Abstract: A semiconductor memory apparatus includes a synchronized signal generation circuit, a serial-to-parallel data conversion unit and a data storage region. The synchronized signal generation unit outputs one of a data input/output strobe signal and a delay locked clock signal as synchronized signals in response to a control signal in a write operation. The serial-to-parallel data conversion unit converts serial data into parallel data in response to the synchronized signals. The parallel data is stored in the data storage region.

Abstract: A semiconductor memory device includes a memory core configured to sequentially activate first and second banks in response to first and second bank active signals which are sequentially enabled in response to first and second enable signals when a self-refresh operation is to be performed, select a word line by row addresses, and perform a refresh operation for memory cells which are connected with the word line; and an address counter configured to perform a counting operation for the row addresses in response to a counter signal, and interrupt the counting operation for the row addresses in a case where both the first and second banks are not activated when the self-refresh operation is ended.

Abstract: A semiconductor device includes a clock supply circuit configured to generate an internal clock by using an external clock, an internal circuit configured to operate in synchronization with the internal clock and enter a power-down mode in response to a power-down signal, and a controller configured to control an entry of the clock supply circuit into the power-down mode in response to a locking signal, which represents that the clock supply circuit has been locked, and the power-down signal.

Abstract: A semiconductor device includes a differential input unit configured to generate internal differential signals based on external differential signals by using a first level voltage, a signal conversion unit configured to generate an internal synchronization signal based on the internal differential signals in response termination control signals by using a second level voltage, and a duty correction unit configured to correct duty of the internal synchronization signal by using the second level voltage.

Abstract: A semiconductor integrated circuit includes a first pad allocated to receive a row address, a second pad allocated to discriminate a first input/output mode and a second input/output mode, a detector configured to generate a detection signal in response to logic levels of the first and second pads, and a column address controller configured to deassert a column address to a logic low level in response to a deasserted detection signal. The semiconductor integrated circuit may selectively support one of first and second memory capacities and one of the first and second input/output modes using the logic levels of the first and second pads.

Abstract: A semiconductor memory device includes a write control signal generating circuit and a write enable signal generating unit. The write control signal generating circuit is configured to generate a write control signal activated during a time period from an input time point of a read command to an end time point of a data output time period. The write enable signal generating unit is configured to output a write command as a write enable signal in response to the write control signal.

Abstract: A slave device communicating with a master device includes a transmission unit configured to transmit a signal to the master device through a communication channel, a calibration unit configured to measure a flight time of a calibration signal which is transmitted to the master device and fed back through a calibration channel coupled to the master device, and a transmission delay unit configured to delay the signal transmitted from an internal circuit of the slave device to the transmission unit by a delay value determined according to the measurement result of the calibration unit.

Abstract: A semiconductor integrated circuit includes a column redundancy fuse block having a fuse set array having a plurality of fuse sets including a plurality of column address fuses, and a fuse blowing information block configured to output a fuse blowing determination signal of a corresponding column based on a cutting state of the column address fuses, wherein the column redundancy fuse is disposed in the edge area, wherein the fuse blowing determination signal is inputted to a column control block through upper portion of a memory cell array of a corresponding bank.

Abstract: A column repair circuit of a semiconductor memory apparatus includes a plurality of mats and performs a column repair operation to replace failed cells among a plurality of memory cells provided in the mats. The column repair circuit includes two or more fuse units configured to perform the column repair operation. Each of the fuse units includes a plurality of fuses, and is configured in such a manner that m mats correspond to one fuse or n mats correspond to one fuse, where m and n are natural numbers equal to or more than 1 and different from each other.

Abstract: A semiconductor device includes a clock supply circuit configured to generate an internal clock by using an external clock, an internal circuit configured to operate in synchronization with the internal clock and enter a power-down mode in response to a power-down signal, and a controller configured to control an entry of the clock supply circuit into the power-down mode in response to a locking signal, which represents that the clock supply circuit has been locked, and the power-down signal.

Abstract: A semiconductor device includes a clock supply circuit configured to generate an internal clock by using an external clock, an internal circuit configured to operate in synchronization with the internal clock and enter a power-down mode in response to a power-down signal, and a controller configured to control an entry of the clock supply circuit into the power-down mode in response to a locking signal, which represents that the clock supply circuit has been locked, and the power-down signal.

Abstract: A semiconductor memory device includes a memory core configured to sequentially activate first and second banks in response to first and second bank active signals which are sequentially enabled in response to first and second enable signals when a self-refresh operation is to be performed, select a word line by row addresses, and perform a refresh operation for memory cells which are connected with the word line; and an address counter configured to perform a counting operation for the row addresses in response to a counter signal, and interrupt the counting operation for the row addresses in a case where both the first and second banks are not activated when the self-refresh operation is ended.

Abstract: A command decoder includes a snoop read control signal generation unit that generates a snoop read control signal from a internal chip select signal according to a level of a transmission mode control signal, and an internal snoop read command generation unit that generates an internal snoop read command by driving a first node in response to an internal command and the snoop read control signal.

Abstract: A semiconductor memory apparatus includes a synchronized signal generation circuit, a serial-to-parallel data conversion unit and a data storage region. The synchronized signal generation unit outputs one of a data input/output strobe signal and a delay locked clock signal as synchronized signals in response to a control signal in a write operation. The serial-to-parallel data conversion unit converts serial data into parallel data in response to the synchronized signals. The parallel data is stored in the data storage region.

Abstract: A semiconductor integrated circuit includes a first pad allocated to receive a row address, a second pad allocated to discriminate a first input/output mode and a second input/output mode, a detector configured to generate a detection signal in response to logic levels of the first and second pads, and a column address controller configured to deassert a column address to a logic low level in response to a deasserted detection signal. The semiconductor integrated circuit may selectively support one of first and second memory capacities and one of the first and second input/output modes using the logic levels of the first and second pads.

Abstract: A semiconductor integrated circuit includes a semiconductor chip having an edge area and a bank area located an inner portion of the edge area, and a column redundancy fuse block disposed in the edge area.

Abstract: A semiconductor memory device includes a write control signal generating circuit and a write enable signal generating unit. The write control signal generating circuit is configured to generate a write control signal activated during a time period from an input time point of a read command to an end time point of a data output time period. The write enable signal generating unit is configured to output a write command as a write enable signal in response to the write control signal.

Abstract: A slave device communicating with a master device includes a transmission unit configured to transmit a signal to the master device through a communication channel, a calibration unit configured to measure a flight time of a calibration signal which is transmitted to the master device and fed back through a calibration channel coupled to the master device, and a transmission delay unit configured to delay the signal transmitted from an internal circuit of the slave device to the transmission unit by a delay value determined according to the measurement result of the calibration unit.

Abstract: A semiconductor integrated circuit includes a column redundancy fuse block having a fuse set array having a plurality of fuse sets including a plurality of column address fuses, and a fuse blowing information block configured to output a fuse blowing determination signal of a corresponding column based on a cutting state of the column address fuses, wherein the column redundancy fuse is disposed in the edge area, wherein the fuse blowing determination signal is inputted to a column control block through upper portion of a memory cell array of a corresponding bank.

Abstract: A semiconductor device includes a clock supply circuit configured to generate an internal clock by using an external clock, an internal circuit configured to operate in synchronization with the internal clock and enter a power-down mode in response to a power-down signal, and a controller configured to control an entry of the clock supply circuit into the power-down mode in response to a locking signal, which represents that the clock supply circuit has been locked, and the power-down signal.