Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured: Formula (AA) or a pharmaceutically acceptable salt thereof, wherein the variables shown in Formula A can be as defined anywhere herein.

Abstract: A light emitting diode (LED) including an epitaxial stacked layer, first and second reflective layers which are disposed at two sides of the epitaxial stacked layer, a current conducting layer and first and second electrodes and a manufacturing thereof are provided. The epitaxial stacked layer includes a first-type and a second-type semiconductor layers and an active layer. A main light emitting surface with a light transmittance >0% and ?10% is formed on one of the two reflective layers. The current conducting layer contacts the second-type semiconductor layer. The first electrode is electrically connected to the first-type semiconductor layer. The second electrode is electrically connected to the second-type semiconductor layer via the current conducting layer. A contact scope of the current conducting layer and the second-type semiconductor layer is served as a light-emitting scope overlapping the two layers, but not overlapping the two electrodes.

Abstract: The present invention discloses a power supply method having power management mechanism that includes the steps outlined below. Power request information of power requesting devices is retrieved to generate a to-be-powered device list and a requested power. Whether a current requesting device satisfy a power stable criteria and a power sufficient criteria is determined, The power stable criteria is satisfied when the power requesting devices each having a priority higher than that of the current requesting device all operate in a powered mode or when the power requesting devices that operate in the powered mode enter a stable operation status. The power sufficient criteria is satisfied when a stable system remained power of a power supply system is not smaller than an individual requested power of the current requesting device. When the criteria are satisfied, the current requesting device is operated in the powered mode to update the requested power.

Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured. The variables shown in Formula AA are as defined in the claims. The compounds of formula AA are NLRP3 activity modulators and, as such, can be used in the treatment of metabolic disorders (e.g. Type 2 diabetes, atherosclerosis, obesity or gout), a disease of the central nervous system (e.g. Alzheimer's disease, multiple sclerosis, Amyotrophic Lateral Sclerosis or Parkinson's disease), lung disease (e.g. asthma, COPD or pulmonary idiopathic fibrosis), liver disease (e.g. NASH syndrome, viral hepatitis or cirrhosis), pancreatic disease (e.g. acute pancreatitis or chronic pancreatitis), kidney disease (e.g. acute kidney injury or chronic kidney injury), intestinal disease (e.g. Crohn's disease or Ulcerative Colitis), skin disease (e.g. psoriasis), musculoskeletal disease (e.g. scleroderma), a vessel disorder (e.g. giant cell arteritis), a disorder of the bones (e.g.

Abstract: An assembly includes a vehicle floor defining a seating area. The assembly includes a post supported by the vehicle floor and movable along a vehicle-longitudinal axis adjacent the seating area. The assembly includes an airbag supported by the post above the vehicle floor.

Abstract: A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.

Abstract: A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.

Abstract: A light emitting diode chip including an epitaxy stacked layer, first and second electrodes and a first reflective layer is provided. The epitaxy stacked layer includes first-type and second-type semiconductor layers and a light-emitting layer. The first and second electrodes are respectively electrically connected to the first-type and second-type semiconductor layers. An orthogonal projection of the light-emitting layer on the first-type semiconductor layer is misaligned with an orthogonal projection of the first electrode on the first-type semiconductor layer. The first reflective layer is disposed on the epitaxy stacked layer, the first and second electrodes. An orthogonal projection of the first reflective layer on the second-type semiconductor layer is misaligned with an orthogonal projection of the second electrode on the second-type semiconductor layer. Furthermore, a light emitting diode device is also provided.

Abstract: A biological analysis system is provided. The system comprises an interchangeable assembly configured to accommodate any one of a plurality of sample holders, each respective sample holder configured to receive a plurality of samples. The system also includes a control system configured to cycle the plurality of samples through a series of temperatures. The system further includes an optical system configured to detect fluorescent signals emitted from the plurality of samples. The optical system, in particular, can comprise a single field lens, an excitation source, an optical sensor, and a plurality of filter components. The excitation source can be one or more light emitting diodes. The field lends can be a bi-convex lens.

Abstract: An assembly includes a vehicle floor defining a seating area. The assembly includes a post supported by the vehicle floor and movable along a vehicle-longitudinal axis adjacent the seating area. The assembly includes an airbag supported by the post above the vehicle floor.

Abstract: Disclosed are embodiments of rope designs and making and manufacturing of such ropes. In some embodiments, a rope comprises a set of first rope cores, each first rope core of the set of first rope cores comprising a first material; a set of second rope cores, each second rope core of the set of second rope cores comprising a second material, the second material being different from the first material; and a rope sheath configured to encompass the set of first rope cores and the second rope core. In some cases, the rope sheath is braided from a plurality of rope sheath strands.

Abstract: A metal product includes a metal substrate, at least one first hole, at least one second hole, and at least one third hole. The first hole is formed in a surface of the metal substrate. The second hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and an inner surface defining the first hole. The third hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and without the second hole, a portion of the inner surface defining the first hole without the second hole, and an inner surface defining the second hole. The first, second, and third holes enhance a bonding strength between the metal product and a material product. The disclosure also provides a metal composite and a method for manufacturing the metal product.

Abstract: A seat includes a seatback. The seat includes a seat bottom extending away from the seatback in a seat-forward direction to a front of the seat bottom distal to the seatback. The seat bottom has a top surface defining an occupant-leg area. The seat includes an airbag supported by the seat bottom at the front of the seat bottom and inflatable from an uninflated position to an inflated position. The airbag in the inflated position extends away from the seat bottom in the seat-forward direction and includes an uppermost surface positioned below the occupant-leg area of the seat bottom.

Abstract: A seat includes a seatback. The seat includes a seat bottom extending away from the seatback in a seat-forward direction to a front of the seat bottom distal to the seatback. The seat bottom has a top surface defining an occupant-leg area. The seat includes an airbag supported by the seat bottom at the front of the seat bottom and inflatable from an uninflated position to an inflated position. The airbag in the inflated position extends away from the seat bottom in the seat-forward direction and includes an uppermost surface positioned below the occupant-leg area of the seat bottom.

Abstract: A human-machine interface (HMI) system comprises a local operation device, a display device, a HMI display control device and a communication control device. The local operation device generates a local operation signal. The display device shows a display image corresponding to a display signal. The HMI display control device generates the display signal according to the local operation signal or a remote operation signal. The communication control device comprises a wireless communication connection port for connecting with a remote operation device. The communication control device transmits the local operation signal to the HMI display control device, transmits the display signal to the display device, and selectively transmits the display signal to the remote operation device.

Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.

Abstract: A package structure is provided. The package structure includes a substrate. The package structure also includes a hybrid pad disposed on the substrate. The hybrid pad includes a metal layer and a buffer layer connected to the metal layer. The Young's modulus of the buffer layer is less than the Young's modulus of the metal layer. The package structure further includes an electrically connecting structure disposed on the hybrid pad. The package structure includes a chip layer electrically connected to the electrically connecting structure. The package structure also includes a bonding pad disposed between the electrically connecting structure and the chip layer.

Abstract: A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.

Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured: or a pharmaceutically acceptable salt thereof, wherein the variables shown in Formula A can be as defined anywhere herein.

Abstract: In one aspect, compounds of Formula AA, or a pharmaceutically acceptable salt thereof, are featured. The variables shown in Formula AA are as defined in the claims. The compounds of formula AA are NLRP3 activity modulators and, as such, can be used in the treatment of metabolic disorders (e.g. Type 2 diabetes, atherosclerosis, obesity or gout), a disease of the central nervous system (e.g. Alzheimer's disease, multiple sclerosis, Amyotrophic Lateral Sclerosis or Parkinson's disease), lung disease (e.g. asthma, COPD or pulmonary idiopathic fibrosis), liver disease (e.g. NASH syndrome, viral hepatitis or cirrhosis), pancreatic disease (e.g. acute pancreatitis or chronic pancreatitis), kidney disease (e.g. acute kidney injury or chronic kidney injury), intestinal disease (e.g. Crohn's disease or Ulcerative Colitis), skin disease (e.g. psoriasis), musculoskeletal disease (e.g. scleroderma), a vessel disorder (e.g. giant cell arteritis), a disorder of the bones (e.g.