Abstract: An electrical joint that couples electric signals and current between objects that move relative to one another. A conductive slurry is disposed upon a first object and a conductor extends from a second object to engage the conductive slurry. The slurry comprises conductive particle suspended in a fluid carrying agent, such as oil. A non-conductive gel may be disposed upon the exposed surface of the conductive slurry to retain and protect it. The conductive slurry and non-conductive gel may be disposed within a channel on the object's surface so as to define their position and retain them in the desired area. The position of the conductive slurry is oriented and aligned to maintain continuous contact with the conductor as movement occurs. Linear, planar, circular and other movements are contemplated. The electrical joint can be readily adapted to printed circuit and printed wire technology.

Abstract: An electrical joint that couples electric signals and current between objects that move relative to one another. A conductive slurry is disposed upon a first object and a conductor extends from a second object to engage the conductive slurry. The slurry comprises conductive particle suspended in a fluid carrying agent, such as oil. A non-conductive gel may be disposed upon the exposed surface of the conductive slurry to retain and protect it. The conductive slurry and non-conductive gel may be disposed within a channel on the object's surface so as to define their position and retain them in the desired area. The position of the conductive slurry is oriented and aligned to maintain continuous contact with the conductor as movement occurs. Linear, planar, circular and other movements are contemplated. The electrical joint can be readily adapted to printed circuit and printed wire technology.

Abstract: Planetary connectors for coupling signals and power between stationary and moving structures. The planetary connector comprises a pressure plate that abuts a conformal pad that in turn contacts a first printed wiring board having a plurality of concentric conductive rings that face the interior of the connector. A second printed wiring board, which may be backed by a second pressure plate, is disposed at an end of the connector distal from the first printed wiring board that has a plurality of concentric conductive rings 18a that face the interior of the connector. A ball bearing retainer that retains a plurality of metal ball bearings is disposed between the flexible printed wiring boards, such that the ball bearings make electrical contact with the conductive rings of the rigid printed wiring boards. A shaft extends through all components.

Abstract: A spring-loaded ball contact device having a housing, a spring disposed in the housing, a moveable plunger disposed in the housing that contacts the spring, a freely moveable ball contact disposed at an end of the plunger, and a lubricant stored within the housing for lubricating the ball contact. A rotary connector using the spring-loaded ball contact devices has first and second printed wiring boards that rotate relative to each other that are electrically interconnected using a plurality of spring-loaded ball contact devices disposed on the first printed wiring board. The spring-loaded ball contact devices are used to transfer electrical signals or power to conductive contacts formed on the second printed wiring board.

Abstract: A rotary connector that transfers electrical power and signals using conductive metallic balls confined by a nonmetallic spacer and conductive conduits that are formed on two opposed metal-backed printed wiring boards. The rotary connector transfers electrical signals and power from a stationary printed wiring board to a moving printed wiring board by way of the conductive balls disposed in some or all openings of the conductive conduits. Nonconductive balls may be used in some of the openings. The use of a relatively large number of balls disposed in the openings of the nonmetallic spacer mechanically balance the connector. The connector is sealed and its interior contains nonconductive lubricant to lubricate the balls and conduits.

Abstract: A spring loaded contact device having a housing with an internal bore, a spring disposed in the bore, a pin disposed in and extending from the bore, and a dimple formed in the housing that secures the pin in the bore. A first portion of the pin contacts the spring, a center portion of the pin is smaller than the first portion and protrudes from the bore, and a head of the pin is disposed external to the bore and has a rounded cylindrical end. A rotary connector using the spring loaded contact devices has first and second printed wiring boards that rotate relative to each other that are electrically interconnected using a plurality of spring loaded contact devices disposed on the first printed wiring board. The spring-loaded contact devices are used to transfer electrical signals or power to conductive contacts formed on the second printed wiring board.

Abstract: A connector having a pair of structural substrates that each contain mechanically raised dimples and adjacent mating flexible interconnect circuits. The structural substrate has one or more structural dimples formed therein that protrude above one surface. A metallization pattern on the substrate overlays each of the structural dimples to provide additional structural support. The flexible interconnect circuits each comprise a dielectric substrate fabricated as a flat flexible circuit having conductive traces formed on top and bottom sides thereof, respectively, that terminate in contact areas. The conductive traces are configured to conform to the shapes of the respective dimples of the structural substrates when they are mated. The mated flexible interconnect circuits are compressed by the structural substrates using plates or other securing members so that contact therebetween is made by the conductive traces adjacent the contact areas.

Abstract: A portable integrated circuit die testing system that offers a cost-effective solution for electrically testing bare, unpackaged, integrated circuit chips or die. The system provides for direct electrical interconnection of die of various sizes and thicknesses to an automatic tester without wire bonding or packaging of the semiconductor chip or die. The system includes an X-Y table that is adjustable in horizontal X and Y directions. A contact platform is disposed above the X-Y table that has an opening therein, and is movable in a vertical direction relative to the X-Y table. An adjustment member is coupled to the contact platform for finely adjusting the movement thereof in the vertical direction. A die holder is secured to the X-Y table for holding the die that is to be tested, and in response to movement of the X-Y table. A vacuum connection is provided for drawing a vacuum on the tested die to secure it in the die holder.

Abstract: A rotary connector comprising first and second printed wiring boards that rotate relative to each other and that are electrically interconnected using spring loaded pogo-stick type contacts. The spring-loaded contacts are used to transfer electrical signals or power to metallized rings or contacts formed on the first printed wiring board. The spring-loaded pogo-stick type contacts are very rugged and provide for a rotary connector having long life.

Abstract: Spring loaded rotary connectors that comprise a first wiring board having one or more sets of electrically conductive concentric circuits or rings formed thereon, that has one or more raised contacts, or looped-shaped dimples, for every ring. In a first embodiment, the first wiring board faces a second wiring board having electrically conductive concentric rings or circuits that form contacts. The first wiring board is coupled to a moving (rotating) component while the second wiring board is coupled to a stationary component, or vice-versa. The sliding rings and dimples (contacts) on the adjacent wiring boards permit signals and power to be transferred from the moving part of the connector to the stationary part thereof.

Abstract: A rotary electrical connector has two planar connector members. Each of the planar connector members is positioned perpendicular to an axis of rotation and is supported in rotational facing relation to the other connector member. One of the connector members has a set of concentric tracts thereon, and the other has a corresponding set of protrusions positioned to contact the tracks. A spring forces the two connector members into contact so that electrical contact is maintained between the protrusions and the tracks as one connector member rotates relative to the other connector member. External electrical contact is made on one side to the tracks, and on the other side to the protrusions.

Abstract: A rotary connector employing rolling conductive members. Two or more electrically isolated assemblies comprising pairs of primed wiring boards or flexprint circuits are disposed in a housing. The printed wiring boards have conductors disposed on adjacent surfaces. The conductors are electrically connected using the rolling conductive members. An insulating spacer is disposed between the metallic conductors of each of the printed wiring boards that hold them in place. The assemblies are disposed adjacent each other, and a shaft is secured to selected printed wiring boards. The shaft is rotatably secured to the housing using a rotary bearing, and the other printed wiring boards are secured to the housing. The printed wiring boards have electrical wires soldered thereto that permits the flow of electrical signals through the rotary connector, and which may be routed to electrical connectors or sensors.

Abstract: Apparatus for interconnecting an integrated circuit device, such as an infrared device, having a plurality of leads to a multilayer printed wiring board having a plurality of interconnects. The apparatus comprises a flexprint circuit having a plurality of interconnects that are configured to mate with the plurality of interconnects on the printed wiring board. The flexprint circuit has wrinkles formed along its surface that form a spring, and a plurality of printed circuit leads that are coupled between the leads of the integrated circuit device and the interconnects. Fastening members is provided for forcibly interconnecting the respective pluralities of interconnects. Respective ends of the flexprint circuit may be folded so that the interconnects contact the interconnects disposed on the printed wiring board.

Abstract: A variable resistor that employs a bumped or dimpled flexprint circuit that rotates relative to an adjacent ceramic substrate having concentric circular resistors formed with printed resistive ink. The ceramic substrate is fused or screened with the resistive ink in a circular arrangement that forms the plurality of concentric printed resistors. The flexprint circuit having bump or dimple contacts is constructed, and the contacts of the flexprint circuit are positioned facing the ceramic substrate so that contact is made between the individual resistors and contacts. As the ceramic substrate rotates relative to the contacts, the values of the resistors change to produce variable resistor values.

Abstract: Electronic interconnection of two printed wiring structures. Two printed wiring boards or a flexprint circuit and a printed wiring board are interconnected by creating a plated hole pattern on a surface of the printed wiring board, and wherein holes of the pattern have a concave cross section. The holes of the plated hole pattern are mated with corresponding bumps or dimples disposed on the second printed wiring board or the flexprint circuit. The holes formed in the first printed wiring board are disposed a predetermined depth below a surface of the printed wiring board, typically to a depth of between 0.007 inches and 0.020 inches below the surface. The plurality of plated holes are formed by electroless plating or electroplating of the holes. The present interconnection structure provides for reliable and self aligning interconnection of the two printed wiring boards or the flexprint circuit and printed wiring board.

Abstract: A brushless rotary connector comprising first and second housings that are rotatable relative to each other and respectively house first and second flat flexible printed circuits having conductive contacts disposed adjacent each other that are rotatable relative to each other. Electrical cables are coupled to the respective conductive contacts. The conductive contacts rotate relative to each other while maintaining contact with each other as the housings rotate, thus permitting electrical signals to be coupled through the connector.

Abstract: A three dimensional stacked integrated circuit system. The system includes a motherboard, a plurality of stacked integrated circuit subassemblies, and a plurality of Z-flex circuits coupled therebetween. The plurality of stacked integrated circuit subassemblies each comprise a base, an integrated circuit, and an X-Y flexprint circuit folded around the edges of the base that provides conducting paths thereto. The base comprises a heat conducting material, such as aluminum, aluminum nitride, alumina, beryllium oxide, or copper, for example. The X-Y flexprint circuits comprise printed interconnects that provide conducting paths between the motherboard and the integrated circuit subassemblies. The Z-flex printed circuits comprise a plurality of bumps that mate with a plurality of rings of the X-Y flexprint circuits, and a plurality of wrinkles that accommodate tolerance build up between the integrated circuit subassemblies.

Abstract: An integrated circuit testing system for testing small quantities of integrated circuit die. The testing system includes an integrated circuit tester and a base printed wiring board interface that physically and electrically interfaces thereto. A die holder that holds an integrated circuit die is coupled to the base printed wiring board interface. A flexprint structure including first and second flexible contact structures is provided that electrically connect to the base printed wiring board interface, to pads on the integrated circuit die, and to each other to provide for electrical connection between the tester and the die. A plurality of alignment pins are provided for aligning the first and second flexible contact structures to each other and to the pads on the integrated circuit die.

Abstract: A composition for forming an electrodeposited tin-lead alloy of controlled composition comprising:(a) about 1.5 to 1.8 percent by weight lead fluoroborate;(b) about 2.5 to 2.75 percent by weight tin fluoroborate;(c) about 91 to 92 percent by weight fluoroboric acid;(d) about 2.7 to 3.4 percent by weight boric acid; and(e) about 0.3 to 0.9 percent by weight Peptone,wherein the alloy comprises 62-64 weight percent tin and 36-38 weight percent lead.

Abstract: A pair of electrical circuits (20, 22), which may be both flexible or one flexible and one rigid, are interconnected by projections, such as bumps (24) and rings (26) . The projections are formed from substantially inelastic dielectric material, such as an epoxy defining bumps (34) and rings (36), which are plated with copper (38). Projections (24, 26) of one circuit are disposed to interconnect with mating projections on the other circuit, the interconnection being bump to bump, bump to ring, or bump to pad. The projections may be formed on a copper-clad substrate (42) or on plated-through holes (72) on a printed wiring board (70). Alternately, polygonal pads (94) on a circuit (90) may be joined to a projection. Further, a plurality of bump projections (106), electrically connected to the same or different circuits, may collectively interconnect with a single oval ring projection (108).