Abstract: An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

Abstract: A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a semiconductor chip is provided, an adhesion layer is applied over its top surface, followed by the application of a reinforcing layer over the adhesion layer. When a semiconductor chip package is provided, the package first undergoes a cleaning process, followed by the application of an adhesion layer over its top surface and, lastly, the application of a reinforcing layer over the adhesion layer.

Abstract: Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement.

Abstract: An electronic component with solder ball connections is provided. A stencil is produced with holes passing through it in an arrangement corresponding to an arrangement of conductive pads on a substrate or integrated circuit. The stencil is made of a solder reflow compatible material. A layer of adhesive is applied to the stencil which is then positioned with the layer of adhesive adjacent the substrate or integrated circuit with the holes aligned with the conductive pads. Solder paste is deposited in the holes and is heated along with the conductive pads to form solder balls on the conductive pads.

Abstract: Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.

Abstract: The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicon or flexible-epoxy adhesive. The aluminum may be coated by anodizing or Chromate conversion or the copper may be coated with nickel or gold Chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of -65 to 150.degree. C. for 1,000 cycles and 85.degree. C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance and a CTE between that of the silicon metal die and the metal of the heat sink.

Abstract: Chip stacks with decreased conductor length and improved noise immunity are formed by laser drilling of individual chips, such as memory chips, preferably near but within the periphery thereof, and forming conductors therethrough, preferably by metallization or filling with conductive paste which may be stabilized by transient liquid phase (TLP) processes and preferably with or during metallization of conductive pads, possibly including connector patterns on both sides of at least some of the chips in the stack. At least some of the chips in the stack then have electrical and mechanical connections made therebetween, preferably with electroplated solder preforms consistent with TLP processes. The connections may be contained by a layer of resilient material surrounding the connections and which may be formed in-situ. High density circuit packages thus obtained may be mounted on a carrier by surface mount techniques or separable connectors such as a plug and socket arrangement.

Abstract: The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint, wherein the solder joint spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a hyperbranched polymer formed by the reaction of a monomer of the formula: (A).sub.n RB, wherein A is a coupling group reactive with B, B is a coupling group reactive with A, n is greater than 1, and R is a group selected from the group consisting of an aromatic group, an aliphatic group, and mixtures thereof.

Abstract: A liquid crystal display is provided wherein a plurality of liquid crystal display tiles are arranged in a matrix and are electrically interconnected to a tile carrier by depositing an electrically conductive metal on a sidewall edge of the liquid crystal display such as by plating, evaporation, or sputtering. Also provided is the method for forming the liquid crystal display.

Abstract: An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold on chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of -65.degree. to 150.degree. C. for 1,000 cycles and 85.degree. C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance.

Abstract: Dielectric adhesive film patterned with clusters of electrically conductive filaments that extend through the film thickness for providing electrical interconnection and encapsulation. The dielectric adhesive material is reworkable. The clusters are formed by selectively electroplating a noble metal at a high current density.

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especially useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0.degree. to 100.degree. C. for 1,500 cycles, -25.degree. to 125.degree. C. for 400 cycles, and -40.degree. to 140.degree. C. for 300 cycles; and withstand continuous exposure at 130.degree. C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 250.degree. C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone.

Abstract: A plurality of liquid crystal display tiles arranged in a matrix are electrically interconnected to a tile carrier by wire bonds.

Abstract: Chip carrier packages, integrated circuits, wiring boards, and assemblies in computer systems are made having conductive adhesive interconnections. Electrically conductive polymer paste with metal particles and powders are used with photoimagable polymer films to form the interconnection structure. These articles are produced with screening and printing processes using a screening head and printing machine.

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0.degree. to 100.degree. C. for 1,500 cycles, -25.degree. to 125.degree. C. for 400 cycles, and -40.degree. to 140.degree. C. for 300 cycles; and withstand continuous exposure at 130.degree. C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 25.degree. C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone.

Abstract: A metallurgical bond which may be substituted for a soldering process forms an alloy of a metal with a metal coating applied to at least one of the surfaces to be so bonded by a transient liquid phase (TLP) reaction at a low temperature. Mechanically robust bonding of noble metals for electrical connections which are resistively stable through repeated thermal cycling can be performed at particularly low temperatures using coating materials of indium, tin or lead. Isotropically or anisotropically conductive connections can be formed by applying a polymer adhesive containing conductive particles to at least one of the surfaces to be bonded and a compressional force developed between surface by curing of the polymer adhesive at temperatures lower than the melting point of a eutectic alloy of the chosen metal system before the TLP process is allowed to proceed.

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using flexible-epoxy to provide improved thermal performance. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel. Such structures are especilly useful for CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, single layer ceramic, and other chip carrier packages as well as for flip chip attachment to flexible or rigid organic circuit boards. These adhesive materials withstand thermal cycle tests of 0.degree. to 100.degree. C. for 1,500 cycles, -25.degree. to 125.degree. C. for 400 cycles, and -40.degree. to 140.degree. C. for 300 cycles; and withstand continuous exposure at 130.degree. C. for 1000 hours without loss of strength. Flexible-epoxies have a modulus of elasticity below 100,000 psi and a glass transition temperature below 25.degree. C., are much stronger than typical silicone adhesives, and do not contaminate the module or circuit board with silicone.