Abstract: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad.

Abstract: Methods and apparatus for producing a semiconductor on glass (SiOG) structure include: subjecting an implantation surface of a donor semiconductor wafer to an ion implantation process to create an exfoliation layer in the donor semiconductor wafer; bonding the implantation surface of the exfoliation layer to a glass substrate using electrolysis; separating the exfoliation layer from the donor semiconductor wafer, thereby exposing at least one cleaved surface; and subjecting the at least one cleaved surface to a wet etching process.

Abstract: The present invention is directed to a draw jet for drawing thermoplastic polymer filaments including a drawing slot defined by an entrance member including a converging passageway communicating with a continuing passageway, terminating at an outlet portion, a drawing member including an inlet portion having a drawing gap width of about 2.0 to about 10 mm communicating with the outlet portion of the entrance member, and at least one air nozzle for directing high speed air onto the filaments in a downstream direction positioned between the outlet portion of the entrance member and the inlet portion of the drawing member, and with a nozzle gap width wherein the gap ratio of the drawing gap width to the combined width of all of the nozzle gaps is from about 1.0 to about 10.

Abstract: The present invention is directed to a draw jet for drawing thermoplastic polymer filaments comprising a drawing slot defined by an entrance member comprising a converging passageway communicating with a continuing passageway, terminating at an outlet portion, a drawing member comprising an inlet portion having a drawing gap width of about 2.0 to about 10 mm communicating with said outlet portion of said entrance member, and at least one air nozzle for directing high speed air onto said filaments in a downstream direction positioned between said outlet portion of said entrance member and said inlet portion of said drawing member, and with a nozzle gap width wherein the gap ratio of said drawing gap width to the combined width of all of said nozzle gaps is from about 1.0 to about 10.