Abstract: The present invention provides an electronic shelf label communication system, method and apparatus.

Abstract: A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.

Abstract: Apparatus and methods are provided for UE-assisted tethering report. In one novel aspect, UE-assisted tethering report is generated with UE-assisted procedure based on latency measurement configuration. In one embodiment, the UE-assisted tethering report includes one or more elements comprising one bit to inform the activation of tethering mode, latency of packet transmission, and other side-information related to tethering path. In one embodiment, the UE-assisted procedure is inserting a measurement timestamp or recording timing of a predefined transport block (TB) of the packet. In another novel aspect, the UE performs a jitter measurement for an extended reality (XR) traffic, sends a UE-assisted information report for an end-to-end path of the XR traffic based on the jitter measurements, wherein the UE-assisted information includes one or more elements comprising jitter information and burst arrival time.

Abstract: An atomization generator and a special high-pressure atomization generation device for increasing oil and gas field recovery are provided. The special high-pressure atomization generation device for increasing oil and gas field recovery includes an agent pot assembly, a gear pump, a metering pump, an atomization generator and pipelines. The gear pump is connected with the agent pot assembly through an agent pot liquid inlet pipe. The metering pump is arranged between the agent pot assembly and the atomization generator which are connected through the low-pressure manifold pipeline and the high-pressure liquid inlet pipeline. The high-pressure liquid inlet pipeline is connected with the liquid inlet pipe. The liquid inlet pipes are connected with the metering pump. The gas inlet pipe is connected with the high-pressure gas source through the high-pressure gas inlet pipe. The gas inlet cap is provided with a gas inlet pipe.

Abstract: Embodiments of the present disclosure relate to a system, a software application, and methods of digital lithography for semiconductor packaging. The method includes comparing positions of vias and via locations, generating position data based on the comparing the positions of vias and the via locations, providing the position data of the vias to a digital lithography device, updating a redistributed metal layer (RDL) mask pattern according to the position data such that RDL locations correspond to the positions of the vias, and projecting the RDL mask pattern with the digital lithography device.

Abstract: A device for detecting whether a wafer is present on a clamping jaw and detecting whether the wafer is parallel to a bottom of the clamping jaw. The device for detecting a wafer comprises: a wafer parallel measuring unit arranged in a CMP cleaning and drying device, and used for emitting a parallel measuring laser beam parallel to the bottom of the clamping jaw and receiving the parallel measuring laser beam; a wafer detection unit used for emitting a wafer detecting laser beam to the wafer and receiving the wafer detecting laser beam; and a detection processing unit electrically connected to the wafer parallel measuring unit and the wafer detection unit, and used for determining whether the wafer is present on the clamping jaw and whether the wafer is parallel to the bottom of the clamping jaw according to the received wafer detecting laser beam and parallel measuring laser beam.

Abstract: The present invention discloses a drug for the augmentation treatment of myocardial infarction with stem cells and its application, specifically the application of 2-deoxy-D-glucose in the preparation of drugs for the augmentation treatment of myocardial infarction with stem cells. Animal experiments have confirmed that the injection of 2-deoxy-D-glucose increased the survival rate of injected mesenchymal stem cells and enhanced the therapeutic effect of mesenchymal stem cells.

Abstract: A card-type USB C transfer device, which includes a first connection interface for coupling and electrically connecting a portable power source, a second connection interface for coupling and electrically connecting at least one external device, an internal circuit electrically connected to the first connection interface and the second connection interface, and been configured to provide more than one power transmission paths between the portable power source and the external device, wherein the portable power source is detachably coupled to the card-type USB C transfer device through the first connection interface.

Abstract: An integrated circuit (IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input/output (IO) pattern configured to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first IO pattern extends along a third direction oblique to both the first direction and the second direction.

Abstract: A package structure is provided. The package structure includes a first conductive pad in a first insulating layer, a conductive via in a second insulating layer directly under the first conductive pad, and a first under bump metallurgy structure directly under the first conductive via. In a first horizontal direction, the conductive via is narrower than the first under bump metallurgy structure, and the first under bump metallurgy structure is narrower than the first conductive pad.

Abstract: Semiconductor device and methods of forming the same are provided. A semiconductor device according to one embodiment includes a dielectric layer including a top surface, a plurality of magneto-resistive memory cells disposed in the dielectric layer and including top electrodes, a first etch stop layer disposed over the dielectric layer, a common electrode extending through the first etch stop layer to be in direct contact with the top electrodes, and a second etch stop layer disposed on the first etch stop layer and the common electrode. Top surfaces of the top electrodes are coplanar with the top surface of the dielectric layer.

Abstract: Disclosed are a super-resolution imaging system (1, 41, 51), a super-resolution imaging method, a biological sample identification system (4, 61) and method, a nucleic acid sequencing imaging system (5) and method, and a nucleic acid identification system (6) and method. The super-resolution imaging system (1, 41, 51) includes an illumination system (A) and an imaging system (B). The illumination system (A) outputs excitation light to irradiate a biological sample to generate excited light, and the imaging system (B) collects and records the excited light to generate an excited light image. The illumination system (A) includes an excitation light source (10, 10a) and a structured light generation and modulation device (11, 11a). The excitation light source (10, 10a) outputs the excitation light, and the structured light generation and modulation device (11, 11a) modulates the excitation light into structured light to irradiate the biological sample to generate the excited light.

Abstract: A method for forming a chip package structure. The method includes bonding first connectors over a front surface of a semiconductor wafer. The method also includes dicing the semiconductor wafer from a rear surface of the semiconductor wafer to form semiconductor dies and mounting first and second semiconductor dies in the semiconductor dies over a top surface of the interposer substrate. The method further forming an encapsulating layer over the top surface of the interposer substrate to cover the first semiconductor die and the second semiconductor die. A first sidewall of the first semiconductor die faces a second sidewall of the second semiconductor die, and upper portions of the first sidewall and the second sidewall have a tapered contour, to define a top die-to-die distance and a bottom die-to-die distance that is less than the top die-to-die distance.

Abstract: A well cementing method is described for improving cementing quality by controlling the hydration heat of cement slurry. By controlling the degree and/or rate of hydration heat release from cement slurry, the method improves the hydration heat release during formation of cement with curing of cement slurry, improves the binding quality between the cement and the interfaces, and in turn improves the cementing quality at the open hole section and/or the overlap section. The cementing method improves cementing quality of oil and gas wells and reduces the risk of annular pressure.

Abstract: A traction apparatus, comprising a clip portion (2) and a traction portion (1), the traction portion containing a closed traction structure (11); the closed traction structure being made from an elastic material; the clip portion comprising a main clip body (23, 25) and a clip arm (24, 26); the main clip body being capable of passing through a biopsy channel (4) of an endoscope (3), the clip arm being capable of clip the closed traction structure. Also disclosed is a traction ring used for the traction apparatus, the traction ring being a single closed traction structure or being formed by connecting several closed traction structures, the traction ring being made from an elastic material.

Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.

Abstract: A focal length adjustment mechanism, adapted for adjusting a focal length adjustment device located in a housing of a projector. The focal length adjustment mechanism includes a knob and a first stroke adjustment member. The first stroke adjustment member is located in the housing and includes a first end and a second end opposite to each other and a first pivot located between the first end and the second end. The first end is connected to the focal length adjustment device. The knob is connected to the second end. The knob rotates to drive the first stroke adjustment member to rotate around the first pivot. A distance between the first pivot and the first end is less than a distance between the first pivot and the second end, such that a movement path of the first end is less than a movement path of the second end.

Abstract: An assembly for a vehicle includes a dash. The assembly includes a seat having a seatback and a head restraint extending upwardly from the seatback. The assembly includes an airbag supported by the seatback. The airbag is inflatable from the seatback toward the dash in a seat-rearward direction to an inflated position. The airbag includes an upper portion adjacent the head restraint and a pair of lobes extending from the upper portion along the head restraint in a seat-forward direction in the inflated position. The head restraint is between the lobes in the inflated position.

Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured: or a pharmaceutically acceptable salt thereof, wherein the variables shown in Formula A can be as defined anywhere herein.