Abstract: A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.

Abstract: The electronic connector (10) includes an improved heat dissipating housing for cooling heat generating devices located within the connector (10). The electronic connector (10) of the present invention enables the cost-effective cooling of electronic devices (22, 24) within the connector (10) while realizing superior thermal conductivity and improved electromagnetic shielding. A method of forming an electronic connector (10) that includes the steps of first providing a heat generating electronic component (22, 24) capable of electronically coupling two data devices together having a first port (16a) and a second port (16b). This component (22, 24) is typically mounted or installed into a circuit board (20). An outer housing (12) of moldable thermally conductive polymer material (102, 202, 302, 402) is overmolded around the heat generating electronic component (22, 24) leaving the first port (16a) and the second port (16b) of connector (10) exposed.

Abstract: A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.

Abstract: A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves. The heat transfer component is formed by net-shape molding a core body from a thermally conductive composition, such as a polymer composition, and applying a metallic coating. The molded heat transfer part is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. Additionally, the part is shielded from electromagnetic interference and radio frequency waves, thus preventing the transfer of same into the circuitry housed by the part. In addition, the coating also seals the conductive polymer core against moisture infiltration, making the part well suited for telecommunications applications in potentially harsh environments.

Abstract: A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves. The heat transfer component is formed by net-shape molding a core body from a thermally conductive composition, such as a polymer composition, and applying a metallic coating. The molded heat transfer part is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. Additionally, the part is shielded from electromagnetic interference and radio frequency waves, thus preventing the transfer of same into the circuitry housed by the part. In addition, the coating also seals the conductive polymer core against moisture infiltration, making the part well suited for telecommunications applications in potentially harsh environments.

Abstract: A net-shape moldable U-shaped heat sink assembly formed by injection molding of a thermally conductive polymer composite material is shown. The heat sink assembly includes a base member with a number of integrated fins members thereon. A right upstanding wall extends from a first side of the base member and a left upstanding wall extends from a second side of the base member to form a substantially U-shaped heat sink assembly. To enhance thermal conductivity, fins members may be integrally formed into the base member, right wall and/or left wall during the molding of the heat sink assembly. Also, a flexible metallic substrate or hinges may be embedded within the U-shaped heat sink assembly to permit positioning of the right wall and left wall relative to the base member for custom configuration of the heat sink assembly.

Abstract: A method of manufacturing a net-shape moldable U-shaped heat sink assembly includes injection molding a thermally conductive polymer composite material. The method includes forming a heat sink assembly base member with a number of integrated fins members thereon. A right upstanding wall extends from a first side of the base member and a left upstanding wall extends from a second side of the base member to form a substantially U-shaped heat sink assembly. To enhance thermal conductivity, fins members may be integrally formed into the base member, right wall and/or left wall during the molding of the heat sink assembly. Also, a flexible metallic substrate or hinges may be embedded within the U-shaped heat sink assembly to permit positioning of the right wall and left wall relative to the base member for custom configuration of the heat sink assembly.

Abstract: A highly thermally conductive and high strength net-shape moldable molding composition, with a thermal conductivity above 4 W/m° K and a strength of at least 15 ksi includes a polymer base matrix of, by volume, between 30 and 70 percent. A first highly thermally conductive filler of high modulus PITCH-based carbon, by volume, between 15 and 47 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second high strength filler of PAN-based carbon, by volume, between 10 and 35 percent that has a relatively high aspect ratio of 10:1 or more. Optionally, a third filler material of thermally conductive material with a relatively low aspect ratio of 5:1 or less may be included in the composition, by volume less than 10 percent, to improve the thermal conductivity and strength of the composition.

Abstract: A net-shape molded elastomeric gasket for dissipating heat and providing electro-magnetic interference (EMI) shielding for an electronic device is formed by loading a base elastomeric matrix material with thermally conductive filler and EMI reflective metallic filler and injecting the mixture into a mold cavity. The gasket of the present invention provides superior sealing between the case sections of an electronic device by shielding the device from EMI infiltration along the seam between the sections. In addition, the gasket of the present invention is in thermal communication with the case sections of the electronic device to provide thermal transfer and dissipation between the separate parts of the device.

Abstract: A thermally conductive and electrically insulative polymer composition and a method for creating the same is provided. Thermally conductive filler material is coated with a thermally conductive and electrically insulative coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electrically insulative coating material prevents the transfer of electricity through the filler material thus resulting in an electrically insulative composition.

Abstract: A heat pipe spreader construction includes a heat pipe with phase change media therein with a top plate and a bottom plate positioned in thermal communication with the heat pipe. A thermally conductive composition is molded about the heat pipe and between the top plate and the bottom plate to embrace and contain the heat pipe therein to form an improved net shape moldable heat spreader construction.

Abstract: A thermally conductive and electromagnetic interference and radio frequency reflective polymer composition and a method for creating the same is disclosed. Thermally conductive filler material is coated with a thermally conductive and electromagnetic interference and radio frequency reflective coating material and mixed with a base polymer matrix. The mixture is molded into the desired shape. The electromagnetic interference and radio frequency reflective coating material prevents the absorption and transfer of EMI and RF waves through the filler material thus resulting in an EMI and RF reflective composition.