Abstract: The present disclosure provides a radar object recognition method, which includes steps as follows. The radar image generation is performed on radar data to generate a radar image; the radar image is inputted into an object recognition model, so that the object recognition model outputs a recognition result; the post-process is performed on the recognition result to eliminate recognition errors from the recognition result.

Abstract: A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support disk is annular and surrounds the wafer spin chuck, can act relative to the wafer spin chuck to a wafer support position or a wafer disengagement position, and includes a soaking trough. The wafer support disk at the wafer support position can support a wafer such that the wafer is soaked in processing liquid injected in the soaking trough for implementing a high efficient cleaning or etching process.

Abstract: Provided are a memory device and a method of forming the same. The memory device includes: a selector; a magnetic tunnel junction (MTJ) structure, disposed on the selector; a spin orbit torque (SOT) layer, disposed between the selector and the MTJ structure, wherein the SOT layer has a sidewall aligned with a sidewall of the selector; a transistor, wherein the transistor has a drain electrically coupled to the MTJ structure; a word line, electrically coupled to a gate of the transistor; a bit line, electrically coupled to the SOT layer; a first source line, electrically coupled to a source of the transistor; and a second source line, electrically coupled to the selector, wherein the transistor is configured to control a write signal flowing between the bit line and the second source line, and control a read signal flowing between the bit line and the first source line.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.

Abstract: The present invention relates to a quick release assembly for a pressing head and an electronic device testing apparatus having the same. The quick release assembly comprises an upper base, an actuator and a lower base. When the lower base is to be mounted on the upper base, the actuator drives a movable head to a first position; the movable head passes through an open slot of the lower base; then, the actuator drives the movable head to a second position so that the lower base is retained by the movable head. The open slot of the lower base is firstly fitted on the movable head of the actuator located on the upper base. At this time, the actuator is controlled to drive the movable head to the second position from the first position.

Abstract: A rotatable cushioning pick-and-place device primarily comprises a motor, a body, a cushioning module and a pick-and-place module. The cushioning module is disposed in a first chamber of the body and comprises a rotary bearing which is connected to a drive shaft of the motor, and coupled to a driven shaft sleeve through a rotary follower. The rotary follower is driven by the rotary bearing to drive the driven shaft sleeve to rotate, thereby allowing the rotary bearing to displace relative to the driven shaft sleeve axially. The cushioning spring is arranged between the rotary bearing and the driven shaft sleeve. A first sealing ring and a second sealing ring of the pick-and-place module are fixed on the body to cooperatively and air-tightly seal the second chamber.

Abstract: A rotatable cushioning pick-and-place device primarily comprises a motor, a body, a cushioning module and a pick-and-place module. The cushioning module is disposed in a first chamber of the body and comprises a rotary bearing which is connected to a drive shaft of the motor, and coupled to a driven shaft sleeve through a rotary follower. The rotary follower is driven by the rotary bearing to drive the driven shaft sleeve to rotate, thereby allowing the rotary bearing to displace relative to the driven shaft sleeve axially. The cushioning spring is arranged between the rotary bearing and the driven shaft sleeve. A first sealing ring and a second sealing ring of the pick-and-place module are fixed on the body to cooperatively and air-tightly seal the second chamber.

Abstract: An electrode soldering method for a back contact solar module is to place a curved solder part on two electrode solder pads of two solar cells on a substrate respectively, and to solder the curved solder part on the electrode solder pads. The curved solder part includes a curved portion between the two electrode solder pads. The curved portion curves parallel to the substrate. Therefore, the elasticity in structure or the allowable deformation of the curved portion can release the internal stress induced by the soldering of the curved solder part on the electrode solder pads or by a following lamination packaging, which solves a problem in the prior art that internal residual stress in an electrode solder part harmfully affects the electrical connection between solar cells.

Abstract: A back contact solar module and an electrode soldering method therefor are disclosed. The back contact solar module includes a substrate, two solar cells formed on the substrate, and a curved solder part. The curved solder part is soldered onto an electrode solder pad of each solar cell. The curved solder part has a curved portion between the two solder pads. The curved portion curves parallel to the substrate. Therefore, the invention utilizes the elasticity in structure or the allowable deformation of the curved portion to release the internal stress induced by the soldering on the electrode pads or by a following lamination packaging, which solves the problem in the prior art that the internal residual stress in an electrode solder part harmfully affects the electrical connection between solar cells.

Abstract: The disclosure provides a photovoltaic array system, a photovoltaic device of the photovoltaic array system, and a frame element of the photovoltaic device of the photovoltaic array system. The frame element includes a groove, a receiving hole and a metal wire. The groove extends along a longitudinal axial direction of the frame element for holding one lateral side of a photovoltaic panel. The receiving hole extends along the longitudinal axial direction for receiving the metal wire therein, and is parallel to the longitudinal axial direction.

Abstract: A solar module is provided and includes a support element, a frame body, a photoelectric conversion module, and a protection element. An accommodating space is formed in a region surrounded by the frame body. The photoelectric conversion module is located in the accommodating space. The support element extends past the photoelectric conversion module and is connected to the frame body. The protection element is located on the photoelectric conversion module, and is located in the accommodating space.

Abstract: A display panel includes a substrate having a display area and a blank area. The blank area includes at least one of a non-metal line region and a metal-line region. The non-metal line region includes a plurality of insulating patterns and a first conductive pattern layer formed on the substrate. The insulating patterns are isolated from each other by the first conductive pattern layer. The metal-line region includes an insulating multilayer formed on the substrate and a conductive pattern layer formed on the insulating multilayer. Several isolated zones are formed by the conductive pattern layer on the surface of the insulating multilayer.

Abstract: A solar panel module includes a solar panel, a supporting stand and a deflecting device. The supporting stand is structurally connected to the solar panel for supporting the solar panel. The solar panel is disposed inclinedly, and the solar panel has a tilt angle with respect to a horizontal plane. The deflecting device is disposed underneath the solar panel for deflecting wind blowing from lateral directions toward a wind exiting direction, which faces a bottom surface of the solar panel.

Abstract: The disclosure provides a photovoltaic array system, a photovoltaic device of the photovoltaic array system, and a frame element of the photovoltaic device of the photovoltaic array system. The frame element includes a groove, a receiving hole and a metal wire. The groove extends along a longitudinal axial direction of the frame element for holding one lateral side of a photovoltaic panel. The receiving hole extends along the longitudinal axial direction for receiving the metal wire therein, and is parallel to the longitudinal axial direction.

Abstract: A method of forming thin film solar cell includes the following steps. A substrate is provided, and a plurality of first electrodes are formed on the substrate. A printing process is performed to print a light-absorbing material on the substrate and the first electrodes to form a plurality of light-absorbing patterns. Each of the light-absorbing patterns corresponds to two adjacent first electrodes, partially covers the two adjacent first electrodes, and partially exposes the two adjacent first electrodes. A plurality of second electrodes are formed on the light-absorbing patterns.

Abstract: A back contact solar module and an electrode soldering method therefor are disclosed. The back contact solar module includes a substrate, two solar cells formed on the substrate, and a curved solder part. The curved solder part is soldered onto an electrode solder pad of each solar cell. The curved solder part has a curved portion between the two solder pads. The curved portion curves parallel to the substrate. Therefore, the invention utilizes the elasticity in structure or the allowable deformation of the curved portion to release the internal stress induced by the soldering on the electrode pads or by a following lamination packaging, which solves the problem in the prior art that the internal residual stress in an electrode solder part harmfully affects the electrical connection between solar cells.