Abstract: In a first aspect, the present invention is directed to a tire comprising a belt portion and a tread portion radially outward of the belt portion, wherein the tread portion comprises a radially outer tread layer for contacting the road when driving and a radially inner tread layer arranged between the radially outer tread layer and the belt portion, wherein the radially outer tread layer comprises a first rubber composition having a first shear storage modulus G?1 and the radially inner tread layer comprises a second rubber composition having a second shear storage modulus G?2, wherein the second shear storage modulus G?2 is between 3 MPa and 9 MPa higher than the first shear storage modulus G?1, and wherein the first shear storage modulus G?1 ranges from 1 MPa to 3 MPa and the second shear storage modulus G?2 ranges from 4 MPa to 12 MPa.

Abstract: Various embodiments may provide a memory cell including a magnetic pinned layer with a substantially fixed magnetization direction, a crystalline spacer layer in contact with the magnetic pinned layer, and a magnetic storage layer. The magnetic storage layer may include an amorphous interface sub-layer in contact with the crystalline spacer layer, the amorphous interface sub-layer including a first alloy of iron (Fe) and at least one element. The amorphous storage layer may also include an amorphous enhancement sub-layer in contact with the amorphous interface sub-layer, the amorphous enhancement sub-layer including a second alloy of iron (Fe) and at least one element. The memory cell may additionally include a cap layer in contact with the amorphous enhancement sub-layer. A concentration of the at least one further element comprised in the first alloy and a concentration of the at least one further element comprised in the second alloy may be different.

Abstract: A method of assembling a terminal assembly includes a terminal and a terminal insert. The terminal insert may be configured to be disposed at least partially in the terminal; the terminal and the terminal insert may be configured to receive at least a portion of a wire; and/or the terminal and the terminal insert may be configured to be crimped to the said wire. The terminal insert may include a first insert wing, a second insert wing a third insert wing, and/or a fourth insert wing. The terminal may include a first wing, a second wing, a third wing, and/or a fourth wing. The first wing of the terminal may be disposed proximate the first wing of the terminal insert and/or the second wing of the terminal may be disposed proximate the second wing of the terminal insert.

Abstract: A control system for controlling operation of a vehicle system is described. The control system includes a trim cover textile configured to cover at least a portion of a vehicle component and having an electrically conductive element configured to provide a capacitive touch functionality. In response to a user touch, the electrically conductive element generates a signal representative of a user command for the vehicle system. The system also includes a control unit adapted to be provided in electrical communication with the electrically conductive element of the trim cover. The control unit is configured to receive the user command signal and, in response, generate a control signal to effectuate control of the vehicle system.

Abstract: A method of assembling a terminal assembly includes a terminal and a terminal insert. The terminal insert may be configured to be disposed at least partially in the terminal; the terminal and the terminal insert may be configured to receive at least a portion of a wire; and/or the terminal and the terminal insert may be configured to be crimped to the said wire. The terminal insert may include a first insert wing, a second insert wing a third insert wing, and/or a fourth insert wing. The terminal may include a first wing, a second wing, a third wing, and/or a fourth wing. The first wing of the terminal may be disposed proximate the first wing of the terminal insert and/or the second wing of the terminal may be disposed proximate the second wing of the terminal insert.

Abstract: Systems and methods for capturing interaction data relating to a host application (app) implemented on a mobile device are disclosed. A tracking module is embedded in the host application. Interaction data relating to the host application is captured on the mobile device with the tracking module. The captured interaction data is transmitted from the mobile device.

Abstract: An electro-mechanical lock for use with a lock device having a locked state and an unlocked state is disclosed. The electro-mechanical lock incorporates an actuation motor susceptible to lockdown and features a variety of lockdown mitigation structures and arrangements to combat the same.

Abstract: A microelectronic device includes a metal layer on a first dielectric layer. An etch stop layer is disposed over the metal layer and on the dielectric layer directly adjacent to the metal layer. The etch stop layer includes a metal oxide, and is less than 10 nanometers thick. A second dielectric layer is disposed over the etch stop layer. The second dielectric layer is removed from an etched region which extends down to the etch stop layer. The etched region extends at least partially over the metal layer. In one version of the microelectronic device, the etch stop layer may extend over the metal layer in the etched region. In another version, the etch stop layer may be removed in the etched region. The microelectronic device is formed by etching the second dielectric layer using a plasma etch process, stopping on the etch stop layer.

Abstract: A microelectronic device includes a metal layer on a first dielectric layer. An etch stop layer is disposed over the metal layer and on the dielectric layer directly adjacent to the metal layer. The etch stop layer includes a metal oxide, and is less than 10 nanometers thick. A second dielectric layer is disposed over the etch stop layer. The second dielectric layer is removed from an etched region which extends down to the etch stop layer. The etched region extends at least partially over the metal layer. In one version of the microelectronic device, the etch stop layer may extend over the metal layer in the etched region. In another version, the etch stop layer may be removed in the etched region. The microelectronic device is formed by etching the second dielectric layer using a plasma etch process, stopping on the etch stop layer.

Abstract: Systems and methods for capturing interaction data relating to a host application (app) implemented on a mobile device are disclosed. A tracking module is embedded in the host application. Interaction data relating to the host application is captured on the mobile device with the tracking module. The captured interaction data is transmitted from the mobile device.

Abstract: An interchangeable electro-mechanical lock core for use with a lock device having a locked state and an unlocked state is disclosed. The interchangeable electro-mechanical lock core may include a moveable plug having a first position relative to a lock core body which corresponds to the lock device being in the locked state and a second position relative to a lock core body which corresponds to the lock device being in the unlocked state. The interchangeable electro-mechanical lock core may include a core keeper moveably coupled to a lock core body. The core keeper may be positionable in a retain position wherein the core keeper extends beyond an envelope of lock core body to hold the lock core body in an opening of the lock device and a remove position wherein the core keeper is retracted relative to the envelope of the lock core body to permit removal.

Abstract: In at least one embodiment, an apparatus for an automated soldering process is provided. The apparatus includes a stepper motor to provide solder and a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire. The apparatus includes a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire. The apparatus includes a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.

Abstract: The present invention provides an improved biotechnological production of riboflavin (also referred herein as vitamin B2) through modification in the operon containing the riboflavin biosynthetic genes (rib operon), in particular modifications of/in the leader sequences (rib leader) upstream of the corresponding riboflavin biosynthetic genes (rib operon). Furthermore, the present invention relates to genetically engineered microorganisms carrying said modified sequences, processes to generate said modified sequences/microorganisms and the use thereof for production of riboflavin.

Abstract: A control system for controlling operation of a vehicle system is described. The control system includes a trim cover textile configured to cover at least a portion of a vehicle component and having an electrically conductive element configured to provide a capacitive touch functionality. In response to a user touch, the electrically conductive clement generates a signal representative of a user command for the vehicle system. The system also includes a control unit adapted to be provided in electrical communication with the electrically conductive element of the trim cover. The control unit is configured to receive the user command signal and, in response, generate a control signal to effectuate control of the vehicle system.

Abstract: A vaporizer body (1) having a vaporizing surface (3) for vaporizing metal in a PVD-metallization installation, wherein the vaporizing surface (3) comprises a plurality of recesses (5, 5?, 5?), with an opening of the respective recess having an area/perimeter-ratio of greater than or equal to 1.5 mm.

Abstract: An interchangeable electro-mechanical lock core for use with a lock device having a locked state and an unlocked state is disclosed. The interchangeable electro-mechanical lock core may include a moveable plug having a first position relative to a lock core body which corresponds to the lock device being in the locked state and a second position relative to a lock core body which corresponds to the lock device being in the unlocked state. The interchangeable electro-mechanical lock core may include a core keeper moveably coupled to a lock core body. The core keeper may be positionable in a retain position wherein the core keeper extends beyond an envelope of lock core body to hold the lock core body in an opening of the lock device and a remove position wherein the core keeper is retracted relative to retain position to permit removal.

Abstract: A microelectronic device includes a metal layer on a first dielectric layer. An etch stop layer is disposed over the metal layer and on the dielectric layer directly adjacent to the metal layer. The etch stop layer includes a metal oxide, and is less than 10 nanometers thick. A second dielectric layer is disposed over the etch stop layer. The second dielectric layer is removed from an etched region which extends down to the etch stop layer. The etched region extends at least partially over the metal layer. In one version of the microelectronic device, the etch stop layer may extend over the metal layer in the etched region. In another version, the etch stop layer may be removed in the etched region. The microelectronic device is formed by etching the second dielectric layer using a plasma etch process, stopping on the etch stop layer.

Abstract: Shielded semiconductor devices and methods for fabricating shielded semiconductor devices are provided. An exemplary magnetically shielded semiconductor device includes a substrate having a top surface and a bottom surface. An electromagnetic-field-susceptible semiconductor component is located on and/or in the substrate. The magnetically shielded semiconductor device includes a top magnetic shield located over the top surface of the substrate. Further, the magnetically shielded semiconductor device includes a bottom magnetic shield located under the bottom surface of the substrate. Also, the magnetically shielded semiconductor device includes a sidewall magnetic shield located between the top magnetic shield and the bottom magnetic shield.