Abstract: Node interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.

Abstract: Technical solutions are described for determining a population count of an input bit-string. In an example, a population count circuit receives a single n-bit input data word including of bits A[n?1:0]. The population count circuit isolates a pair of 4-bit nibbles. The population count circuit includes a carryless counter circuit that determines a pair of counts of 1s, one for each 4-bit nibble. The population circuit further includes an adder circuit that determines the population count by summing the pair of counts of 1s from the carryless counter circuit, where the adder circuit determines the most significant bit (MSB) of the sum based on the MSBs of the counts of 1s only, without depending on carry propagation.

Abstract: Technical solutions are described for determining a population count of an input bit-string. In an example, a population count circuit receives a single n-bit input data word including of bits A[n?1:0]. The population count circuit isolates a pair of 4-bit nibbles. The population count circuit includes a carryless counter circuit that determines a pair of counts of 1s, one for each 4-bit nibble. The population circuit further includes an adder circuit that determines the population count by summing the pair of counts of 1s from the carryless counter circuit, where the adder circuit determines the most significant bit (MSB) of the sum based on the MSBs of the counts of 1s only, without depending on carry propagation.

Abstract: A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.

Abstract: A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.

Abstract: Node interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.

Abstract: Compute clusters to implement a high performance computer are provided. For example, a compute cluster includes an optical redistribution box, and a processor module comprising M processors. The optical redistribution box includes N optical input connectors, N optical global connectors, and internal optical connections configured to connect each optical input connector to every optical global connector such that each duplex pair of a given optical input bundle connected connected to the optical global connectors. A first group of N processors (wherein N=M/2) of the processor module is optically connected to one of the optical input connectors via one of the optical input bundles, and second group of N processors of the processor module is optically connected to one of the optical global connectors via one of the optical global bundles.

Abstract: Node interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.

Abstract: Node Interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.

Abstract: A chip stack structure includes a logic chip having an active device surface, and memory slices of a memory unit vertically aligned such that a surface of the memory slices is oriented perpendicular to the active device surface of the logic chip. The chip stack structure also includes wiring patterned on an upper surface of the memory slices, the wiring electrically connecting memory leads of the memory slices to logic grids corresponding to logic grid connections of the logic chip.

Abstract: Node Interconnect architectures to implement a high performance supercomputer are provided. For example, a node interconnect architecture for connecting a multitude of nodes (or processors) of a supercomputer is implemented using an all-to-all electrical and optical connection network which provides two independent communication paths between any two processors of the supercomputer, wherein a communication path includes at most two electrical links and one optical link.

Abstract: A system, method, and design structure for address-event-representation network simulation are provided. The system includes a hardware structure with a plurality of interconnected processing modules configured to simulate a plurality of interconnected nodes. To simulate each node, the hardware structure includes a source table configured to receive an input message and identify a weight associated with a source of the input message. The hardware structure also includes state management logic configured to update a node state as a function of the identified weight, and generate an output signal responsive to the updated node state. The hardware structure further includes a target table configured to generate an output message in response to the output signal, identify a target to receive the output message, and transmit the output message. The hardware structure may further include learning logic configured to combine information about input messages and generated output signals, and to update weights.

Abstract: A chip stack structure includes a logic chip having an active device surface, and memory slices of a memory unit vertically aligned such that a surface of the memory slices is oriented perpendicular to the active device surface of the logic chip. The chip stack structure also includes wiring patterned on an upper surface of the memory slices, the wiring electrically connecting memory leads of the memory slices to logic grids corresponding to logic grid connections of the logic chip.

Abstract: A multiprocessor system comprising a plurality of processors is disclosed. The plurality of processors includes a first processor including first monitor on-chip and a second processor including a including a second monitor on-chip. The first monitor on-chip is configured to measure load on the second processor and the second monitor on-chip is configured to measure load on the first processor. The first monitor on-chip is configured to cause the second monitor on-chip to perform a self-test on the second processor if the load on the second processor is below a second processor load threshold value and the second monitor on-chip is configured to cause the first monitor on-chip to perform a self-test on the first processor if the load on the first processor is below first processor load threshold value.

Abstract: A system, method, and design structure for address-event-representation network simulation are provided. The system includes a hardware structure with a plurality of interconnected processing modules configured to simulate a plurality of interconnected nodes. To simulate each node, the hardware structure includes a source table configured to receive an input message and identify a weight associated with a source of the input message. The hardware structure also includes state management logic configured to update a node state as a function of the identified weight, and generate an output signal responsive to the updated node state. The hardware structure further includes a target table configured to generate an output message in response to the output signal, identify a target to receive the output message, and transmit the output message. The hardware structure may further include learning logic configured to combine information about input messages and generated output signals, and to update weights.

Abstract: A multiprocessor system comprising a plurality of processors is disclosed. The plurality of processors includes a first processor including first monitor on-chip and a second processor including a including a second monitor on-chip. The first monitor on-chip is configured to measure load on the second processor and the second monitor on-chip is configured to measure load on the first processor. The first monitor on-chip is configured to cause the second monitor on-chip to perform a self-test on the second processor if the load on the second processor is below a second processor load threshold value and the second monitor on-chip is configured to cause the first monitor on-chip to perform a self-test on the first processor if the load on the first processor is below first processor load threshold value.

Abstract: There is provided a method for routing packets on a linear of N processors connected in a nearest neighbor configuration. The method includes the step of, for each end processor of the array, connecting unused outputs to corresponding unused inputs. For each axis required to directly route a packet from a source to a destination processor, the following steps are performed. It is determined whether a result of directly sending a packet from an initial processor to a target processor is less than or greater than N/2 moves, respectively. The initial processor is the source processor in the first axis, and the target processor is the destination processor in the last axis. The packet is directly sent from the initial processor to the target processor, when the result is less than N/2 moves. The packet is indirectly sent so as to wrap around each end processor, when the result is greater than N/2 moves.

Abstract: An architecture that achieves high speed performance in a network protocol handler combines parallelism and pipelining in multiple programmable processors, along with specialized front-end logic at the network interface that handles time critical protocol operations. The multiple processors are interconnected via high-speed interconnect, and each processor's memory is globally accessible by other processors. Each processor has multiple threads, each capable of fully executing programs. Each processors contains embedded dynamic random access memory (DRAM). Threads within a processor are assigned the processing of various protocol functions in a parallel/pipelined fashion. Data frame processing is done by one or more of the threads to identify relates frames. Related frames are dispatch to the same thread so as to minimize the overhead associated with memory accesses and general protocol processing.

Abstract: There is provided a method for routing packets on a linear array of N processors connected in a nearest neighbor configuration. The method includes the step of, for each end processor of the array, connecting unused outputs to corresponding unused inputs. For each axis required to directly route a packet from a source to a destination processor, the following steps are performed. It is determined whether a result of directly sending a packet from an initial processor to a target processor is less than or greater than N/2 moves, respectively. The initial processor is the source processor in the first axis, and the target processor is the destination processor in the last axis. The packet is directly sent from the initial processor to the target processor, when the result is less than N/2 moves. The packet is indirectly sent so as to wrap around each end processor, when the result is greater than N/2 moves.

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.