Abstract: A pair of electrical circuits (20, 22), which may be both flexible or one flexible and one rigid, are interconnected by projections, such as bumps (24) and rings (26). The projections are formed from substantially inelastic dielectric material, such as an epoxy, defining bumps (34) and rings (36), which are plated with copper (38). Projections (24, 26) of one circuit are disposed to interconnect with mating projections on the other circuit, the interconnection being bump to bump, bump to ring, or bump to pad. The projections may be formed on a copper-clad substrate (42) or on plated-through holes (72) on a printed wiring board (70). Alternately, polygonal pads (94) on a circuit (90) may be joined to a projection. Further, a plurality of bump projections (106), electrically connected to the same or different circuits, may collectively interconnect with a single oval ring projection (108).

Abstract: A hermetically sealed electronics package in which an electronic element located on a support is hermetically sealed using a cover comprising the top layer of a multilayer flexprint or a separate flexprint. The top layer of the flexprint or the separate flexprint is supported above the electronic element by a frame structure. When the cover comprises the top flexprint layer, the top layer is only partially bonded to the underlying flexprint during fabrication of the package. After circuit placement, the flap portion of the top flexprint layer is bonded to the flexprint to provide hermetic sealing of the underlying electronic elements. The frame structure provides support for the flexprint cover to prevent deformation of the cover and resulting damage to the underlying circuit. A cooling system is also disclosed for use in combination with the hermetic seal configuration to provide an electronic package which is protected from both contaminants and built-up heat.

Abstract: Electrical interconnects, contained in a supported bulge (42, 90) which extends substantially across a circuit or flexible cable (24, 92) in a continuous ridge pattern, are formed in both one or more of electrical conductors (32, 94) in the circuit or flexible cable and in any insulation (34, 98) underlying and adjacent to the conductors at the sites of the interconnects. The bulges may be placed individually in each conductor, or traverse the circuit or cable in a straight, curved, segmented or other broken or unbroken meandering path as a V-shaped or hollow shaped fold, wrinkle or crease in both the conductors and any insulation underlying the conductors at the sites of the interconnects. Supports (56, 108) for the bulges are so composed as to be physically, electrically and chemically compatible with their surrounding materials. Such interconnects are employable in circuits or flexible cables whose line widths and spacings are 3 mil (0.0762 mm) or less in dimension.

Abstract: An electrical connector assembly (10) comprises first and second electrical connectors (12 and 14) and/or a printed wiring board (70) having electrical conductors thereon ending in termini (32, 34). Dimples (36, 38 and/or 72) are provided on the termini and provide connections between the flex cables or a flex cable and the printed wiring board. The dimples also provide self-alignment between the matable electrical connectors.