Patents by Inventor Michimasa Aoki

Michimasa Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080024978
    Abstract: An electronic apparatus includes an enclosure enclosing a liquid cooling unit. The liquid cooling unit includes a heat receiver received on an electronic component. Heat of the electronic component is transferred to the heat receiver. The heat of the heat receiver is transferred to the coolant flowing through the flow passage of the heat receiver. The electronic component gets cooled. The coolant flows into a tank in the liquid cooling unit. The tank stores the coolant and air. The air inlet is formed in the enclosure. Fresh air is introduced into the enclosure through the air inlet. Since the tank is opposed to the air inlet, the tank is exposed to the fresh air. The heat of the coolant in the tank is thus radiated into the air. The coolant gets cooled in an efficient manner. The efficiency of heat radiation is enhanced in this manner.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20080024987
    Abstract: A heat exchanger allows establishment of a flat space between first and second plates. The heat exchanger is inserted in a closed circulating loop for coolant. The flat space is allowed to have a cross-section larger than that of a cylindrical duct of the closed circulating loop. The flat space serves as a flow passage. An increased cross-section enables a reduction in the flow speed of the coolant. The coolant is allowed to slowly flow through the flat space. The coolant thus contacts with the first and second plates for a longer time. The heat of the coolant is sufficiently transferred to the first and second plates. The efficiency of heat radiation is enhanced.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20080023178
    Abstract: A heat exchanger allows establishment of first and second flat spaces, namely parallel flat spaces along a reference. The heat exchanger is inserted in a closed circulating loop for coolant. The first and second flat spaces have a cross-section larger than that of a cylindrical duct of the closed circulating loop. These flat spaces serve as a flow passage for the coolant. An increased cross-section enables a reduction in the flow speed of the coolant. The coolant is allowed to slowly flow through the first and second flat spaces. The coolant thus contacts with the first and second plates and the third and fourth plates for a longer time. The heat of the coolant is sufficiently transferred to the first and second plates and the third and fourth plates. The efficiency of heat radiation is enhanced.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20080024989
    Abstract: A heat receiver includes a casing defining a flow passage on a thermal conductive plate. The thermal conductive plate is received on an electronic component. An outflow nozzle has an inflow opening at the downstream end of the flow passage at a position outside the thermal conductive plate. Since the thermal conductive plate is received on the electronic component, the outflow nozzle is connected to the flow passage at a position outside the electronic component. This results in avoidance of increase in the thickness of the casing as compared with the case where the outflow nozzle directly extends into the flow passage on the thermal conductive plate.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Publication number: 20080024988
    Abstract: A heat receiver includes a casing defining a flow passage on a thermal conductive plate. The thermal conductive plate is received on an electronic component. The thermal conductive plate serves to transfer heat to coolant in the flow passage. At least two inflow nozzles extend into the casing to have discharge openings opposed to the upstream end of the flow passage. The coolant flows into the flow passage through the inflow nozzles. At least two streams of the coolant are thus generated in the flow passage. The streams widely expand or spread in the flow passage. The coolant flows through the flow passage without stagnating. The coolant can thus absorb the heat of the thermal conductive plate in an efficient manner. This results in an efficient heat absorption of the heat receiver.
    Type: Application
    Filed: July 25, 2007
    Publication date: January 31, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Masumi Suzuki, Michimasa Aoki, Yosuke Tsunoda, Masuo Ohnishi, Masahiko Hattori
  • Patent number: 7248473
    Abstract: An intake opening is defined in a printed circuit board inside a fan cover mounted on the printed circuit board. The intake opening has a particular extent inside the fan cover. This intake opening contributes to improvement in the cooling efficiency of a fan as compared with a conventional intake opening. Moreover, the intake opening allows a sufficient space to remain on the front and back surfaces of the printed circuit board inside the fan cover. Electronic components and/or wiring patterns may be disposed in the space. This contributes to disposition of electronic components and/or wiring patterns at a higher density on the printed circuit board.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: July 24, 2007
    Assignee: Fujitsu Limited
    Inventors: Masuo Ohnishi, Masumi Suzuki, Michimasa Aoki
  • Publication number: 20070139206
    Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.
    Type: Application
    Filed: February 9, 2007
    Publication date: June 21, 2007
    Inventors: Shunichi Kikuchi, Masumi Suzuki, Michimasa Aoki
  • Patent number: 7199718
    Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.
    Type: Grant
    Filed: March 22, 2005
    Date of Patent: April 3, 2007
    Assignee: Fujitsu Limited
    Inventors: Shunichi Kikuchi, Masumi Suzuki, Michimasa Aoki
  • Publication number: 20060145867
    Abstract: The present invention provides an RFID tag excellent in the diffusion of heat. The RFID tag includes a base, an antenna pattern that is provided on the base and forms a communication antenna, a circuit chip that is electrically connected to the antenna pattern and performs radio communication via the antenna, a cover that is provided in close contact with the base in such a manner as to cover the antenna pattern except a prescribed region including the circuit chip, and an insulating thermal diffusion material that covers the prescribed region and is in thermal contact with the circuit chip. The insulating thermal diffusion material has thermal conductivity higher than the thermal conductivity of the cover.
    Type: Application
    Filed: March 22, 2005
    Publication date: July 6, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Shunichi Kikuchi, Masumi Suzuki, Michimasa Aoki
  • Publication number: 20060144573
    Abstract: In a cooling device, an electronic component is attached to one surface on one side of a heat pipe so that heat can be conveyed, a first heat-radiating fin is provided on another surface on another side of the heat pipe, a first fan unit that sends an airflow to the first heat-radiating fin is provided on one side of the heat pipe, and a first duct that guides the airflow produced by the first fan unit to the first heat-radiating fin is provided on the other surface of the heat pipe.
    Type: Application
    Filed: February 28, 2006
    Publication date: July 6, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Kazuhiro Nitta, Masumi Suzuki, Michimasa Aoki, Keizou Takemura, Kenji Katsumata
  • Publication number: 20050207124
    Abstract: An intake opening is defined in a printed circuit board inside a fan cover mounted on the printed circuit board. The intake opening has a particular extent inside the fan cover. This intake opening contributes to improvement in the cooling efficiency of a fan as compared with a conventional intake opening. Moreover, the intake opening allows a sufficient space to remain on the front and back surfaces of the printed circuit board inside the fan cover. Electronic components and/or wiring patterns may be disposed in the space. This contributes to disposition of electronic components and/or wiring patterns at a higher density on the printed circuit board.
    Type: Application
    Filed: September 23, 2004
    Publication date: September 22, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Masuo Ohnishi, Masumi Suzuki, Michimasa Aoki
  • Publication number: 20040141290
    Abstract: A heat sink includes a generally rectangular flat base, a plurality of fins provided on the surface of the base in parallel to each other, a protrusion provided on the surface of the base along substantially the overall width of the base in the transverse direction to the fins. The fins become gradually shorter on one end side of the base. The ends of the fins are arranged on an oblique line with respect to a line perpendicular to the fins.
    Type: Application
    Filed: December 29, 2003
    Publication date: July 22, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Michimasa Aoki, Masumi Suzuki