Abstract: A method for correcting an error of the imaging system of a coordinate measuring machine is disclosed. The position of at least two different edges of at least one structure on a substrate is measured. The substrate may be automatically rotated into another orientation. Then the position of the at least two different edges of the at least one structure is measured on the rotated substrate. Based on the measurement data, a systematic error of the imaging system is eliminated.

Abstract: An apparatus and a method for determining the focus of an optical system on a substrate are disclosed. A light source emits an auxiliary light beam into an auxiliary beam path, wherein the auxiliary light beam, after splitting, is offset in relation to an optical axis of a measuring objective. At least one optical switch is provided in the auxiliary beam path for switching the path of the auxiliary beam path from one side offset from the optical axis to the other side offset from the optical axis of the measuring objective.

Abstract: A method for improving the reproducibility of a coordinate measuring machine and its accuracy is disclosed. Using at least one measuring field of a camera, a plurality of images of at least one structure on the substrate are recorded. The substrate is placed on a measuring stage traversable in the X coordinate direction and the Y coordinate direction, the position of which is determined during imaging using a displacement measuring system. The measuring field is displaced by the amount of the deviation determined.

Abstract: A method, a device and the application for the inspection of defects on the edge region of a wafer (6) is disclosed. At least one illumination device (41) illuminates the edge region (6a) of the wafer (6). At least one optical unit (40) is provided, said optical unit (40) being positionable subject to the position of the defect (88) relative to a top surface (30) of the edge of the wafer (6a) or a bottom surface (31) of the edge of the wafer (6a) or a face (32) of the edge of the wafer (6a) for capturing an image of said defect.

Abstract: The present invention broadly comprises a device for supplying light at an illumination wavelength shorter than 300 nm. The device includes a first subassembly, having a light source for delivering light at a wavelength that is at least twice as long as the illumination wavelength; a second subassembly having at least one means for wavelength reduction; and a light guide that guides the light from the light source of the first subassembly into the second subassembly. The present invention also broadly comprises a method for supplying light at an illumination wavelength shorter than 300 nm.

Abstract: The invention relates to an objective for a microscope for dark field microscopy having alternating illumination with grazing incidence. A dark field objective is shown having a front lens for receiving light from a sample and having a dark field illumination device for guiding illumination light onto the sample, the dark field illumination device comprising at least one pair of light decoupling elements, which are each situated in pairs around the front lens opposite to the optical axis for counter parallel illumination of the sample.

Abstract: The present invention relates to an apparatus for illuminating and inspecting a specular surface, comprising a light source, a collector optics for collecting the light from the light source, a homogenizing optics for transmitting the light from the collector optics having a first micro-lens array downstream of the collector optics, and a second micro-lens array downstream of the first micro-lens array, a Fourier optics for transmitting the light from the homogenizing optics onto the specular surface, an objective optics, and a detector for receiving an image, wherein the collector optics and the first micro-lens array project the light source onto the second micro-lens array and wherein the second micro-lens array and the Fourier optics project the first micro-lens array onto the specular surface, and wherein the objective optics projects the specular surface onto the detector.

Abstract: An apparatus for inspecting a surface of a wafer includes an illumination device for illuminating an imaging area of the wafer with at least one broad-band spectrum, and an optical imaging device with a detector for polychromatic imaging of the imaging area of the wafer based on the illumination, wherein the imaging device includes a filter arrangement for selecting a plurality of narrow-band spectra. In addition, a method for inspecting the surface of a wafer, includes the steps of leveling a plurality of narrow-band spectra to a common intensity range, illuminating an imaging area of the wafer with at least one broad-band spectrum, and imaging a plurality of narrow-band spectra from the imaging area based on the illumination.

Abstract: A method for determining the centrality of masks is disclosed. The mask is positioned in a coordinate measuring device on a measurement table displaceable in a direction perpendicular to the optical axis of an imaging measurement system in an interferometrically measurable way. The position of a mask coordinate system with respect to the measuring device coordinate system is determined based on at lest two structures on the mask. The relative distance from one of the at least first and second outer edges to the at least two structures is determined. The coordinate measuring machine determines the actual coordinates of the at least two structures with respect to the respective outer edges, which must not exceed a predetermined deviation from a desired value.

Abstract: A means and a method for determining the spatial position of at least one moving element (9, 20) of a coordinate measuring machine (1) are disclosed. At least one laser interferometer (24) directs a measurement beam (23) to the moving element (9, 20). At least one laser interferometer directs a further measurement beam to the moving element to determine a rotation of the moving element (9, 20) around an X-coordinate direction or around a Y-coordinate direction or around a Z-coordinate direction.

Abstract: A coordinate measuring machine (1) including a plane (25a) in which there is arranged a movable measurement table (20) moving the mask (2) correspondingly in the plane (25a), at least one objective (9) and a detector (11), an incident light source (14) arranged to provide incident light and/or a transmitted light source (6) arranged to provide transmitted light, wherein the mask (2) has at least a first area (41) and a second area (42), wherein the first area (41) and the second area (42) comprise different materials differing in their transmission or reflection properties.

Abstract: A method and a device for improving the measurement accuracy in the nm range for optical systems are disclosed. The object is provided with a plurality of structures oriented in the X and Y-coordinate direction. The light beam coming from at least one light source defines an optical illumination path.

Abstract: A method for correcting the measuring errors caused by the lens distortion of an objective in a coordinate measuring machine is disclosed. For a plurality of different types of structures, the lens distortion caused by an objective is determined in an image field of the objective. The position of a type of structure is determined in the image field of the objective by a measuring window. The correction of the lens distortion required for the type of structure to be measured is retrieved from the database as a function of the type of structure to be measured.

Abstract: A method for determining the ideal focus position on different substrates is disclosed. A focus criterion is determined with which the best reproducibility may be achieved. An offset permits the user to set the optimal operating point of the coordinate measuring machine for a reproducible measurement of dimensions of structures on a substrate.

Abstract: A method for reproducibly determining object characteristics is disclosed. Herein an object is imaged onto a detector by means of an imaging optics and detected thereon. A correction function k is applied to a brightness measuring result N originally detected by a detector in such a way, that a corrected brightness measuring result N? is proportional to a brightness I impinging on the detector.

Abstract: A method and a coordinate measuring machine (1) are provided, wherein the non-linearities of an interferometer (24) can be corrected. A measuring stage (20) traversable in a plane (25a) is provided for measurement. The substrate (2) is placed in a measuring stage (20); wherein the position of the measuring stage (20) along each of the motion axes is determined by at least one interferometer (24) in each case. A computer (16) is provided for compensating the non-linearity inherent in each of the interferometers (24), wherein the position of the measuring stage (20) to be determined by the interferometers (24) is arranged along a trajectory (52, 60, 67) of the measuring stage (20), which is composed at least partially of components of the axes.

Abstract: A system and a method for determining positions of structures on a substrate are disclosed. The system includes at least one measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective (9) and a camera for determining the positions of the structures (3) on the substrate (2). The position of the measurement objective (9) and/or the measurement table (20) may be determined by at least one interferometer (24). The system is surrounded by a housing representing a climatic chamber (50) provided with an active pressure regulation.

Abstract: A coordinate measuring machine (1) for measuring structures (3) on a substrate (2) including a measurement table (20) movable in the X-coordinate direction and in the Y-coordinate direction, a measurement objective (9), at least one laser interferometer (24) for determining the position of the measurement table (20) and the measurement objective (9) wherein the measurement table (20), the measurement objective (9) and the at least one laser interferometer (24) are arranged in a vacuum chamber (50).

Abstract: A method for correcting an error of the imaging system of a coordinate measuring machine is disclosed. The position of at least two different edges of at least one structure on a substrate is measured. The substrate may be automatically rotated into another orientation. Then the position of the at least two different edges of the at least one structure is measured on the rotated substrate. Based on the measurement data, a systematic error of the imaging system is eliminated.

Abstract: A method and a device are disclosed, with which an improvement of the measurement accuracy for the determination of structure data is possible. There is provided a device having a support table (4) movable in the X-coordinate direction and the Y-coordinate direction, on which an additional holder (6) for holding a substrate (2) is carried, having at least one light source (16; 20), at least one objective (8) and a first detector unit (15a) receiving the light transmitted or reflected by structures applied to the substrate (2). There is further provided a polarization means (30a; 30b) associated with the light source (16; 20) and/or located in an optical imaging path (10; 12).