Abstract: The present disclosure relates to a body fluid collection device (1), the body fluid collection device (1) comprises a tube body (10), wherein the tube body (10) is used to contain the collected body fluid and is provided with an opened end (12); a tube plug (20), wherein the tube plug (20) is configured to be able to hermetically close the opened end (12) of the tube body (10); and a filter (30), wherein the filter (30) is arranged in the tube body (10) for filtering out specific components from a body fluid to be collected, wherein the filter (30) is configured to be capable of being attached to the tube plug (20) at the open end, and the tube plug (20) is hermetically connected to the filter (30).

Abstract: A method of forming a semiconductor device includes: forming a gate structure over a fin that protrudes above a substrate; forming source/drain regions over the fin on opposing sides of the gate structure; forming a first dielectric layer and a second dielectric layer successively over the source/drain regions; performing a first etching process to form an opening in the first dielectric layer and in the second dielectric layer, where the opening exposes an underlying electrically conductive feature; after performing the first etching process, performing a second etching process to enlarge a lower portion of the opening proximate to the substrate; and forming a contact plug in the opening after the second etching process.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an assisting user equipment (UE) may determine, within a resource selection window, one or more resources to reserve in a shared resource pool for an internal sidelink transmission within a disaggregated UE group including the assisting UE and one or more assisted UEs. The assisting UE may transmit, over a sidelink, an assisting reservation message indicating a lower reference signal received power (RSRP) to project onto the one or more resources reserved for the internal sidelink transmission relative to a measured RSRP that is based at least in part on a transmit power associated with the assisting reservation message. Numerous other aspects are described.

Abstract: An optical fingerprint sensing module includes an image sensing device, a light source and a light shielding structure. The image sensing device is configured to sense light transmitted from a fingerprint of a finger on a display panel. The image sensing device includes a light sensing plane having a first geometric center. The light source includes a light emitting plane having a second geometric center. The first geometric center is separated from the second geometric center by a distance from 2 mm to 20 mm. The light shielding structure is disposed between the image sensing device and the light source. In examples, the optical fingerprint sensing module further includes a field angle controller to constrain light pass there through with a field angle of 5-60 degrees. A display device including an optical fingerprint sensing module is disclosed herein as well.

Abstract: A memory management method, a memory storage device, and a memory control circuit unit are provided. The memory management method includes: obtaining a first weight value corresponding to a first command in a command queue, wherein the command queue is used to store at least one command to be executed; obtaining a second weight value corresponding to at least one second command being executed; and in response to a sum of the first weight value and the second weight value being greater than a base value, delaying an execution of the first command.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first wireless communication device may transmit, to a second wireless communication device, information indicating positions of orbital angular momentum (OAM) antennas of a partial receive circle of the first wireless communication device that are operational. The partial receive circle is part of a full receive circle that includes positions with the OAM antennas that are operational and one or more positions that do not have OAM antennas that are operational. The first wireless communication device may receive an OAM mode to use for reception of an OAM signal at the OAM antennas that are operational. The first wireless communication device may then receive the OAM signal according to the OAM mode. Numerous other aspects are described.

Abstract: A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Abstract: Methods, systems, and devices for wireless communications are described. A receiving device may receive, from a transmitting device, a configuration indicating a set of orbital angular momentum (OAM) modes for joint reporting, where at least one of the set of OAM modes is associated with transmission via two or more of a plurality of sets of antennas arranged in a set of concentric circular arrays. The receiving device may transmit, to the transmitting device, a report indicating precoding information for each of at least a subset of the set of OAM modes, where the precoding information includes one or more first parameters common to the set of OAM modes and one or more second parameters for respective ones of the at least the subset of the set of OAM modes.

Abstract: Provided is an LED chip, which includes a semiconductor stack layer and an insulating layer on the semiconductor stack layer. The insulating layer at least includes a first insulating layer and a second insulating layer. The insulating layer has a step structure including a first step formed by the first insulating layer and a second step formed by the second insulating layer. The first step extends beyond the second step in a horizontal direction. Since the insulating layer is formed by at least the first insulating layer and the second insulating layer, crack or whole-layer breaking of the insulating layer is avoided. The extended portion of the first insulating layer can play a buffering role, thereby reducing a stress generated inside the second structural layer, avoiding the second structural layer from cracking or whole-layer breaking, and improving the reliability of the LED chip.

Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region, a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, a first magnetic tunneling junction (MTJ) between the first gate pattern and the second pattern and within the word line connecting region, and a second MTJ between the first gate pattern and the second gate pattern in the first active region. Preferably, top surfaces of the first MTJ and the second MTJ are coplanar.

Abstract: The present invention discloses a metal-free perovskite film and metal-free perovskite piezoelectric nanogenerators comprising the film. The metal-free perovskite film is organic, lead-free and metal-free. The open-circuit voltage of the metal-free perovskite piezoelectric nanogenerators can reach 9˜16 V and the short-circuit current of the metal-free perovskite piezoelectric nanogenerators can reach 38˜55 nA. Also, the metal-free perovskite piezoelectric nanogenerators can be used as self-powered strain sensor of human-machine interface application and be adopted in in vitro electrical stimulation devices.

Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first wireless communication device may transmit, in a time-frequency resource occasion to a second wireless communication device, a first orbital angular momentum (OAM) signal in a first OAM mode. The first wireless communication device may receive, in the time-frequency resource occasion from the second wireless communication device, a second OAM signal, in a second OAM mode, that is orthogonal to the first OAM signal. Numerous other aspects are described.

Abstract: Methods, systems, and devices for wireless communications are described. Techniques are described for a user equipment (UE) to trigger a sidelink channel state information (CSI) procedure without an associated data grant. In some cases, a CSI procedure may be triggered by sending a sequence on a specific resource. In some cases, a CSI procedure may be triggered by a sidelink control information (SCI) message which does not include a sidelink data grant. Techniques are described which avoid CSI reference signal (CSI-RS) resource collision. For example, CSI-RS resources may be selected based on channel sensing, UE identifiers, or a combination thereof. In some cases, UEs may be configured subsets of a CSI-RS resource pool for sending CSI-RS.

Abstract: Methods, systems, and devices for wireless communications are described. A first user equipment (UE) may transmit a trigger message to a second UE, where the trigger message triggers a channel state information (CSI) report that includes a first CSI reporting mode of a set of CSI reporting modes and a reporting quantity for the first CSI reporting mode. For a first reporting quantity, the first UE may trigger the second UE to transmit a CSI reference signal (RS), and the first UE may then receive the CSI-RS to determine CSI based on the CSI-RS. Additionally or alternatively, for other reporting quantities, the first UE may transmit the CSI-RS to the second UE, and the second UE may transmit channel state feedback to the first UE based on measuring CSI for the received CSI-RS, where the first UE determines the CSI based on the channel state feedback.

Abstract: The electronic device includes a first substrate, a second substrate, a first support member, a planarization layer, and an alignment layer. The second substrate is opposite to the first substrate. The first support member is disposed in the peripheral region and located between the first substrate and the second substrate. The planarization layer is disposed on the first substrate and has a first portion and an opening. The first portion is disposed between the opening, and the first support member and the first portion are overlapped in a normal direction of the first substrate. The alignment layer is disposed on the planarization layer. The alignment layer on the first portion has a first thickness. The alignment layer in the opening has a second thickness. The first thickness is greater than or equal to zero and less than the second thickness.

Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may convey uplink control information (UCI) to a base station using a multi-slot or single slot uplink channels. In some cases, however, transmissions scheduled on a first set of resources allocated for multi-slot transmission of a first uplink channel may overlap with one or more slots of a second set of resources allocated for multi-slot transmission of a second uplink control channel. Accordingly, the UE may employ a number of different techniques to transmit the UCI. In a first case, the UE may map the UCI to at least one of the overlapping slots of the first uplink channel. In a second case, the UE may drop the second uplink channel which carries the UCI. In a third case, and the UE may map the UCI to an overlapping slot of the second uplink channel.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may determine that an enhanced type-II channel state information (CSI) report configuration, associated with transmitting CSI feedback to a base station, is to be overridden; and transmit, based at least in part on determining that the enhanced type-II CSI report configuration is to be overridden, a CSI report using another CSI report configuration, wherein the CSI report includes the CSI feedback and an indication that the enhanced type-II CSI report configuration has been overridden. Numerous other aspects are provided.