Abstract: A light-emitting diode reflector assembly having a heat pipe and a reflector body is provided. The assembly further includes a mounting member for mounting a circuit board having an array of light-emitting diodes. The mounting member and reflector body are made from a thermally-conductive polymer composition comprising: i) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite.

Abstract: A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.

Abstract: A thermoplastic, thermally-conductive interface article is provided. The interface article is elastomeric and can be used to provide a thermally-conductive pathway between a heat-generating product such as an electronic device and a heat-sink. The interface article also can have good electrical-conductivity. The elastomeric interface article is made from a composition comprising a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material.

Abstract: The present invention discloses a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties. In addition, the present invention provides a method of manufacturing an elastomeric heat sink device as described above.

Abstract: The electronic connector (10) includes an improved heat dissipating housing for cooling heat generating devices located within the connector (10). The electronic connector (10) of the present invention enables the cost-effective cooling of electronic devices (22, 24) within the connector (10) while realizing superior thermal conductivity and improved electromagnetic shielding. A method of forming an electronic connector (10) that includes the steps of first providing a heat generating electronic component (22, 24) capable of electronically coupling two data devices together having a first port (16a) and a second port (16b). This component (22, 24) is typically mounted or installed into a circuit board (20). An outer housing (12) of moldable thermally conductive polymer material (102, 202, 302, 402) is overmolded around the heat generating electronic component (22, 24) leaving the first port (16a) and the second port (16b) of connector (10) exposed.

Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Abstract: A light-emitting diode reflector assembly having a heat pipe and a reflector body is provided. The assembly further includes a mounting member for mounting a circuit board having an array of light-emitting diodes. The mounting member and reflector body are made from a thermally-conductive polymer composition comprising: i) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite.

Abstract: A thermally-conductive polymer composition suitable for making molded reflector articles having light-reflecting surfaces is provided. The composition comprises: a) about 20% to about 80% by weight of a base polymer matrix such as polycarbonate; and b) about 20% to about 80% by weight of a thermally-conductive carbon material such as graphite. The composition can be used to make reflector articles such as housings for automotive tail lamps, head lamps, and other lighting fixtures. A method for manufacturing reflector articles is also provided.

Abstract: A thermally conductive lamp reflector is provided that dissipates heat from a light source within the reflector. The reflector assembly includes a shell having a metallized layer on its surface. The shell is made from a composition including about 30% to about 80% by volume of a base polymer matrix and about 20% to about 70% by volume of a thermally conductive filler material. The reflector has a thermal conductivity of greater than 3 W/m° K and preferably greater than 22 W/m° K. The reflectors can be used in automotive headlamps, flashlights, and other lighting fixtures. A method of forming the lamp reflector is also provided.

Abstract: The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Abstract: The present invention discloses method of manufacturing a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties.

Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K. and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Abstract: A method of making a thermally-conductive casing for an optical head in a disc player is provided. The method involves molding a polymer composition comprising: i) about 20% to about 80% by weight of a polymer matrix such as polyphenylene sulfide, and ii) about 20% to about 80% by weight of a thermally-conductive material such as carbon graphite into a casing for the optical head. A reinforcing material, such as glass, and other additives, such as flame retardants, can be incorporated into the polymer composition.

Abstract: The present invention discloses a method of constructing a heat pipe that includes providing a heat pipe with phase change media therein and injection overmolding the heat pipe with a conductive composition. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.

Abstract: A thermally-conductive plastic substrate for supporting electronic circuits is provided. The substrate has a relatively low dielectric constant and good mechanical strength. The substrate is made from a polymer composition comprising a base polymer matrix and a thermally-conductive, electrically-insulating material. The composition can comprise polyphenylene sulfide and boron nitride. The composition can further comprise a reinforcing material such as glass. The invention also encompasses methods for making such substrates.

Abstract: A thermoplastic, thermally-conductive composition is provided. The composition comprises a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material. The composition can be used to make shaped, thermally-conductive articles. The articles can be used as thermal interfaces for dissipating heat from heat-generating devices such as electronic parts. The articles can have good electrical conductivity.

Abstract: A composite heat dissipation assembly having a net shape injection molded thermally conductive elastomeric heat sink and at least one integral heat pipe is provided in the present invention. The molded conformable heat sink is formed from a base elastomeric material that is loaded with thermally conductive filler. The base material is mixed with the filler and net shape molded to form the outer geometry of the assembly. Within the geometry of the part an integral channel is formed that is capable of receiving a heat pipe. The channel is formed to have an opening that is slightly smaller than the outer cross-sectional dimensions of the heat pipe. When the heat pipe is pressed into the channel a portion of the elastomeric material is compressed and the reactionary force of the compressed material firmly presses the elastomer into thermal communication with the outer surface of the heat pipe.

Abstract: A method of manufacturing a net-shape moldable U-shaped heat sink assembly includes injection molding a thermally conductive polymer composite material. The method includes forming a heat sink assembly base member with a number of integrated fins members thereon. A right upstanding wall extends from a first side of the base member and a left upstanding wall extends from a second side of the base member to form a substantially U-shaped heat sink assembly. To enhance thermal conductivity, fins members may be integrally formed into the base member, right wall and/or left wall during the molding of the heat sink assembly. Also, a flexible metallic substrate or hinges may be embedded within the U-shaped heat sink assembly to permit positioning of the right wall and left wall relative to the base member for custom configuration of the heat sink assembly.

Abstract: A thermally-conductive biological assay tray is provided. The trays are made from a polymer composition comprising a base polymer matrix and a thermally-conductive material. The trays can be used for fluorescent immunoassays. The fluorescence level of the polymer composition is sufficiently low such that it does not interfere with the fluorescent immunoassay process. The invention also includes methods for making the bioassay trays.