Patents by Inventor Michael Raymond Weatherspoon
Michael Raymond Weatherspoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8904632Abstract: A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.Type: GrantFiled: September 23, 2011Date of Patent: December 9, 2014Assignee: Harris CorporationInventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Lawrence Wayne Shacklette, Casey P. Rodriguez
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Patent number: 8877558Abstract: A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a coverlay layer on the substrate and the electrically conductive pattern, forming a partially cured, tacky adhesive layer on the coverlay layer, and forming openings in the coverlay layer and the partially cured, tacky adhesive layer aligned with the electrically conductive pattern. The method includes positioning an IC on the partially cured, tacky adhesive layer and thereafter curing the partially cured tacky adhesive layer to thereby simultaneously mechanically secure and electrically interconnect the IC to the substrate, the IC having bond pads on a surface thereof.Type: GrantFiled: February 7, 2013Date of Patent: November 4, 2014Assignee: Harris CorporationInventors: Andrew Craig King, Michael Raymond Weatherspoon, Louis J. Rendek, Jr.
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Publication number: 20140217618Abstract: A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a coverlay layer on the substrate and the electrically conductive pattern, forming a partially cured, tacky adhesive layer on the coverlay layer, and forming openings in the coverlay layer and the partially cured, tacky adhesive layer aligned with the electrically conductive pattern. The method includes positioning an IC on the partially cured, tacky adhesive layer and thereafter curing the partially cured tacky adhesive layer to thereby simultaneously mechanically secure and electrically interconnect the IC to the substrate, the IC having bond pads on a surface thereof.Type: ApplicationFiled: February 7, 2013Publication date: August 7, 2014Applicant: Harris CorporationInventors: Andrew Craig KING, Michael Raymond Weatherspoon, Louis J. Rendek, JR.
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Publication number: 20140138849Abstract: A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.Type: ApplicationFiled: January 24, 2014Publication date: May 22, 2014Inventors: LOUIS JOSEPH RENDEK, JR., MICHAEL RAYMOND WEATHERSPOON, CASEY PHILIP RODRIGUEZ, DAVID NICOL
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Patent number: 8708576Abstract: An electro-optical device may include a substrate having opposing first and second surfaces and an opening extending therebetween. The optical device may also include an optical waveguide extending laterally along the first surface and having an end aligned with the opening, and an electro-optical component carried by the second surface and aligned with the opening. The electro-optical device may further include an elastomeric body within the opening and having a first end face adjacent the optical waveguide and having a second end face adjacent the electro-optical component. The elastomeric body and the optical waveguide may have respective gradient refraction indices within ±5% of each other.Type: GrantFiled: January 20, 2011Date of Patent: April 29, 2014Assignee: Harris CorporationInventors: Lawrence Wayne Shacklette, Michael Ray Lange, Michael Raymond Weatherspoon, Gary M. Singer
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Publication number: 20130335183Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.Type: ApplicationFiled: August 21, 2013Publication date: December 19, 2013Applicant: Harris CorporationInventors: MICHAEL RAYMOND WEATHERSPOON, LOUIS JOSEPH RENDEK, JR., LAWRENCE WAYNE SHACKLETTE, ROBERT PATRICK MALONEY, DAVID M. SMITH
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Patent number: 8559774Abstract: An optical device may include a substrate and an optical waveguide carried by the substrate and having a notch therein defining a feed optical waveguide and a longitudinal optical waveguide section on opposite longitudinal sides of the notch. The optical device may also include a transverse optical waveguide section carried by the substrate and transversely aligned with the feed optical waveguide adjacent the notch. The optical device may further include an elastomeric waveguide switch body configured to be moved between a first position within the notch and operative to switch light from the feed optical waveguide to the longitudinal optical waveguide section, and a second position removed from the notch and operative to switch light from the optical waveguide to the transverse optical waveguide section.Type: GrantFiled: March 31, 2011Date of Patent: October 15, 2013Assignee: Harris CorporationInventors: Lawrence Wayne Shacklette, Glenroy Weimar, Michael Raymond Weatherspoon
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Patent number: 8539666Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.Type: GrantFiled: November 10, 2011Date of Patent: September 24, 2013Assignee: Harris CorporationInventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, Jr., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
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Publication number: 20130120095Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.Type: ApplicationFiled: November 10, 2011Publication date: May 16, 2013Applicant: Harris CorporationInventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, JR., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
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Publication number: 20130087365Abstract: A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.Type: ApplicationFiled: October 5, 2011Publication date: April 11, 2013Applicant: Harris CorporationInventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, JR., Lawrence Wayne Shacklette, Robert Patrick Maloney, David M. Smith
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Publication number: 20130075137Abstract: A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.Type: ApplicationFiled: September 23, 2011Publication date: March 28, 2013Applicant: Harris Corporation, Corporation of the State of DelawareInventors: Michael Raymond Weatherspoon, Louis Joseph Rendek, JR., Lawrence Wayne Shacklette, Casey P. Rodriguez
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Publication number: 20120251043Abstract: An optical device may include a substrate and an optical waveguide carried by the substrate and having a notch therein defining a feed optical waveguide and a longitudinal optical waveguide section on opposite longitudinal sides of the notch. The optical device may also include a transverse optical waveguide section carried by the substrate and transversely aligned with the feed optical waveguide adjacent the notch. The optical device may further include an elastomeric waveguide switch body configured to be moved between a first position within the notch and operative to switch light from the feed optical waveguide to the longitudinal optical waveguide section, and a second position removed from the notch and operative to switch light from the optical waveguide to the transverse optical waveguide section.Type: ApplicationFiled: March 31, 2011Publication date: October 4, 2012Applicant: Harris CorporationInventors: Lawrence Wayne Shacklette, Glenroy Weimar, Michael Raymond Weatherspoon
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Patent number: 8231281Abstract: A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The interconnection may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face, and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction profile matching an index of refraction of the core and the cladding.Type: GrantFiled: November 2, 2009Date of Patent: July 31, 2012Assignee: Harris CorporationInventors: Lawrence Wayne Shacklette, Michael Raymond Weatherspoon
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Publication number: 20120189253Abstract: An electro-optical device may include a substrate having opposing first and second surfaces and an opening extending therebetween. The optical device may also include an optical waveguide extending laterally along the first surface and having an end aligned with the opening, and an electro-optical component carried by the second surface and aligned with the opening. The electro-optical device may further include an elastomeric body within the opening and having a first end face adjacent the optical waveguide and having a second end face adjacent the electro-optical component. The elastomeric body and the optical waveguide may have respective gradient refraction indices within ±5% of each other.Type: ApplicationFiled: January 20, 2011Publication date: July 26, 2012Applicant: Harris CorporationInventors: Lawrence Wayne Shacklette, Michael Ray Lange, Michael Raymond Weatherspoon, Gary M. Singer
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Patent number: 8137001Abstract: A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The repeatable optical waveguide interconnection may further include a first index matching elastomeric solid layer having a proximal face chemically bound to the first end face and a low-tack distal face opposite the proximal face to be repeatably optically coupled to the second end face. Further, the first index matching elastomeric solid layer may have an index of refraction matching at least the index of refraction of the core.Type: GrantFiled: November 2, 2009Date of Patent: March 20, 2012Assignee: Harris CorporationInventors: Lawrence Wayne Shacklette, Michael Raymond Weatherspoon
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Publication number: 20110103745Abstract: A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The repeatable optical waveguide interconnection may further include a first index matching elastomeric solid layer having a proximal face chemically bound to the first end face and a low-tack distal face opposite the proximal face to be repeatably optically coupled to the second end face. Further, the first index matching elastomeric solid layer may have an index of refraction matching at least the index of refraction of the core.Type: ApplicationFiled: November 2, 2009Publication date: May 5, 2011Applicant: Harris CorporationInventors: Lawrence Wayne Shacklette, Michael Raymond Weatherspoon
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Publication number: 20110104388Abstract: A method for making an optical device may include applying at least one precursor for a curable index matching elastomeric solid layer onto an end face of an optical waveguide device. The optical waveguide device may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The method may further include curing the at least one precursor to form the index matching elastomeric solid layer on the end face to have an index of refraction matching the index of refraction of at least the core.Type: ApplicationFiled: November 2, 2009Publication date: May 5, 2011Applicant: Harris CorporationInventors: Lawrence Wayne Shacklette, Michael Raymond Weatherspoon
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Publication number: 20110103746Abstract: A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The interconnection may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face, and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction profile matching an index of refraction of the core and the cladding.Type: ApplicationFiled: November 2, 2009Publication date: May 5, 2011Applicant: Harris Corporation, Corporation of the State of DelawareInventors: Lawrence Wayne Shacklette, Michael Raymond Weatherspoon