Abstract: A method for generating a wireless signal fingerprint database includes: obtaining an initial atmospheric pressure value, in which the initial atmospheric pressure value is an atmospheric pressure value collected when a terminal enters indoors; obtaining periodically a current wireless signal fingerprint and a current atmospheric pressure value collected by the terminal; and determining a floor corresponding to the current wireless signal fingerprint based on the initial atmospheric pressure value and the current atmospheric pressure value, to obtain the wireless signal fingerprint database.

Abstract: An apparatus, method, and system for indexing backed up files is disclosed. The operations comprise: maintaining a File index and a Backup index, the File index comprising entries each associated with an individual file backed up, the Backup index comprising entries each associated with a particular backup; receiving a request to determine whether or not a first file is included in a first backup; determining whether or not the first file is included in the first backup based on the File index entry corresponding to the first file and the Backup index entry corresponding to the first backup; and returning a result of the determination of whether or not the first file is included in the first backup.

Abstract: A circuit includes an array of OTP cells, an array of NVM cells, an amplifier coupled to each of the array of OTP cells and the array of NVM cells, and a control circuit configured to generate one or more control signals. Responsive to the one or more control signals, the amplifier is configured to generate an output voltage based on a current received from the array of OTP cells in a first configuration, and generate the output voltage based on a voltage received from the array of NVM cells in a second configuration.

Abstract: Examples described herein relate to a central processing unit (CPU) that includes at least two cores, at least two caching agents (CAs), and circuitry to monitor a workload mapped to a CA of the at least two CAs and adjust the workload allocated to the CA to allocation among the CA and at least one other CA of the at least two CAs based on the monitored workload.

Abstract: The present disclosure provides an electronic device and method for wireless communication, and a computer-readable storage medium. The electronic device comprises: a processing circuit, configured to acquire a channel state information (CSI) resource configuration and a CSI report configuration from a base station, the CSI report configuration being associated with one or more CSI resource configurations, the CSI resource configuration comprising a resource configuration for a reference signal on one or more bandwidth parts (BWPs), and to send, on the basis of the CSI report configuration, to the base station a measurement result, obtained by measuring a reference signal specified in the associated CSI resource configuration, of a beam corresponding to the reference signal.

Abstract: A device includes an enclosure and logic. The enclosure includes a plurality of capacitive touch sensor arrays disposed at least on two of a top side, a bottom side, a left side, a right side, a front side, and a back side of the device. The enclosure also includes a first display on the front side of the device. The logic receives touch interaction information from the plurality of capacitive touch sensor arrays and initiates an action based at least in part on the touch interaction information.

Abstract: Methods and systems for generating virtual appliance products. The techniques include obtaining an operating system virtual disk file; creating a configuration file to include a first reference to the operating system virtual disk file and a second reference to a product-specific disk file; generating a virtual appliance file including the configuration file, the operating system virtual disk file, and the product-specific disk file; and distributing the virtual appliance file to a user.

Abstract: A semiconductor device includes a first device region and a second device region. The first device region includes a first source/drain region extending from a substrate and a first and a second pair of spacers. The first source/drain region extends between the first pair of spacers and the second pair of spacers. The first pair of spacers and the second pair of spacers have a first height. The second device region includes a second and a third source/drain region extending from the substrate and a third and a fourth pair of spacers. The third source/drain region is separate from the second source/drain region. The second source/drain region extends between the third pair of spacers. The third source/drain region extends between the fourth pair of spacers. The third pair of spacers and the fourth pair of spacers have a second height greater than the first height.

Abstract: In some implementations, one or more semiconductor processing tools may form a via within a substrate of a semiconductor device. The one or more semiconductor processing tools may deposit a ruthenium-based liner within the via. The one or more semiconductor processing tools may deposit, after depositing the ruthenium-based liner, a copper plug within the via.

Abstract: An embodiment includes a device including a first fin extending from a substrate. The device also includes a first gate stack over and along sidewalls of the first fin. The device also includes a first gate spacer disposed along a sidewall of the first gate stack. The device also includes and a first source/drain region in the first fin and adjacent the first gate spacer, the first source/drain region including a first carbon-containing buffer layer on the first fin. The device also includes and a first epitaxial structure on the first carbon-containing buffer layer.

Abstract: A semiconductor processing tool performs passivation layer deposition and removal in situ. A transport mechanism included in the semiconductor processing tool transfers a semiconductor structure through different deposition chambers (e.g., without breaking or removing a vacuum environment). Accordingly, the semiconductor processing tool deposits a target layer that is thinner on, or even absent from, a metal layer, such that contact resistance is reduced between a conductive structure formed over the target layer and the metal layer. As a result, electrical performance of a device including the conductive structure is improved. Moreover, because the process is performed in situ (e.g., without breaking or removing the vacuum) in the semiconductor processing tool, production time and risk of impurities in the conductive structure are reduced. As a result, throughput is increased, and chances of spoiled wafers are decreased.

Abstract: A display substrate includes a first base, touch signal lines and touch units. The touch signal lines are disposed on a side of the first base, and lengths of at least two touch signal lines decrease in sequence. The touch units are disposed on a side of the touch signal lines away from the first base, and a touch unit is electrically connected to a touch signal line. Resistances of at least two touch units increase in sequence, and the at least two touch units in an increase order of the resistances in sequence are electrically connected to the at least two touch signal lines in a decrease order of the lengths in sequence, respectively. The touch units each include a touch electrode, and at least one of the at least two touch units further includes an auxiliary electrode stacked with and electrically connected to a touch electrode.

Abstract: In coarse memory training approaches, a multiple of a base timing interval is used to reduce the sampling time in a sweep sampling approach during memory training to determine the timing offset between a non-clock memory signal and a memory clock to ensure reliable memory operation at high frequencies. In a hierarchical memory training method, a coarse memory training step is employed to determine adjustable timing offsets where a memory captures the rising and falling edges of a non-clock memory signal and those adjustable timing offsets are used in a subsequent fine memory training step to refine the timing offsets where the memory captures the rising and falling edges of the non-clock memory signal. The hierarchical approach can determine timing offsets for non-clock memory signals with the accuracy of existing (non-coarse, non-hierarchical) memory training methods in less time than the existing methods.

Abstract: A heat pipe structure includes a main body. The main body has an internal airtight chamber. At least one capillary structure is disposed on a wall face of the airtight chamber. A working fluid is filled in the airtight chamber. The main body has at least one stress concentration section. A retaining reinforcement member is disposed on the capillary structure corresponding to the stress concentration section for reinforcing the capillary structure and securely retaining the capillary structure on the wall face. When the heat pipe is flexed, bent and deformed, the retaining reinforcement member serves to prevent the capillary structure disposed on the stress concentration section from cracking or damaging.

Abstract: A floating heat pipe assembly includes a floating heat pipe and a clamp collar used with the floating heat pipe. The floating heat pipe has a flattened section that has a flattened pipe size smaller than a pipe size of any other section of the floating heat pipe, so that the floating heat pipe is adjustable at the thinner flattened section for other sections of the floating heat pipe located at two opposite ends of the flattened section to displace to two positions having a height difference between them. The clamp collar is fitted on around the flattened section and includes two symmetrically arranged elastic clamping sections that elastically clamp on two opposite outer sides of the flattened section to hold the same in place, so that the sections of the floating heat pipe located at different heights do not deform to cause reduced or failed capillary action efficiency.

Abstract: Disclosed is a biomedical ? titanium alloy and a preparation method thereof. Its composition includes: Mo: 9.20-13.50%; Fe: 1.00-3.20%; Zr: 3.50-8.20%; Ta: 0-1.00%; the balance is Ti. The ? titanium alloy is suitable for the laser additive manufacturing technology, and the prepared parts have a dense equiaxed grain structure with ultra-low grain size and a small number of columnar grain structures, which produces a fine-grain strengthening effect, and greatly improve the hardness and tribocorrosion performance of the alloy material. Also provided is a method for preparing a non-toxic, low-elasticity, and tribocorrosion resistant biomedical ? titanium alloy material. A powder prepared from the above alloy components is subjected to a laser additive manufacturing technology to prepare a corresponding ? titanium alloy with high-hardness, good tribocorrosion resistance and extremely low cytotoxicity.

Abstract: A method includes: receiving a current data packet of a target service; adding detection indication information to the current data packet, to obtain a target data packet, where the detection indication information includes a target phase category corresponding to the current data packet, the target phase category is used to indicate a target phase in at least one key phase in which the current data packet is located in the target service, and the detection indication information is used to indicate to detect the current data packet; and transmitting the target data packet to a next hop node.

Abstract: The present disclosure provides a high-strength and high-plasticity casting high-entropy alloy (HEA), having a general formula of AlaCobCrcTidFeeNifCug, where 6.0<a?8.0, 18.0<b?23.0, 7.5?c<12.5, 2.0<d?8.5, 15.5<e?20.0, 28.0<f?37.0, 0.2<g?10.0, and a+b+c+d+e+f+g=100. The casting HEA can be prepared in one step and has excellent mechanical properties. The various metal raw materials are environmental-friendly and suitable for large-scale industrial production.

Abstract: A mechanism for adaptively performing in-band network telemetry (INT) by a network controller is disclosed. The mechanism includes receiving one or more congestion indicators from a collector. An adjusted sampling rate is generated. The adjusted sampling rate is a specified rate of insertion of instruction headers for INT and is generated based on the congestion indicators. The adjusted sampling rate is transmitted to a head node, which is configured to perform INT via instruction header insertion into user packets.

Abstract: A display panel and a method for fabricating the same, and a display device and a method for charging the same are provided. The display panel includes: an array substrate; an opposite substrate arranged opposite to the array substrate; a charging coil located between the array substrate and the opposite substrate, wherein the charging coil is configured to generate electrical energy through electromagnetic induction. In this way, a battery for charging the battery is integrated inside the display panel to thereby make the display panel thin and lightweight.