Abstract: A process for producing a hybrid structured surface, including depositing, on a substrate, a layer of mineral resin including a proportion of Si and/or of SiO2 includes between 1% and 30% by molar mass; forming a structure including a plurality of pattern motifs in that layer, having at least one dimension, measured parallel or perpendicular to the substrate, includes between 50 nm and 500 ?m; forming a roughness on at least part of the surface of the pattern motifs.

Abstract: A method for producing an individualisation area includes providing at least a first level of the electrical tracks. The method includes depositing a dielectric layer and a deformable layer on the interconnection level. The method includes producing, in an area of the deformable layer, recessed patterns, by penetrating an imprint mould into the deformable layer, the production of the patterns being configured so that the patterns have a randomness in the deformable layer, thus forming random patterns. The method includes transferring the random patterns into the dielectric layer to form transferred random patterns therein and exposing the vias located in line with the transferred random patterns. The method includes filling the transferred random patterns with an electrically conductive material so as to form electrical connections between vias. The method includes producing a second level of the electrical tracks on the vias and the electrical connections.

Abstract: Systems and techniques may be used for providing artificial intelligence regarding orthopedic patients. A technique may include using sensor data generated over a period of time by a patient an input to a machine learning model. The machine learning model may be trained based on labeled sensor data and labeled outcome data. The machine learning model may generate a predicted outcome for the patient. The technique may include output at least one medical intervention recommendation based on the predicted outcome.

Abstract: Disclosed is a method of delivering a product comprising receiving from a user device, an order, a preferred delivery location, and a user device location, assigning the order a preparation time, receiving an updated user device location at predetermined intervals, using the user device location and order preparation time, placing the order in a production queue to be prepared for delivery, determining if the user device is at the preferred delivery location, when the user device is at the preferred delivery location, delivering the order.

Abstract: The invention relates to a method for visualizing the automation of a drive system for a technical system, wherein the technical system consists of a plurality of modules. Module type data objects that are assigned to module types are stored in a data storage device, wherein the module type data objects include a graphical representation of the module type data relating to the particular module types. First, the module types of the modules of which the technical system is composed are selected by a user via a user interface. Module data objects assigned to the modules are generated by means of a data processing device, which module data objects contain module data, wherein the module data contain data relating to the graphical representation of the module type of each module, and wherein a data processing device generates a visualization of the assembled technical system based on the module data, which visualization is presented to the user by means of a visualization device, in particular a display.

Abstract: A method for producing a plurality of chips each comprising an individualisation region, each chip comprising at least: a first and a second level of the electrical tracks, and an interconnections level comprising vias. The method includes producing on the dielectric layer covering the first level a mask having openings located in line with the electrical tracks and making the dielectric layer accessible. The method includes producing, in a region of the chip comprising the individualisation region, patterns conformed so that: first openings of the hard mask are not masked by the patterns, and second openings of the hard mask are masked by the patterns. The method includes producing via openings in the dielectric layer in line solely with the first openings. The method further includes filling in the via openings with an electrically conductive material, and producing the second level of the electrical tracks on the vias.

Abstract: A method for producing an individualisation area includes providing at least a first level of the electrical tracks. The method includes depositing a dielectric layer and a deformable layer on the interconnection level. The method includes producing, in an area of the deformable layer, recessed patterns, by penetrating an imprint mould into the deformable layer, the production of the patterns being configured so that the patterns have a randomness in the deformable layer, thus forming random patterns. The method includes transferring the random patterns into the dielectric layer to form transferred random patterns therein and exposing the vias located in line with the transferred random patterns. The method includes filling the transferred random patterns with an electrically conductive material so as to form electrical connections between vias. The method includes producing a second level of the electrical tracks on the vias and the electrical connections.

Abstract: The invention relates to a method of securing an integrated circuit during its fabrication on a wafer, said method including the following steps: delimitation of said wafer of the integrated circuit (1) into a first zone called a standard zone (5a) and a second zone called a security zone (5b), and creation of a random connection tracks network (7b) in said security zone (5b) configured to interconnect a set of conducting nodes (9b) thus forming a physical unclonable function modelled by random electrical continuity that can be queried through said set of conducting nodes using a challenge-response authentication protocol.

Abstract: An integrated circuit and a method of securing the integrated circuit during its fabrication. The method includes delimitation of the integrated circuit into a first zone called a standard zone and a second zone called a security zone, and random degradation of an interconnection structure of the security zone thus forming a physical unclonable function modelled by random electrical continuity that can be queried by a challenge-response authentication protocol.

Abstract: The present invention provides antibodies and antibody-drug conjugates that bind to the extra domain B splice variant of fibronectin 1 and methods for preparing and using the same.

Abstract: Assembling jig for mounting panel structure elements onto a surface of a CFRP-panel, comprising a base frame on which several positioning boards are transversely attached, which are parallel arranged one to another for supporting the CFRP-panel on an upper mounting surface, wherein the base frame comprises at least one metal bar for coupling the positioning boards consisting of a material having a thermal expansion coefficient which corresponds to the thermal expansion coefficient of the CFRP-material of the panel in order to provide a tolerance compensation system in at least longitudinal direction of the base frame.

Abstract: A self-guided geosteering assembly having an on-board, automated guidance system that incorporates a detailed subsurface earth model and well path to geosteer the assembly along a formation. While advancing along the formation, the guidance system continually monitors data related to formation characteristics and the formation/tool location, compares the data to the earth model and well path, and adjusts the direction of the assembly accordingly. In addition, the data may be utilized to update the earth model in real-time.

Abstract: An optical connector having at least one removable integrated assembly tool for terminating an optical fiber cable is described. The connector comprises a housing configured to mate with a receptacle, a collar body disposed in the housing, a backbone that retains the collar body in the housing, a removable funnel-shaped and a fiber boot. The collar body secures a ferrule secured at a first end thereof, and includes mechanical element disposed in an intermediate portion and a buffer clamping portion near a second end of the collar body. The backbone has a mounting structure surrounding a central bore at one end. The funnel-shaped fiber guide attaches to the mounting structure to facilitate insertion of an optical fiber into the connector, and wherein the fiber boot is attachable to the mounting structure after the fiber guide has been removed.

Abstract: The invention relates to a method of securing an integrated circuit during its fabrication on a wafer, said method including the following steps: delimitation of said wafer of the integrated circuit (1) into a first zone called a standard zone (5a) and a second zone called a security zone (5b), and creation of a random connection tracks network (7b) in said security zone (5b) configured to interconnect a set of conducting nodes (9b) thus forming a physical unclonable function modelled by random electrical continuity that can be queried through said set of conducting nodes using a challenge-response authentication protocol.

Abstract: An integrated circuit and a method of securing the integrated circuit during its fabrication. The method includes delimitation of the integrated circuit into a first zone called a standard zone and a second zone called a security zone, and random degradation of an interconnection structure of the security zone thus forming a physical unclonable function modelled by random electrical continuity that can be queried by a challenge-response authentication protocol.

Abstract: Bispecific heterodimeric diabody molecules and uses thereof in the treatment of cancer. The bispecific heterodimeric diabody molecules comprise two polypeptide chains that associate to form two epitope binding sites recognizing the P-cadherin tumor cell associated antigen and the CD3 T cell antigen.

Abstract: An optical connector having at least one removable integrated assembly tool for terminating an optical fiber cable is described. The connector comprises a housing configured to mate with a receptacle, a collar body disposed in the housing, a backbone that retains the collar body in the housing, a removable funnel-shaped and a fiber boot. The collar body secures a ferrule secured at a first end thereof, and includes mechanical element disposed in an intermediate portion and a buffer clamping portion near a second end of the collar body. The backbone has a mounting structure surrounding a central bore at one end. The funnel-shaped fiber guide attaches to the mounting structure to facilitate insertion of an optical fiber into the connector, and wherein the fiber boot is attachable to the mounting structure after the fiber guide has been removed.

Abstract: A mixer-sparger assembly includes a first body portion; a second body portion; a gasket positioned between the first and second body portions to form a seal between the two body portions; an inlet disposed in the first body portion; a flexible tube connected to the inlet; a fluid chamber disposed in the first body portion or the second body portion and in fluidic communication with the inlet; an outlet disposed in the first body portion or the second body portion and in fluidic communication with the fluid chamber; and a plurality of supports extending downwardly from the second body portion to form a self-standing assembly with a space disposed below the second body portion. The first and second body portions have a density greater than about 1.0 g/cm3, and the inlet, fluid chamber, and outlet in spatial combination are configured to have an axis of rotational symmetry.

Abstract: Bispecific heterodimeric diabody molecules and uses thereof in the treatment of cancer. The bispecific heterodimeric diabody molecules comprise two polypeptide chains that associate to form two epitope binding sites recognizing the P-cadherin tumor cell associated antigen and the CD3 T cell antigen.

Abstract: A pharmaceutical composition for use as medicament that inhibits autocrine Human Chorionic Gonadotropin (HCG) production and thus carcinogenesis in adult human cells, the composition comprising at least a first pharmaceutically acceptable carrier and an active agent that is a competitively binding progesterone antagonist binding to steroid receptors of human cells, wherein the composition is provided in units designed for the monthly, semi-annual or annual application of the active agent in annual dosages in the range between 0.1 mg to 10.0 mg per kg of person/body-weight.