Patents by Inventor Michael J. Hochberg

Michael J. Hochberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TEST SYSTEMS AND METHODS FOR CHIPS IN WAFER SCALE PHOTONIC SYSTEMS
    Publication number: 20190293866
    Abstract: A qualification apparatus for a photonic chip on a wafer that leaves undisturbed an edge coupler that provides an operating port for the photonic devices or circuits on the chip during normal operation in order to not introduce extra loss in the optical path of the final circuit. The qualification apparatus provides an optical path that is angled with regard to the surface of the chip, for example by using a grating coupler. The qualification apparatus can be removed after the chip is qualified. Optionally, the qualification apparatus can be left in communication with the chip and optionally employed as an input port for the chip after the chip has been separated from other chips on a common substrate.
    Type: Application
    Filed: June 12, 2019
    Publication date: September 26, 2019
    Inventors: Ari Novack, Matthew Akio Streshinsky, Michael J. Hochberg
  • Controlling back scattering in optical waveguide systems
    Patent number: 10409012
    Abstract: Back scattering in an optical waveguide at an operating wavelength is controlled by adjusting an optical phase of light propagating in the waveguide at one or more locations along the waveguide. A portion of the back scattered light is tapped off near an input port and coupled into a photodetector. A controller detects changes in the photodetector signal and adjusts an optical phase tuner configured to control the optical phase of light in the waveguide at the selected location or locations. The optical phase tuner may be configured to vary the refractive index of at least a portion of the waveguide.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: September 10, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Thomas Wetteland Baehr-Jones, Matthew Akio Streshinsky, Yang Liu, Michael J. Hochberg, Ran Ding, Alexei Tager
  • Bias control of optical modulators
    Patent number: 10401655
    Abstract: An optical waveguide modulator with automatic bias control is disclosed. A portion of the modulator light is mixed with reference light and converted to one or more electrical feedback signals. An electrical feedback circuit controls the modulator bias responsive to the feedback signals.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: September 3, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Matthew Akio Streshinsky, Ari Novack, Kishore Padmaraju, Michael J. Hochberg, Alexander Rylyakov
  • INTEGRATED ON-CHIP POLARIZER
    Publication number: 20190258002
    Abstract: A low loss high extinction ratio on-chip polarizer is disclosed. The polarizer includes an input waveguide taper having an outer waveguiding region that widens in the direction of light propagation along at least a portion of the taper length, and a core waveguiding region that narrows in the direction of light propagation along at least a portion of the taper length, so as to selectively squeeze out light of undesired modes into the outer regions while preserving light of a desired mode in the waveguide core. An integrated light absorber/deflector may be coupled to the outer waveguiding regions.
    Type: Application
    Filed: March 14, 2019
    Publication date: August 22, 2019
    Inventors: Ruizhi Shi, Thomas Wetteland Baehr-Jones, Yangjin Ma, Yang Liu, Michael J. Hochberg, Matthew Akio Streshinsky
  • BACK END OF LINE PROCESS INTEGRATED OPTICAL DEVICE FABRICATION
    Publication number: 20190258005
    Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 22, 2019
    Inventors: Ruizhi Shi, Michael J. Hochberg, Ari Jason Novack, Thomas Wetteland Baehr-Jones
  • DISTRIBUTED TRAVELLING-WAVE MACH-ZEHNDER MODULATOR DRIVER
    Publication number: 20190253149
    Abstract: A distributed traveling-wave Mach-Zehnder modulator driver having a plurality of modulation stages that operate cooperatively (in-phase) to provide a signal suitable for use in a 100 Gb/s optical fiber transmitter at power levels that are compatible with conventional semiconductor devices and conventional semiconductor processing is described.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 15, 2019
    Inventors: Ran Ding, Thomas Wetteland Baehr-Jones, Michael J. Hochberg, Alexander Rylyakov
  • PHOTONIC CHIP WITH AN INPUT WAVELENGTH FILTER
    Publication number: 20190227230
    Abstract: A photonic chip includes a device layer and a port layer, with an optical port located at the port layer. Inter-layer optical couplers are provided for coupling light between the device and port layers. The inter-layer couplers may be configured to couple signal light but block pump light or other undesired wavelength from entering the device layer, operating as an input filter. The port layer may accommodate other light pre-processing functions, such as optical power splitting, that are undesirable in the device layer.
    Type: Application
    Filed: January 19, 2018
    Publication date: July 25, 2019
    Inventors: Ari Novack, Ruizhi Shi, Alexandre Horth, Ran Ding, Michael J. Hochberg
  • Test systems and methods for chips in wafer scale photonic systems
    Patent number: 10359567
    Abstract: A qualification apparatus for a photonic chip on a wafer that leaves undisturbed an edge coupler that provides an operating port for the photonic devices or circuits on the chip during normal operation in order to not introduce extra loss in the optical path of the final circuit. The qualification apparatus provides an optical path that is angled with regard to the surface of the chip, for example by using a grating coupler. The qualification apparatus can be removed after the chip is qualified. Optionally, the qualification apparatus can be left in communication with the chip and optionally employed as an input port for the chip after the chip has been separated from other chips on a common substrate.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: July 23, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Ari Novack, Matthew Akio Streshinsky, Michael J. Hochberg
  • MULTI-MODE INTERFERENCE COUPLER
    Publication number: 20190219767
    Abstract: A multimode interference (MMI) coupler with an MMI region of curved edges, and a method of design and manufacturing by using a computerized optimization algorithm to determine a favorable set of segment widths for the MMI region for a predefined set of coupler design parameters.
    Type: Application
    Filed: March 27, 2019
    Publication date: July 18, 2019
    Inventors: Yangjin Ma, Michael J. Hochberg
  • BENT TAPER AND POLARIZATION ROTATOR
    Publication number: 20190212494
    Abstract: A bent taper is provided that includes one or more waveguide bends, at least one of which has a tapering waveguide width along at least a portion thereof. In one embodiment, the bent taper is an S-shaped bent taper that is configured as a TE0-TE1 mode convertor. Such a bent taper can be combined with a linear bi-layer taper configured as a TM0-TE1 mode converter to form a TM0-TE0 polarization rotator.
    Type: Application
    Filed: March 19, 2019
    Publication date: July 11, 2019
    Inventors: Yangjin Ma, Michael J. Hochberg
  • SEMICONDUCTOR LASER
    Publication number: 20190181612
    Abstract: A hybrid single or multi-wavelength laser using an optical gain element, such as a semiconductor optical amplifier (SOA), for example a QD RSOA, and a semiconductor, e.g. silicon, photonics chip is demonstrated. A plurality, e.g. four, lasing modes at a predetermined, e.g. 2 nm, spacing and less than 3 dB power non-uniformity may be observed, with over 20 mW of total output power. Each lasing peak can be successfully modulated at 10 Gb/s. At 10?9 BER, the receiver power penalty is less than 2.6 dB compared to a conventional commercial laser. An expected application is the provision of a comb laser source for WDM transmission in optical interconnection systems.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 13, 2019
    Applicant: Elenion Technologies, LLC
    Inventors: Yi Zhang, Shuyu Yang, Michael J. Hochberg, Thomas Wetteland Baehr-Jones, Saeed Fathololoumi
  • OPTICALLY ALIGNED HYBRID SEMICONDUCTOR DEVICE AND METHOD
    Publication number: 20190179091
    Abstract: Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.
    Type: Application
    Filed: January 16, 2019
    Publication date: June 13, 2019
    Inventors: David Henry Kinghorn, Ari Jason Novack, Holger N. Klein, Nathan A. Nuttall, Kishor V. Desai, Daniel J. Blumenthal, Michael J. Hochberg, Ruizhi Shi
  • OPTICAL LINK ARCHITECTURE BASED ON WIRELINE EQUALIZATION TECHNIQUES
    Publication number: 20190181958
    Abstract: A high data rate, high sensitivity, low power optical link using low-bandwidth components and low-bandwidth E/O drivers and receivers and method of building same. The method is based on the idea of making the optical part of the link look like a bandwidth limited lossy electrical channel, so that the powerful equalization methods used in the wireline electrical links can be applied to recover the transmitted data in a situation with low bandwidth and/or high loss and strong inter-symbol interference. Linear and non-linear optical channel components, E/O drivers and receivers can benefit from the apparatus and the methods of the invention.
    Type: Application
    Filed: January 29, 2019
    Publication date: June 13, 2019
    Inventors: Alexander Rylyakov, Richard Younce, Ran Ding, Peter D. Magill, Hao Li, Michael J. Hochberg
  • Distributed traveling-wave Mach-Zehnder modulator driver
    Patent number: 10320488
    Abstract: A distributed traveling-wave Mach-Zehnder modulator driver having a plurality of modulation stages that operate cooperatively (in-phase) to provide a signal suitable for use in a 100 Gb/s optical fiber transmitter at power levels that are compatible with conventional semiconductor devices and conventional semiconductor processing is described.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: June 11, 2019
    Assignee: Elenion Technologies, LLC.
    Inventors: Ran Ding, Thomas Wetteland Baehr-Jones, Michael J. Hochberg, Alexander Rylyakov
  • Back end of line process integrated optical device fabrication
    Patent number: 10317623
    Abstract: An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: June 11, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Ruizhi Shi, Michael J. Hochberg, Ari Jason Novack, Thomas Wetteland Baehr-Jones
  • INTEGRATED ON-CHIP POLARIZER
    Publication number: 20190170940
    Abstract: A low loss high extinction ratio on-chip polarizer is disclosed. The polarizer is formed of a mode convertor followed by a mode squeezer and a dump waveguide, and may be configured to pass a desired waveguide mode and reject undesired modes. An embodiment is described that transmits a TE0 mode while blocking a TM0 mode by converting it into a higher-order TEn mode in a waveguide taper, squeezing out the TEn mode in a second waveguide taper to lessen its confinement, and then dumping the TEn mode in a waveguide bend that is configured to pass the TE0 mode.
    Type: Application
    Filed: January 15, 2019
    Publication date: June 6, 2019
    Inventors: Yangjin Ma, Michael J. Hochberg, Ruizhi Shi, Yang Liu
  • Multi-mode interference coupler
    Patent number: 10295748
    Abstract: A multimode interference (MMI) coupler with an MMI region of curved edges, and a method of design and manufacturing by using a computerized optimization algorithm to determine a favorable set of segment widths for the MMI region for a predefined set of coupler design parameters.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: May 21, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Yangjin Ma, Michael J. Hochberg
  • SHIELDED PHOTONIC INTEGRATED CIRCUIT
    Publication number: 20190137709
    Abstract: A light shield may be formed in photonic integrated circuit between integrated optical devices of the photonic integrated circuit. The light shield may be built by using materials already present in the photonic integrated circuit, for example the light shield may include metal walls and doped semiconductor regions. Light-emitting or light-sensitive integrated optical devices or modules of a photonic integrated circuit may be constructed with light shields integrally built in.
    Type: Application
    Filed: January 3, 2019
    Publication date: May 9, 2019
    Inventors: Ruizhi Shi, Yang Liu, Ari Novack, Yangjin Ma, Kishore Padmaraju, Michael J. Hochberg
  • Bent and tapered optical waveguide component for mode converter and polarization rotator
    Patent number: 10261255
    Abstract: A bent taper is provided that includes one or more waveguide bends, at least one of which has a tapering waveguide width along at least a portion thereof. In one embodiment, the bent taper is an S-shaped bent taper that is configured as a TE0-TE1 mode convertor. Such a bent taper can be combined with a linear bi-layer taper configured as a TM0-TE1 mode converter to form a TM0-TE0 polarization rotator.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: April 16, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Yangjin Ma, Michael J. Hochberg
  • Integrated on-chip polarizer
    Patent number: 10261254
    Abstract: A low loss high extinction ratio on-chip polarizer is disclosed. The polarizer includes an input waveguide taper having an outer waveguiding region that widens in the direction of light propagation along at least a portion of the taper length, and a core waveguiding region that narrows in the direction of light propagation along at least a portion of the taper length, so as to selectively squeeze out light of undesired modes into the outer regions while preserving light of a desired mode in the waveguide core. An integrated light absorber/deflector may be coupled to the outer waveguiding regions.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: April 16, 2019
    Assignee: Elenion Technologies, LLC
    Inventors: Ruizhi Shi, Thomas Wetteland Baehr-Jones, Yangjin Ma, Yang Liu, Michael J. Hochberg, Matthew Akio Streshinsky