Abstract: Epoxy compounds that are bisanhydrohexitol derivatives (i.e., isosorbide derivatives, isomannide derivatives, isoidide derivatives, or mixtures thereof) having two terminal oxirane groups are provided. Additionally, curable compositions that include these epoxy compounds, cured compositions prepared from the curable compositions, and articles containing the cured compositions are described. The cured compositions can be used, for example, as a structural adhesive or as a coating.

Abstract: Methods of joining pipe section and joined pipe assemblies are described. The pipe sections, e.g., pipes and couplers, are joined by a mechanical interference bond formed using a shape memory polymer key. The key can be inserted into a first keyway of one pipe section, the pipes fitted to align first keyway with a second keyway of the second pipe section, and the shape memory polymer activated to at least partially fill both keyways.

Abstract: Described herein is an acrylate composition comprising: a first component comprising an amine-based curing agent and a first dye, having a first color; and a second component comprising a curable acrylate resin and a second dye, having a second color.

Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.

Abstract: Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.

Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.

Abstract: Methods of joining pipe section and joined pipe assemblies are described. The pipe sections, e.g., pipes and couplers, are joined by a mechanical interference bond formed using a shape memory polymer key. The key can be inserted into a first keyway of one pipe section, the pipes fitted to align first keyway with a second keyway of the second pipe section, and the shape memory polymer activated to at least partially fill both keyways.

Abstract: Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.

Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Abstract: Toughened curable compositions are described. The curable compositions include a curable resin, surface-modified nanoparticles, and rubber nano-domains. Both core-shell rubber nano-domains, and nano-rubber domains arising from self-assembled block co-polymers are disclosed. Toughened, cured resin compositions, and articles comprising such cured compositions are also discussed.

Abstract: This disclosure relates to gasket materials used for attaching and sealing covers to enclosures. More particularly, this disclosure relates to form-in-place gaskets, applied to surfaces of containers for sensitive electronic components. The gaskets include a flexible polymer and a micropowder polyolefin filler.

Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Abstract: A plug-in coupling for pipes includes a sealing element, a sleeve linked with the base and a retaining element including retaining claws for fixing the pipe end which is disposed in the interior of the sleeve. An annular gap between the base and the sleeve and receives the pipe end. While reducing production and assembly costs, the plug-in coupling ensures a durable and reliable connection and prevents the pipe end from being damaged and the retaining claws from penetrating the pipe end too deeply. The retaining element includes a closed annular part and is integrated into the sleeve and fixed therein with said part. The sleeve includes radially inside the retaining element a support element with an outer supporting face on which the spring-elastic retaining elements are supported. The supporting face is mounted at a predetermined angle which opens up towards the free front sleeve end.

Abstract: A method of applying a curable composition. The method includes providing a curable composition comprising about 10 to about 60 weight percent of one or more epoxy resins; about 20 to about 80 weight percent of one or more resins selected from polyester resins, ethyl vinyl acetate resins, thermoplastic resins, and acrylate resins; up to about 30 weight percent of one or more hydroxyl-containing compounds; and an initiator selected from a photoinitiator, a thermal initiator, and combinations thereof. The method further includes initiating cure of the curable composition.

Abstract: A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive precursor can be cured to form a conductive adhesive useful for bonding two substrates together.

Abstract: The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.

Abstract: Provided is a layered body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body comprising a substrate to be ground, a joining layer including a curable adhesive in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a layered body including a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body including a substrate to be ground, a joining layer having a curable acrylate polymer and a curable acrylate adhesion modifying agent in contact with the substrate to be ground, a photothermal conversion layer having a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is an adhesive composition useful for electronic assembly comprising a curable epoxy resin, a plurality of polymer particles having at least one of a plurality of acid functional groups or a composition which swells in the presence of the epoxy resin at a first temperature and a thermally activated cure agent and/or a thermally activated cure catalyst which becomes active at a second, temperature, wherein the second temperature is higher than the first temperature. Also provided are assemblies including such adhesives and methods of assembling same.

Abstract: The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component bonded and electrically connected to a substrate using an underfill adhesive comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles that are substantially spherical, non-agglomerated, amorphous, and solid.