Abstract: The invention relates to a device for training the muscles of the body, comprising a stack of weights (1) disposed one over the other. In order to couple the weights (1) to a lifting device (2), each weight (1) is associated with a pin (3) or a pivot plate (12) arranged in a vertical line and aligned correspondingly equally. A linearly adjustable actuation device presses the desired pin (3) inward, or pivots the pivot plate (12), and produces the coupling to the lifting device (2).

Abstract: A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.

Abstract: Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.

Abstract: A method of manufacturing a solar cell. The method includes the steps of providing a substrate, applying a first dopant to a first surface, applying a second dopant to a second surface, covering the doped first surface with a hard mask, applying a third dopant to the substrate side, removing the hard mask, applying a pattern of first electrical contacts to the doping pattern, and applying a pattern of second electrical contacts to the doped second surface, the pattern of second electrical contacts and the doping pattern being straight-lined opposed.

Abstract: A method of backside contacting of thin layer photovoltaic cells having Si elements as well as thin film cells, like CIGS, is provided, including the following steps: providing a p-n-junction including a thin n-doped Si layer and a thin p-doped Si layer bonded on top of said n-doped Si layer; bonding said p-n-junction to a glass substrate; preparing contact points on said structured thin p-doped Si layer and said thin n-doped Si layer; and creating contact pins on said structured thin p-doped Si layer and said thin n-doped Si layer.

Abstract: A method for manufacturing a solar concentrator cell module assembly within an integrated circuit process, which solar concentrator cell module assembly includes at least one solar device and which solar device includes one printed circuit board and one Fresnel lens. A printed circuit board is assembled according to a pre-defined circuit board base design layout that allows pick and place of a single solar concentrator cell chip onto a circuit board base. Connections are provided for the solar concentrator cell chip in a serialized or a parallelized arrangement on the circuit board base, and a plurality of openings are formed in the circuit board base below a backside of the solar concentrator chip to enable attachment of cooling fingers.

Abstract: Solar cell assemblies and method of making solar cell assemblies. The method, including: fabricating solar cell chips on solar cell wafers; dicing the solar cell wafers into individual solar cell chips; packaging the individual solar cell chips in molded plastic packages to form solar cell chip packages; and mounting on and electrically connecting one or more of the solar cell chip packages to a printed circuit board. The assemblies including a printed circuit board; one or more solar cell chip packages mounted on and electrically connected to the printed circuit board, each of said one or more solar chip packages comprising a solar cell chip and a lead frame encapsulated in a molded plastic body, top surfaces the solar cell chips exposed in top surfaces of the molded plastic bodies.

Abstract: A method of fabricating solar cell chips. The method includes creating an integrated circuit chip process route for fabricating integrated circuit chips using integrated circuit wafers in an integrated circuit fabrication facility; creating a solar cell process route for fabricating solar cells using solar cell wafers in the integrated circuit fabrication facility; releasing integrated circuit chip wafers and solar cell wafers into tool queues of tools of the an integrated circuit fabrication facility; and processing the solar cell wafers on at least some tools of the integrated circuit fabrication facility used to process the integrated circuit wafers. Also the process used to fabricate the solar cell chips.

Abstract: The invention relates to a clamping device with a base body (2) which comprises a central receptacle (5) for a component or tool to be clamped, in the base body (2) at least one groove (6) being formed which is open to a face side of the base body (2), and with at least one clamping wedge (9b) which can be pressed axially into the groove (6) from the open face side of the latter to radially deform an inner wall section (7) lying between the groove (6) and the receptacle, which is characterised in that the wall (10) which defines the groove (6) on the outside is designed to be elastic over at least an axial partial section such that it is elastically deformed to the outside when the at least one clamping wedge (9b) is pressed into the groove (6).

Abstract: A magnetic field sensor device comprising a substrate having at least a first tilted planar section having a surface normal at a first angle with respect to a surface normal of the substrate, and at least a first magnetoresistive layered structure positioned at the at least first tilted section. Methods for manufacturing magnetic field sensor devices are also presented.

Abstract: A method of manufacturing a magnetic field sensor device in one embodiment includes applying a mask on a substrate, performing a wet etching procedure on the substrate for generating at least a first groove having tilted side walls, and depositing at least one layer of magnetoresistive material onto a section of the surface of at least a first tilted side wall of the groove. A method of manufacturing a magnetic field sensor device on a substrate having a plurality of tilted planar sections, each of the tilted planar sections having a surface normal angled with respect to a surface normal of the substrate is also provided.

Abstract: A method for the manufacture of solar panels from scrapped wafers and/or scrapped dies is provided, including the following steps: identifying scrap wafers and/or scrap dies; cleaning and removing remaining structures from the surface of the wafers/dies; grinding both surfaces of the wafers/dies down to a required thickness; doping the wafers/dies; and further processing the wafers/dies using a solar panel manufacturing method.

Abstract: A package for the transportation of contamination vulnerable articles is provided, comprising a closeable plastic container which is loaded with the respective articles, a first bag made from plastic surrounding said container, and a second bag made from plastic wrapping said first bag, wherein said first bag is provided with a valve-filter arrangement in order to allow a controlled air stream into said first bag when opening said valve-filter arrangement.

Abstract: The invention relates to a clamping device for clamping workpiece, which comprises a base in which a center holding fixture for the shank of a tool to be clamped and an annular damping cavity surrounding the fixture or a plurality of damping cavities arranged around the fixture and set off from each other are configured. Every damping cavity is open towards the front face of the chuck base facing the workpiece. The clamping device is characterized in that the open end of every damping cavity is at least partially closed by respective covers which are inserted into the respective damping cavity from the open front face and are fixed inside the damping cavity.

Abstract: Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.

Abstract: Embodiments of the present invention provide a thin-film coil assembly. The coil assembly includes a substrate, at least two layers of conductive material on top of the substrate, and one layer of insulating material between the two layers of conductive material, wherein the two layers of conductive material are in contact with two interconnects, respectively, which extends substantially vertical to the substrate.

Abstract: A policy engine generates configlets that are vendor-neutral, vendor-specific or both, based on a selected target level and a selected device/device group. A translator translates and combines the configlets to form vendor-dependent configuration files. The policy engine generates the configlets using policies associated with the selected target level and its sub-target levels, as defined by a target level hierarchy. A policy includes at least a condition, and an action which the policy engine performs if the condition is true. In performing the action, the policy engine typically writes to at least a partial configlet. A policy may further include a verification clause, which is used to verify a running configuration. Policy dependencies may also be defined such that where a second policy is dependent on a first policy, the second policy must be evaluated after the first policy. This is necessary, where, for example, the first policy generates and stores a value to be used by the second policy.

Abstract: A magnetic field sensor device comprising a substrate having at least a first tilted planar section having a surface normal at a first angle with respect to a surface normal of the substrate, and at least a first magnetoresistive layered structure positioned at the at least first tilted section. Methods for manufacturing magnetic field sensor devices are also presented.

Abstract: A system to coat a substrate includes a deposition chamber maintained at sub-atmospheric pressure, one or more arrays containing two or more expanding thermal plasma sources associated with the deposition chamber, and at least one injector containing orifices for each array. The substrate is positioned in the deposition chamber and each expanding thermal plasma source produces a plasma jet with a central axis, while the injector injects vaporized reagents into the plasma to form a coating that is deposited on the substrate. The injector orifices are located within a specified distance from the expanding thermal plasma source to obtain generally a coating with generally uniform coating properties.

Abstract: Disclosed is a method to build rounded forms on a substrate by means of a masking layer covering at least parts of a substrate by applying the masking layer in a predetermined thickness to the substrate, such that the layer fixedly adheres to the substrate, performing a photo step, developing the masking layer, contracting the masking layer when adhering to the substrate by an irreversible shrinking process with predefined process control parameters, performing the etching process with a shrunk masking layer and etching at least in part through the shrunk masking layer.