Patents by Inventor Michael T. Marczi

Michael T. Marczi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLVENT SYSTEMS FOR METALS AND INKS
    Publication number: 20140186524
    Abstract: Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.
    Type: Application
    Filed: December 3, 2013
    Publication date: July 3, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Oscar Khaselev, Michael T. Marczi, Bawa Singh, Nitin Desai
  • METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
    Publication number: 20140153203
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Application
    Filed: September 16, 2013
    Publication date: June 5, 2014
    Applicant: ALPHA METALS, INC.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • Solvent systems for metals and inks
    Patent number: 8597548
    Abstract: Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: December 3, 2013
    Assignee: Alpha Metals, Inc.
    Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
  • Methods of attaching a die to a substrate
    Patent number: 8555491
    Abstract: Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: October 15, 2013
    Assignee: Alpha Metals, Inc.
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • Methods for producing electrical conductors
    Patent number: 8312623
    Abstract: A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: November 20, 2012
    Assignee: Fry's Metals, Inc.
    Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
  • Electrical conductors and methods of making and using them
    Patent number: 8304062
    Abstract: Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: November 6, 2012
    Assignee: Fry's Metals, Inc.
    Inventors: Oscar Khaselev, Nitin Desai, Supriya Deverajen, Michael T. Marczi, Bawa Singh
  • SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME
    Publication number: 20120114927
    Abstract: Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
    Type: Application
    Filed: November 2, 2011
    Publication date: May 10, 2012
    Inventors: Oscar Khaselev, Bawa Singh, Bin Mo, Michael T. Marczi, Monnir Boureghda
  • PARTICLES AND INKS AND FILMS USING THEM
    Publication number: 20110318478
    Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 29, 2011
    Inventors: Sachin Parashar, Siuli Sarkar, Oscar Khaselev, Brian G. Lewis, Michael T. Marczi, Bawa Singh, Nitin Desai, Michael Liberatore
  • Particles and inks and films using them
    Patent number: 7968008
    Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: June 28, 2011
    Assignee: Fry's Metals, Inc.
    Inventors: Sachin Parashar, Siuli Sarkar, Oscar Khaselev, Brian G. Lewis, Michael T. Marczi, Bawa Singh, Nitin Desai, Michael Liberatore
  • FLUX FORMULATIONS
    Publication number: 20100139952
    Abstract: Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.
    Type: Application
    Filed: July 2, 2009
    Publication date: June 10, 2010
    Inventors: Sanyogita Arora, Martinus N. Finke, Bawa Singh, Brian Lewis, Michael T. Marczi, Mitchell Holtzer
  • ELECTRICAL CONDUCTORS AND METHODS OF MAKING AND USING THEM
    Publication number: 20090061169
    Abstract: Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.
    Type: Application
    Filed: July 17, 2008
    Publication date: March 5, 2009
    Inventors: Oscar Khaselev, Nitin Desai, Supriya Deverajan, Michael T. Marczi, Bawa Singh
  • METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
    Publication number: 20090025967
    Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 29, 2009
    Inventors: Monnir Boureghda, Nitin Desai, Anna Lifton, Oscar Khaselev, Michael T. Marczi, Bawa Singh
  • ELECTRICAL CONTACTS
    Publication number: 20080245765
    Abstract: Certain embodiments are directed to methods, devices and systems designed to remove selected portions of a material to expose an underlying material or substrate. One or more electrical components may be coupled to the underlying substrate through an electrical contact. Kits and systems for producing electrical contacts are also provided.
    Type: Application
    Filed: March 20, 2008
    Publication date: October 9, 2008
    Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
  • DEVICES AND METHODS FOR PRODUCING ELECTRICAL CONDUCTORS
    Publication number: 20080236874
    Abstract: A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed.
    Type: Application
    Filed: March 20, 2008
    Publication date: October 2, 2008
    Inventors: Oscar Khaselev, Nitin Desai, Michael T Marczi, Bawa Singh
  • MATERIALS FOR USE WITH INTERCONNECTS OF ELECTRICAL DEVICES AND RELATED METHODS
    Publication number: 20080173698
    Abstract: Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
    Type: Application
    Filed: October 17, 2007
    Publication date: July 24, 2008
    Inventors: Michael T. Marczi, Paul Koep, Michel A. de Monchy, Martinus N. Finke, Brian Lewis
  • SOLVENT SYSTEMS FOR METALS AND INKS
    Publication number: 20080145560
    Abstract: Solvent systems and dispersions including such solvent systems for use in compositions including metals and inks are provided. In certain examples, the solvent systems may be used with capped metal particles to provide a dispersion that may be used to print conductive lines.
    Type: Application
    Filed: September 19, 2007
    Publication date: June 19, 2008
    Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
  • Methods of preparation of hollow microstructures and nanostructures
    Patent number: 7387813
    Abstract: Structures in the nanoscale and mesoscale domain are provided. The structures typically have a shell which can be comprised of a porous polymeric material such as parylene. The surfaces of the shell can further comprise pendant functional groups that can provide reactive or passive characteristics.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: June 17, 2008
    Assignee: Specialty Coating Systems, Inc.
    Inventors: Rakesh Kumar, Bawa Singh, Brian G. Lewis, Michael T. Marczi
  • CONDUCTIVE PATTERNS AND METHODS OF USING THEM
    Publication number: 20080137316
    Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
    Type: Application
    Filed: September 19, 2007
    Publication date: June 12, 2008
    Inventors: Oscar Khaselev, Nitin Desai, Michael T. Marczi, Bawa Singh
  • PARTICLES AND INKS AND FILMS USING THEM
    Publication number: 20080032047
    Abstract: Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
    Type: Application
    Filed: August 3, 2006
    Publication date: February 7, 2008
    Inventors: Sachin Parashar, Siuli Sarkar, Oscar Khaselev, Brian G. Lewis, Michael T. Marczi, Bawa Singh, Nitin Desai, Michael Liberatore