emitting diode including an anode electrode; a first transistor for providing a current to the anode electrode of the organic light emitting diode; a second transistor for transmitting a voltage to a gate electrode of the first transistor; a first capacitor for storing the voltage transmitted to the gate electrode of the first transistor; and a second capacitor disposed between a first electrode of the second transistor and a data line, wherein the first electrode of the second transistor is directly connected to the anode electrode of the organic tight emitting diode.

Abstract: A semiconductor package includes: a connection member including a plurality of connection pads and a redistribution layer; a semiconductor chip disposed on the connection member; an encapsulant sealing the semiconductor chip; a passivation layer disposed on the connection member; a plurality of under bump metallurgy (UBM) pads disposed on the passivation layer; and a plurality of UBM vias connecting the plurality of UBM pads to the plurality of connection pads, respectively, wherein the plurality of UBM pads include a first UBM pad overlapped with the semiconductor chip in a stacking direction, and a second UBM pad located outside of the overlapped region, and the first connection pad has an area larger than an area of an associated first UBM pad while the associated first UBM pad is overlapped in the stacking direction, and has an area larger than an area of the second connection pad.

Abstract: A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.

Abstract: A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.

Abstract: A semiconductor package includes: a connection member including a plurality of connection pads and a redistribution layer; a semiconductor chip disposed on the connection member; an encapsulant sealing the semiconductor chip; a passivation layer disposed on the connection member; a plurality of under bump metallurgy (UBM) pads disposed on the passivation layer; and a plurality of UBM vias connecting the plurality of UBM pads to the plurality of connection pads, respectively, wherein the plurality of UBM pads include a first UBM pad overlapped with the semiconductor chip in a stacking direction, and a second UBM pad located outside of the overlapped region, and the first connection pad has an area larger than an area of an associated first UBM pad while the associated first UBM pad is overlapped in the stacking direction, and has an area larger than an area of the second connection pad.

Abstract: A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.

Abstract: A semiconductor package includes: a connection member including a plurality of connection pads and a redistribution layer; a semiconductor chip disposed on the connection member; an encapsulant sealing the semiconductor chip; a passivation layer disposed on the connection member; a plurality of under bump metallurgy (UBM) pads disposed on the passivation layer; and a plurality of UBM vias connecting the plurality of UBM pads to the plurality of connection pads, respectively, wherein the plurality of UBM pads include a first UBM pad overlapped with the semiconductor chip in a stacking direction, and a second UBM pad located outside of the overlapped region, and the first connection pad has an area larger than an area of an associated first UBM pad while the associated first UBM pad is overlapped in the stacking direction, and has an area larger than an area of the second connection pad.