Abstract: Provided is a method for charging, with ceramic, open pores formed in a matrix of a ceramic matrix composite that includes the matrix and reinforcing fibers provided in the matrix. The ceramic comes to constitute the matrix. The method includes repeating the following steps (A) and (B) in a state where the ceramic matrix composite is arranged in a liquid material serving as a matrix material. At the step (A), the ceramic matrix composite is heated such that the liquid material is brought into a film-boiling state, and the ceramic derived from the liquid material is thereby generated in the open pores. At the step (B), the ceramic matrix composite is cooled until a temperature of the ceramic matrix composite becomes lower than a boiling point of the liquid material.

Abstract: An immersion tank includes a tank main body that includes a storage unit that stores a cooling liquid in which an electronic device is immersed, an upper part of the storage unit having an opening, a lid body that includes a top wall portion and a side wall portion, and is paired with the tank main body, and a gas-phase heat exchanger that cools a space between the storage unit and the top wall portion.

Abstract: An immersion tank includes a tank main body that includes a storage unit that stores a cooling liquid in which an electronic device is immersed, an upper part of the storage unit having an opening, a lid body that includes a top wall portion and a side wall portion, and is paired with the tank main body, and a gas-phase heat exchanger that cools a space between the storage unit and the top wall portion.

Abstract: A semiconductor device includes a semiconductor chip; a heat transfer plate joined to an upper surface of the semiconductor chip; a first adhesive material provided on an upper surface of the heat transfer plate; a radiator whose lower surface is joined to the upper surface of the heat transfer plate via the first adhesive material; a second adhesive material that is provided on an outer peripheral surface of the heat transfer plate, and joins the upper surface of the semiconductor chip and the lower surface of the radiator; and a groove that is formed on the lower surface of the radiator and extends along the outer peripheral surface of the heat transfer plate.

Abstract: An electronic device includes a housing filled with a liquid coolant, a first electronic device accommodated in the housing and immersed in the liquid coolant, a first heat sink provided with the first electronic device and exposed to the liquid coolant filled in the housing, a suction pipe configured to have an inlet that sucks the liquid coolant filled in the housing, a discharge pipe configured to have an outlet that faces the first heat sink via the liquid coolant filled in the housing and discharges the liquid coolant sucked from the inlet toward the first heat sink, and a pump provided in the housing to be coupled between the suction pipe and the discharge pipe, and configured to suck the liquid coolant from the inlet and discharge the liquid coolant from the outlet.

Abstract: An electronic apparatus includes a housing, a heating component arranged inside the housing, a plurality of heat sinks arranged inside the housing, a heat transport member coupled such that heat is transferred from the heating component to the heat sinks, air intake regions positioned in the housing, corresponding to the respective heat sinks, and arranged below and close to the respective heat sinks, and an air exhaust region positioned in the housing and arranged above the heat sinks.

Abstract: An electronic apparatus includes a case, an electronic part housed in the case, and a heat sink coupled to the electronic part and at least partially arranged outside a side wall of the case with a gap formed between an outer peripheral portion of the heat sink and the side wall of the case.

Abstract: An electronic device includes a housing filled with a liquid coolant, a first electronic device accommodated in the housing and immersed in the liquid coolant, a first heat sink provided with the first electronic device and exposed to the liquid coolant filled in the housing, a suction pipe configured to have an inlet that sucks the liquid coolant filled in the housing, a discharge pipe configured to have an outlet that faces the first heat sink via the liquid coolant filled in the housing and discharges the liquid coolant sucked from the inlet toward the first heat sink, and a pump provided in the housing to be coupled between the suction pipe and the discharge pipe, and configured to suck the liquid coolant from the inlet and discharge the liquid coolant from the outlet.

Abstract: A heat exchanger for liquid immersion cooling includes a first coolant stored in a tank capable of accommodating an electronic component, and configured to cool the electronic component by immersion, an introduction pipe into which a second coolant is introduced from outside of the tank, a discharge pipe from which the second coolant is discharged to outside of the tank, and a plurality of connection pipes coupled between the introduction pipe and the discharge pipe and configured to flow the second coolant from the introduction pipe to the discharge pipe, wherein the heat exchanger is immersed in the first coolant and accommodated in the tank.

Abstract: A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

Abstract: A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency.

Abstract: A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

Abstract: An electronic apparatus includes a case, an electronic part housed in the case, and a heat sink coupled to the electronic part and at least partially arranged outside a side wall of the case with a gap formed between an outer peripheral portion of the heat sink and the side wall of the case.

Abstract: A cooling device includes an immersion tank that stores a refrigerant liquid, and a cooling pipe that is disposed on a peripheral wall of the immersion tank, at least a portion of which is exposed from the peripheral wall to an inside of the immersion tank, and through which cooling water flows.

Abstract: An electronic apparatus includes a housing, a heating component arranged inside the housing, a plurality of heat sinks arranged inside the housing, a heat transport member coupled such that heat is transferred from the heating component to the heat sinks, air intake regions positioned in the housing, corresponding to the respective heat sinks, and arranged below and close to the respective heat sinks, and an air exhaust region positioned in the housing and arranged above the heat sinks.

Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.

Abstract: A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.

Abstract: An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

Abstract: An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.

Abstract: A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant to the plurality of pumps, a plurality of flow merging ports through which the coolant from the plurality of pumps merges, and a coolant outlet port; and a separating wall that is provided inside the casing and that separates the inside of the casing into a distribution chamber that is in communication with the inlet port and the branch ports, and a flow merging chamber that is in communication with the flow merging ports and the outlet port.