Abstract: A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.

Abstract: An integrated circuit package is disclosed, of the type having a pin-fin heat sink attached to the surface. A flat plate is attached to the ends of the pins of the heat sink, to provide a planar surface area of adequate size to allow a vacuum pickup tool to pick and place the packaged integrated circuit, and to receive marking and symbolization.

Abstract: A packaged integrated circuit and method of manufacturing the same is disclosed. The semiconductor integrated circuit chip is mounted and bonded to a lead frame in the conventional fashion, and an inner molded body is formed therearound. The leads of the lead frame have inner and outer dambars, with the inner dambars located so as to prevent bleedout of mold compound during the molding of the inner body. Upon removal of the inner dambars, two tie bars become floating and are then formed to extend above the inner molded body so as to make contact to an electrochemical cell that is attached to the inner molded body. An outer body is then molded to surround the inner molded body and the cell, with the outer dambars located so as to prevent bleedout of mold compound. Removal of the outer dambars and formation of the leads into the desired shape completes the assembly of the packaged integrated circuit.

Abstract: An integrated circuit package of the surface-mountable type within which a battery is mounted is disclosed. Battery leads extend from the side of the package body opposite that which is adjacent the circuit board when mounted, and between which a conventional battery may be placed. Standoffs are located on the package body for supporting the battery above the package body, so that a gap is present therebetween. A housing is attached to the package over the battery, and has standoffs attached to its inner surface so that a gap is also present between the housing and the battery. The gaps may be air gaps or filled with a low thermal conductivity material. The gaps thermally insulate the battery from the package body and housing, so that the circuit may be subjected to solder reflow mounting to a circuit board, while insulating the high temperatures from the battery.

Abstract: A molded device package supports a volatile memory chip and a replaceable backup battery for preserving data in the event of loss of main power supply. The package includes an external socket for receiving a replaceable backup battery which can be manually inserted into or removed from the socket after molding encapsulation and metal trim work have been completed. The socket is intersected by an exposure cavity which permits the positive and negative terminals of a backup battery to engage positive and negative finger leads. The positive and negative battery terminals are engaged by resilient terminal contact portions of the positive and negative finger leads which project into the exposure cavity. Socket shoulder portions and a retainer cap hold a backup battery within the socket and in electrical contact with the resilient terminal contact portions.

Abstract: A premolded battery package supports a volatile memory chip and a replaceable backup battery for preserving data in the event of loss of main power supply. The package includes an integrally formed external socket for receiving a replaceable backup battery which can be manually inserted into or removed from the socket after molding encapsulation and metal trim work have been completed. The socket assembly includes an interface battery cavity which permits the negative terminal of a backup battery to engage a negative power finger lead. The positive battery terminal is engaged by a resilient terminal contact portion of a positive finger lead which projects externally of the molded package. The terminal contact portion of the positive power lead serves as a retainer in combination with socket shoulder portions for retaining the backup battery within the socket.

Abstract: A circuit assembly includes a finger lead assembly having structure for supporting an interposer substrate assembly and an electronic circuit device, the substrate assembly having conductive elements for providing electrical connection between finger leads of the lead assembly and respective circuit sections within the circuit device. The circuit device is mounted proximate to an upper surface of the substrate assembly. At least one decoupling capacitor is mounted on a lower surface of the substrate assembly at a level below that of the finger leads and electrically connected, through circuitry within the substrate assembly including inter-level via connectors, to respective circuits within the circuit device.

Abstract: An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.

Abstract: An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.