Abstract: A two-phase immersion type heat dissipation fin composite structure is provided. The two-phase immersion type heat dissipation fin composite structure includes a heat dissipation base layer, a bubble activation layer, and a fin structure. The fin structure and the bubble activation layer are both formed on the heat dissipation base layer, or the fin structure is formed on the bubble activation layer. The bubble activation layer is immersed in a two-phase coolant for increasing an amount of bubbles that is generated.

Abstract: An image displacement device includes a first grating and a second grating. The first grating has a first surface and a second surface opposite the first surface, the first surface receives image beams, and the image beams leave the first grating by the second surface. The second grating is disposed downstream from the first grating in a light path and has a third surface and a fourth surface opposite the third surface. The third surface receives the image beams, and the image beams leave the second grating by the fourth surface. The image beams are projected to form a plane image comprised of pixels, each pixel is displaced in a direction by the image displacement device, and a displacement of each pixel is smaller than five times a width of one pixel.

Abstract: An image displacement device includes a first grating and a second grating. Each grating is switchable between a diffracting state and a non-diffracting state. The first grating has a first surface and a second surface opposite the first surface, the first surface receives image beams, and the image beams leave the first grating by the second surface. The second grating is disposed downstream from the first grating in a light path and has a third surface and a fourth surface opposite the third surface. The third surface receives the image beams, and the image beams leave the second grating by the fourth surface. An exit direction of the image beam exiting the second grating is shifted a distance in a first direction from an incident direction of the image beam incident to the first grating.

Abstract: A method for manufacturing a sensing device is provided. The method includes: providing a substrate; forming a sensing unit on the substrate; forming a first light-shielding layer on the sensing unit; forming a first anti-reflection layer on the sensing unit; and patterning the first light-shielding layer and the first anti-reflection layer using a single lithography process to form a first pinhole corresponding to the sensing unit.

Abstract: An image displacement device includes a projection lens and a first grating. The projection lens has a lens group, and the lens group includes a first lens and a second lens, where no lens with refractive power is disposed between the first lens and the second lens. The first grating is switchable between a diffracting state and a non-diffracting state, and the first grating is disposed on one side of the first lens facing away from the second lens. A distance between the first grating and an aperture stop of the projection lens measured along an optical axis of the projection lens is smaller than a distance between the first grating and the second lens measured along the optical axis of the projection lens.

Abstract: The present disclosure provides a method for scavenging hydrogen peroxide and regulating gastrointestinal function by using a drinking water including silicon dioxide (SiO2).

Abstract: A manufacturing method is applied to set a stackable chip package. The manufacturing method includes encapsulating a plurality of chips stacked with each other, disposing a lateral surface of the stacked chips having conductive elements onto a substrate, disassembling the substrate from the conductive elements when the stacked chips are encapsulated, and disposing a dielectric layer with openings on the stacked chips to align the openings with the conductive elements for ball mounting process.

Abstract: A method for manufacturing an electronic device is provided. In the method for manufacturing an electronic device, a substrate is provided, a device layer is disposed on the substrate, and a photoresist layer is disposed on the device layer. Next, a photo mask is disposed on the photoresist layer, and a light source is used to firstly illuminate the photo mask to form a first exposure region. After that, a relative movement is made between the substrate and the photo mask, and the light source is used to secondly illuminate the photo mask to form a second exposure region, wherein the first exposure region partially overlaps the second exposure region. Afterwards, a pattern is developed on the substrate, the device layer is etched using a patterned photoresist layer as an etching mask, and then the patterned photoresist layer is removed.

Abstract: A stacked package structure has a metal casing, a stacked chipset, an encapsulation and a redistribution layer. The stacked chipset is adhered in the metal casing. The encapsulation is formed in the metal casing to encapsulate the stacked chip set, but a plurality of surfaces of the metal pads are exposed through the encapsulation. The redistribution layer is further formed on the encapsulation and electrically connects to the metal pads of the stacked chipset. Therefore, the stacked package structure includes the metal casing, so an efficiency of heat dissipation and structural strength are increased.

Abstract: A stacked package structure has a metal casing, a stacked chipset, an encapsulation and a redistribution layer. The stacked chipset is adhered in the metal casing. The encapsulation is formed in the metal casing to encapsulate the stacked chip set, but a plurality of surfaces of the metal pads are exposed through the encapsulation. The redistribution layer is further formed on the encapsulation and electrically connects to the metal pads of the stacked chipset. Therefore, the stacked package structure includes the metal casing, so an efficiency of heat dissipation and structural strength are increased.

Abstract: A touch system, a stylus, a touch apparatus, and a control method of the touch apparatus are provided. The control method includes following steps. At least one characteristic data of at least one input tool is obtained. An identifier of the input tool is generated according to the characteristic data. If a touch operation on the touch panel is performed with the input tool, a specific function of the touch apparatus is determined according to the identifier of the input tool.

Abstract: An image displacement device includes a first grating and a second grating. Each grating is switchable between a diffracting state and a non-diffracting state. The first grating has a first surface and a second surface opposite the first surface, the first surface receives image beams, and the image beams leave the first grating by the second surface. The second grating is disposed downstream from the first grating in a light path and has a third surface and a fourth surface opposite the third surface. The third surface receives the image beams, and the image beams leave the second grating by the fourth surface. An exit direction of the image beam exiting the second grating is shifted a distance in a first direction from an incident direction of the image beam incident to the first grating.

Abstract: An image displacement device includes a projection lens and a first grating. The projection lens has a lens group, and the lens group includes a first lens and a second lens, where no lens with refractive power is disposed between the first lens and the second lens. The first grating is switchable between a diffracting state and a non-diffracting state, and the first grating is disposed on one side of the first lens facing away from the second lens. A distance between the first grating and an aperture stop of the projection lens measured along an optical axis of the projection lens is smaller than a distance between the first grating and the second lens measured along the optical axis of the projection lens.

Abstract: A spectrometer system including a spectrometer device, a mobile apparatus and a cloud server is provided. The spectrometer device scans a target object according to one of a plurality of sets of spectral scan setting parameters to generate spectral data. The mobile apparatus sets the spectrometer device to select one set from the plurality of sets spectral scan setting parameters for scanning the target object. The mobile apparatus receives the spectral data from the spectrometer device and outputs the spectral data. The cloud server stores detection models and the spectral data received from the mobile apparatus, and analyzes the spectral data according to one of the detection models to output an analysis result to the mobile apparatus. The spectrometer system can reduce network transmission traffic and prevent object analysis and model building from being affected by unregulated spectral data so correctness of spectral scan can be controlled.

Abstract: A spectrometer system including a spectrometer device, a mobile apparatus and a cloud server is provided. The spectrometer device scans a target object according to one of a plurality of sets of spectral scan setting parameters to generate spectral data. The mobile apparatus sets the spectrometer device to select one set from the plurality of sets spectral scan setting parameters for scanning the target object. The mobile apparatus receives the spectral data from the spectrometer device and outputs the spectral data. The cloud server stores detection models and the spectral data received from the mobile apparatus, and analyzes the spectral data according to one of the detection models to output an analysis result to the mobile apparatus. The spectrometer system can reduce network transmission traffic and prevent object analysis and model building from being affected by unregulated spectral data so correctness of spectral scan can be controlled.

Abstract: A manufacturing method is applied to set a stackable chip package. The manufacturing method includes encapsulating a plurality of chips stacked with each other, disposing a lateral surface of the stacked chips having conductive elements onto a substrate, disassembling the substrate from the conductive elements when the stacked chips are encapsulated, and disposing a dielectric layer with openings on the stacked chips to align the openings with the conductive elements for ball mounting process.

Abstract: A stacked package has plurality of chip packages stacked on active surfaces of each other, a dielectric layer, a redistribution layer and a plurality of external terminals. Each chip package has an exterior conductive element formed on the active surface. Each exterior conductive element has a cut edge exposed on at least one of the lateral side of the chip package. The dielectric layer, the redistribution layer and the external terminals are formed in sequence on the lateral side with the exposed cut edges to form the electrical connection between the cut edges, the redistribution layer and the external terminals. Therefore, the process for forming the electrical connections is simplified to enhance the reliability and the UPH for manufacturing the stacked package.

Abstract: A stacked package has plurality of chip packages stacked on a base. Each chip package has an exterior conductive element formed on the active surface. Each exterior conductive element has a cut edge exposed on a lateral side of the chip package. The lateral trace is formed through the encapsulant and electrically connects to the cut edges of the chip packages. The base has an interconnect structure to form the electrical connection between the lateral trace and the external terminals. Therefore, the process for forming the electrical connections is simplified to enhance the reliability and the UPH for manufacturing the stacked package.

Abstract: A stacked package has plurality of chip packages stacked on active surfaces of each other, a dielectric layer, a redistribution layer and a plurality of external terminals. Each chip package has an exterior conductive element formed on the active surface. Each exterior conductive element has a cut edge exposed on at least one of the lateral side of the chip package. The dielectric layer, the redistribution layer and the external terminals are formed in sequence on the lateral side with the exposed cut edges to form the electrical connection between the cut edges, the redistribution layer and the external terminals. Therefore, the process for forming the electrical connections is simplified to enhance the reliability and the UPH for manufacturing the stacked package.

Abstract: A vibration suppressing apparatus and a vibration suppressing method thereof are provided. The vibration amplitude, vibration frequency, and vibration phase of a vibration suppressing unit are adjusted in real-time according to the vibration amplitude, vibration frequency and vibration phase of a vibration source.