Abstract: An apparatus integrated with fingerprint recognition and touch detection is provided. The apparatus includes a touchpad and a controller IC. The touchpad has a touch area for recognizing a touch event and a fingerprint area for recognizing a fingerprint and the touch event. The fingerprint area includes TX lines of a first group crossing RX lines of a first group. The touch area includes TX lines of the first group and a second group crossing RX lines of the first group and a second group. When the apparatus is operated in a fingerprint sensing mode, the controller IC supplies a driving signal to the TX lines of the first group. When the apparatus is operated in a touch sensing mode, the controller IC supplies the driving signal to the TX lines of the second group and a portion of the TX lines of the first group.

Abstract: Methods and apparatus for depositing a coating on a semiconductor manufacturing apparatus component are provided herein. In some embodiments, a method of depositing a coating on a semiconductor manufacturing apparatus component includes: sequentially exposing a semiconductor manufacturing apparatus component including nickel or nickel alloy to an aluminum precursor and a reactant to form an aluminum containing layer on a surface of the semiconductor manufacturing apparatus component by a deposition process.

Abstract: An apparatus integrated with fingerprint recognition and touch detection is provided. The apparatus includes a touchpad and a controller IC. The touchpad has a touch area for recognizing a touch event and a fingerprint area for recognizing a fingerprint and the touch event. The fingerprint area includes TX lines of a first group crossing RX lines of a first group. The touch area includes TX lines of the first group and a second group crossing RX lines of the first group and a second group. When the apparatus is operated in a fingerprint sensing mode, the controller IC supplies a driving signal to the TX lines of the first group. When the apparatus is operated in a touch sensing mode, the controller IC supplies the driving signal to the TX lines of the second group and a portion of the TX lines of the first group.

Abstract: A computer system modifies a compiled application to monitor performance. A request routing function of the compiled application is replaced with jump code that directs processing to a data collection function and backing up the request routing function. In response to receiving, during execution of the compiled application, an incoming request from a remote device for handling by the request routing function, the data collection function is executed based on the jump code. Using the data collection function, data associated with the incoming request is collected, the data comprising performance metrics. The backup of the request routing function is called using the data collection function to process the request and provide a response. Embodiments of the present invention further include a method and program product for modifying a compiled application to monitor performance in substantially the same manner described above.

Abstract: Routing containerized services requests on a serverless platform can include responding to receiving on the serverless platform a request for a containerized service and detecting a potential request failure. The response to the potential request failure can include searching a database that maps version-specific requests to a plurality of containers that are configured and managed by the serverless platform. The routing can include redirecting the request to a container containing a prior version of the containerized service requested in response to determining that the prior version of the containerized service maps to a version-specific request that matches the request received.

Abstract: Subject matter disclosed herein may relate to fabrication of a correlated electron material (CEM) switch. In particular embodiments, an insulative material may be formed on or over a sidewall portion of a conductive contact region. The insulative material may insulate the conductive contact region from resputtered CEM occurring during a physical etch of a CEM film.

Abstract: Subject matter disclosed herein may relate to fabrication of a correlated electron material (CEM) device. In particular embodiments, layers of a CEM to form a correlated electron switch (CES) device may be disposed between layers of electrode material. Use of a metal nitride as an electrode material for at least one terminal of a CES device may simplify processes to implement a CES device in an integrated circuit device such as in back end of line processing.

Abstract: A display panel and an associated electronic device are provided. The display panel may include: a plurality of display blocks arranged to display images, a plurality of light sensors arranged to perform light sensing, a plurality of sets of switches, and a detection circuit. The plurality of sets of switches may combine the plurality of light sensors into a plurality of combined sensors, respectively, wherein the plurality of sets of switches operate according to a plurality of switching signals, respectively. The detection circuit may be coupled to two sets of combined sensors within the plurality of combined sensors, and arranged to detect a voltage level of a combined sensor of one set of the two sets of combined sensors according to a reference voltage level, for performing fingerprint detection through the display panel, wherein the reference voltage level is obtained from another set of the two sets of combined sensors.

Abstract: Implementation of large temperature-insensitive resistance in CMOS using short-duty-clock cycle is provided herein. Operations of a method can comprise boosting a resistance level of a switched-resistor circuit to a defined resistance level. The boosting can comprise using a short-duty-cycle clock to facilitate the boosting. Also provided is a sensor system that can comprise a short-duty-cycle clock and a switched-resistor circuit. The short-duty cycle clock boosts a resistance level of the switched-resistor circuit to a defined resistance level.

Abstract: A fingerprint sensor embedded in a flat-panel display includes photo sensors; select transistors that are correspondingly connected in series with the photo sensors respectively; switch transistors that are correspondingly connected in series with the select transistors respectively, but are correspondingly connected in parallel with the photo sensors respectively; and a detection circuit that detects a signal passing one turned-on select transistor.

Abstract: Embodiments of the present disclosure relate to articles, coated articles, and methods of coating such articles with a corrosion resistant coating. The corrosion resistant coating can comprise hafnium aluminum oxide. The corrosion resistant coating may be deposited by a non-line of sight deposition, such as atomic layer deposition. Articles that may be coated may include chamber components, such as gas lines.

Abstract: A cathode catalyst used for conversion of a carbon dioxide gas by an electrochemical reduction includes at least one first catalyst layer and at least one second catalyst layer disposed on a surface of the at least one first catalyst layer. The at least one second catalyst layer is a porous structure. The at least one first catalyst layer and the at least one second catalyst layer are physically combined with each other, and materials of the at least one first catalyst layer and the at least one second catalyst layer are different. A cathode material and a reactor include the cathode catalyst are also provided.

Abstract: A fingerprint sensor embedded in a flat-panel display includes photo sensors; select transistors that are correspondingly connected in series with the photo sensors respectively; switch transistors that are correspondingly connected in series with the select transistors respectively, but are correspondingly connected in parallel with the photo sensors respectively; and a detection circuit that detects a signal passing one turned-on select transistor.

Abstract: A display panel and an associated electronic device are provided. The display panel may include: a plurality of display blocks arranged to display images, a plurality of light sensors arranged to perform light sensing, a plurality of sets of switches, and a detection circuit. The plurality of sets of switches may combine the plurality of light sensors into a plurality of combined sensors, respectively, wherein the plurality of sets of switches operate according to a plurality of switching signals, respectively. The detection circuit may be coupled to two sets of combined sensors within the plurality of combined sensors, and arranged to detect a voltage level of a combined sensor of one set of the two sets of combined sensors according to a reference voltage level, for performing fingerprint detection through the display panel, wherein the reference voltage level is obtained from another set of the two sets of combined sensors.

Abstract: Subject matter disclosed herein may relate to fabrication of a correlated electron material (CEM) device. In particular embodiments, formation of a CEM device may include application of rapid thermal annealing to doped layers of a metal oxide.

Abstract: A display device is provided. The display device includes a display panel having a biometric detecting area configured to detect a biometric pattern of a biometric object in a blanking period of the display device. The biometric detecting area has plural blocks and each of the blocks comprises plural first pixels and plural photodetectors adjacent to the first pixels, respectively. The light sequentially penetrates the first pixels within each of the blocks in the blanking period of the display device.

Abstract: A binder for an electrochemical battery is provided, which is a copolymer including a first repeating unit and a second repeating unit. The first repeating unit has a first side moiety. The second repeating unit has a second side moiety. A first terminal group of the first side moiety is a polar functional group. A second terminal group of the second side moiety is an epoxy group. A composition including the binder and active material particles, an electrode material for the electrochemical battery, and a method for making the electrode material are further provided.

Abstract: Disclosed herein is an article comprising one or more channels and a multi-layer protective coating on the one or more channels. The multi-layer protective coating includes an anodization layer comprising a plurality of cracks and a plurality of pores, a sealing layer on the anodization layer, and a top layer on the sealing layer. The sealing layer comprises a metal oxide, the seals the plurality of cracks and the plurality of pores, and has a porosity of approximately 0%. The top layer comprises a rare earth oxide, a rare earth fluoride, or a rare earth oxyfluoride, has a different material composition than the sealing layer, and has a porosity of approximately 0%.

Abstract: Subject matter disclosed herein may relate to fabrication of a correlated electron material (CEM) switch. In particular embodiments, formation of a CEM switch may include removing of an exposed portion of a CEM film to form an exposed sidewall region bordering a remaining unexposed portion of the CEM film under or beneath a conductive overlay. The method may further include at least partially restoring properties of the exposed sidewall region to a CEM via exposure of the exposed sidewall region to one or more gaseous annealing agents.

Abstract: The present disclosure relates to a method for making an electrode material of lithium-ion batteries. In the method, a lithium source solution and a plurality of titanium source particles are provided. The lithium source solution and the titanium source particles are mixed, wherein a molar ratio of lithium element to titanium element is in a range from about 4:5 to about 9:10, thereby forming a sol. A carbon source compound is dispersed into the sol to form a sol mixture. The sol mixture is spray dried to form a plurality of precursor particles. The precursor particles are heated to form a lithium titanate composite electrode material.