Abstract: A package structure may include a one-piece metal carrier, a die, a mold layer and a redistribution layer. The one-piece metal carrier may include a bottom portion and a first supporting structure, and the one-piece metal carrier may have a recess defined by the bottom portion and the first supporting structure. The die may be disposed in the recess of the one-piece metal carrier, and the die may have a plurality of conductive bumps. The mold layer may be formed to encapsulate the die. The mold layer may expose a portion of each of the plurality of conductive bumps and a portion of the first supporting structure. The redistribution layer may be disposed on the mold layer and electrically connected to the plurality of conductive bumps.

Abstract: A package structure may include a one-piece metal carrier, a die, a mold layer and a redistribution layer. The one-piece metal carrier may include a bottom portion and a first supporting structure, and the one-piece metal carrier may have a recess defined by the bottom portion and the first supporting structure. The die may be disposed in the recess of the one-piece metal carrier, and the die may have a plurality of conductive bumps. The mold layer may be formed to encapsulate the die. The mold layer may expose a portion of each of the plurality of conductive bumps and a portion of the first supporting structure. The redistribution layer may be disposed on the mold layer and electrically connected to the plurality of conductive bumps.

Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: A manufacturing method of an interposed substrate is provided. A photoresist layer is formed on a metal carrier. The photoresist layer has plural of openings exposing a portion of the metal carrier. Plural of metal passivation pads and plural of conductive pillars are formed in the openings. The metal passivation pads cover a portion of the metal carrier exposed by openings. The conductive pillars are respectively stacked on the metal passivation pads. The photoresist layer is removed to expose another portion of the metal carrier. An insulating material layer is formed on the metal cattier. The insulating material layer covers the another portion of the metal carrier and encapsulates the conductive pillars and the metal passivation pads. An upper surface of the insulating material layer and a top surface of each conductive pillar are coplanar. The metal carrier is removed to expose a lower surface of the insulating material layer.

Abstract: A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer.

Abstract: An electronic device includes a first body, a second body, a rotary shaft and a flexible display panel. The second body is movably connected to the first body and is adapted to lean against the first body or separate from the first body. The rotary shaft is pivotally connected to the first body. The flexible display panel is connected between the first and second bodies. When the second body is at the first position, a first section of the flexible display panel is rolled around the rotary shaft, and a second section of the flexible display panel is expanded between the first and second bodies. When the second body is at the second position, a part of the first section and the second section are expanded between the first and second bodies.

Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor body, a first doped region, a second doped region, a gate and a dielectric layer. The semiconductor body is disposed on a dielectric substrate and has a protrusion portion, a first portion and a second portion. The first portion and the second portion are respectively disposed at two opposite sides of the protrusion portion. The first doped region is disposed in a top of the protrusion portion. The second doped region is disposed in an end of the first portion far away from the protrusion portion. The gate is disposed on the first portion and adjacent to the protrusion portion. The dielectric layer is disposed between the gate and the protrusion portion, and between the gate and the first portion.

Abstract: A field effect transistor is provided in the present invention with an active area including a source region, a drain region, and a channel region. The width of the channel region is larger than the width of the source/drain regions, and at least one of the source region and the drain region is comb-shaped.

Abstract: A vibration suppressing apparatus and a vibration suppressing method thereof are provided. The vibration amplitude, vibration frequency, and vibration phase of a vibration suppressing unit are adjusted in real-time according to the vibration amplitude, vibration frequency and vibration phase of a vibration source.

Abstract: A vibration suppressing apparatus and a vibration suppressing method thereof are provided. The vibration amplitude, vibration frequency, and vibration phase of a vibration suppressing unit are adjusted in real-time according to the vibration amplitude, vibration frequency and vibration phase of a vibration source.

Abstract: A heat dissipation device including a driving module and a heat dissipation sheet is provided. The heat dissipation sheet has a connection portion and a swing portion and is connected to the driving module by the connection portion. When the driving module receives an input voltage to drive the connection portion, the connection portion drives the swing portion to swing back and forth so as to generate a heat dissipation airflow.

Abstract: A fan system suitable for an electronic device is provided. The fan system includes a fan module and a fan protecting module. The fan module includes a base and a fan blade assembly. The base is disposed at the electronic device and has a chamber. The fan blade assembly includes a fan blade and a shaft portion. The fan blade is fixed on the shaft portion. The shaft portion is rotatably contained in the chamber. The fan protecting module includes an electromagnetic component and an accelerometer. The electromagnetic component is disposed at a position adjacent to the shaft portion. The accelerometer is disposed in the electronic device and coupled to the electromagnetic component. When an acceleration of the electronic device detected by the accelerometer is greater than a threshold value, the electromagnetic component applies magnetic force to the shaft portion to prevent the shaft portion from overly shifting or deflecting.

Abstract: A fan control system and a fan controlling method thereof are disclosed. The fan control system is used to an electronic apparatus for controlling an air pump fan device. The fan controlling method includes following steps: setting a plurality of vibrating working periods of the air pump fan device; setting a plurality of vibrating frequencies of the air pump fan device, wherein each vibrating frequency has a different vibrating frequency value; detecting a temperature of the electronic apparatus; determining whether the temperature of the electronic apparatus exceeding a first setting temperature; and if yes, controlling the air pump fan device to vibrate according to the plurality of vibrating frequencies during the plurality of vibrating working periods, wherein adjacent vibrating working periods of the plurality of vibrating working periods correspond to different vibrating frequency values.

Abstract: A force feedback mechanism disposed inside a casing for vibration balance of the casing is disclosed in the present invention. The force feedback mechanism includes an accelerator, a force generator and a controller. The accelerator detects an acceleration parameter of the casing. The force generator respectively generates an effective force at a first direction and a second direction. The first direction is substantially opposite to the second direction. The controller is electrically connected to the accelerator and the force generator. The controller obtains and analyzes absolute value and vector of the acceleration parameter, and drives the force generator to generate the corresponding effective force according to the absolute value and the vector.

Abstract: A packaging carrier includes an interposer, a dielectric layer and a built-up structure. The interposer has a first surface and a second surface opposite to each other, and a plurality of first pads and second pads located on the first surface and the second surface, respectively. The dielectric layer has a third surface and a fourth surface opposite to each other. The interposer is embedded in the dielectric layer. The second surface of the interposer is not covered by the fourth surface of the dielectric layer, and has a height difference with the fourth surface. The built-up structure is disposed on the third surface of the dielectric layer and electrically connected to the first pads of the interposer.

Abstract: A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer.

Abstract: An electronic apparatus includes a first casing, a protected device, a detector, a first actuator and a controller. The protected device is spaced apart from the first casing by a first shortest distance. The detector is configured to detect a first early sign before a first collision of the first casing and the protected device. The controller is configured to actuate the first actuator after the detector detects the first early sign, causing an increase of the first shortest distance.

Abstract: A touch system, a stylus, a touch apparatus, and a control method of the touch apparatus are provided. The control method includes following steps. At least one characteristic data of at least one input tool is obtained. An identifier of the input tool is generated according to the characteristic data. If a touch operation on the touch panel is performed with the input tool, a specific function of the touch apparatus is determined according to the identifier of the input tool.

Abstract: A manufacturing method of an interposed substrate is provided. A metal-stacked layer comprising a first metal layer, an etching stop layer and a second metal layer is formed. A patterned conductor layer is formed on the first metal layer, wherein the patterned conductor layer exposes a portion of the first metal layer. A plurality of conductive pillars is formed on the patterned conductor layer, wherein the conductive pillars are separated from each other and stacked on a portion of the patterned conductor layer. An insulating material layer is formed on the metal-stacked layer, wherein the insulating material layer covers the portion of the first metal layer and encapsulates the conductive pillars and the other portion of the patterned conductor layer. The metal-stacked layer is removed to expose a lower surface opposite to an upper surface of the insulating material layer and a bottom surface of the patterned conductor layer.

Abstract: A switching method for a multimedia player of a vehicle includes setting an operational mode for playing a predetermined signal; the multimedia player receiving a broadcasted signal to determine whether an intensity signal corresponding to the broadcasted signal exceeds a threshold value when the multimedia player processes a broadcast mode; and the multimedia player processing the operational mode for playing the predetermined signal when the intensity signal corresponding to the broadcasted signal is smaller than the threshold signal; wherein the predetermined signal is a source signal from a CD/DVD multimedia player, an audio multimedia player or a mobile device, or is a silent signal.