Abstract: An image recognition method and apparatus. The method comprises: obtaining original image data, convolutional neural network configuration parameters, and convolutional neural network operation parameters from a data transfer bus, the original image data comprising M pieces of pixel data, and M being a positive integer (101); and performing convolutional neural network operation on the original image data by a convolutional neural network operation module according to the convolutional neural network configuration parameters and the convolutional neural network operation parameters (102), wherein the convolutional neural network operation module comprises a convolution operation unit, a batch processing operation unit, and an activation operation unit connected in sequence. The method improves the real timeliness of image recognition.

Abstract: The invention provides an on-chip passive power supply compensation circuit, and an operational unit, a chip, a hash board and a computing device using the same. The on-chip passive power supply compensation circuit comprises: two or more to-be-powered voltage domains, wherein the to-be-powered voltage domains are connected in series between a power supply and ground; and two or more isolation regions, wherein the to-be-powered voltage domains are formed in the isolation regions, and the isolation regions are configured for isolating the to-be-powered voltage domains; the isolation regions are connected in series between the power supply and the ground, wherein the on-chip passive power supply compensation circuit further comprises power supply compensation units connected between the to-be-powered voltage domains and the isolation regions for providing power supply compensation to the to-be-powered voltage domains.

Abstract: The invention provides a chip frequency modulation method and apparatus of a computing device, a hash board, a computing device and a storage medium. The chip frequency modulation method comprises: setting a plurality of working frequencies for the operational chip and causing the plurality of cores work at the respective working frequencies; analyzing a computing performance indicator of each core at its current working frequency; and modulating the current working frequency of the core up or down according to the computing performance indicator of the core modulating the frequency of a core with high computing performance up and modulating the frequency of a core with low computing performance down. Therefore, the invention can automatically modulate a frequency corresponding to each core according to the actual computing performance of each core in the operational chip of the computing device, thereby maximizing the computing performance of the cores.

Abstract: The invention provides a dynamic D flip-flop, and a data operation unit, a chip, a hash board and a computing device using the same. The dynamic D flip-flop comprises: an input terminal, an output terminal and at least one clock signal terminal; a first latch unit for transmitting data of the input terminal and latching the data under control of a clock signal; a second latch unit for latching data of the output terminal and inversely transmitting the data latched by the first latch unit under control of a clock signal; and an output driving unit for inverting and outputting the data received from the second latch unit; wherein the second latch unit outputs in high level, low level and high impedance states by means of a single element under control of a clock signal. Therefore, the invention can effectively reduce chip area, power consumption, and logic delay.

Abstract: The invention provides a voltage-following series power supply circuit, comprising a power supply end and a ground end; a power supply module comprising an input end connected to the power supply end, and an output end for providing a power supply to two or more to-be-powered chips, the power supply module and the to-be-powered chips connected in series between the power supply end and the ground end; and at least one auxiliary power supply module for supplying an auxiliary power supply to the to-be-powered chips, wherein a voltage following module is further connected between the power supply end and the auxiliary power supply module for adjusting a voltage of the auxiliary power supply.

Abstract: A data compression method, comprising: obtaining a plurality of values of a parameter and an occurrence probability of each of the plurality of values (S101) comparing the occurrence probability with a predetermined threshold, wherein values with the occurrence probability less than the predetermined threshold are first set of values, and values with the occurrence probability greater than or equal to the predetermined threshold are second set of values (S102), performing pretreatment on the first set of values (S103), and encoding the second set of values and the pretreated first set of values (S104). By means of the data compression method, the maximum codeword length can be effectively reduced, so as to reduce the requirements of a code table to the storage space.

Abstract: A printed circuit board structure and a wiring method therefor are disclosed. The printed circuit board structure comprises a first wiring channel formed inside the printed circuit board for transmitting a circuit signal; a pin, connected to the first wiring channel for connecting a chip to the printed circuit board; the pin comprising an unused pin and a used pin, the used pin comprising a peripheral pin and an internal pin; wherein the printed circuit board further comprises a second wiring channel, the second wiring channel leads out the internal pin by means of covering at least a portion of the unused pin. By means of using a printed circuit board structure and a wiring method to configure pins of the printed circuit board, the number of printed circuit board layers is reduced, and the current carrying capacity is enhanced.

Abstract: A printed circuit board structure and a wiring method therefor are disclosed. The printed circuit board structure comprises a first wiring channel formed inside the printed circuit board for transmitting a circuit signal; a pin, connected to the first wiring channel for connecting a chip to the printed circuit board; the pin comprising an unused pin and a used pin, the used pin comprising a peripheral pin and an internal pin; wherein the printed circuit board further comprises a second wiring channel, the second wiring channel leads out the internal pin by means of covering at least a portion of the unused pin. By means of using a printed circuit board structure and a wiring method to configure pins of the printed circuit board, the number of printed circuit board layers is reduced, and the current carrying capacity is enhanced.

Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. The computing device of the disclosure includes a device housing enclosing an enclosed heat-dissipation air duct, and the computational heat dissipation structure; the computational heat dissipation structure is located in the enclosed heat-dissipation air duct. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e.

Abstract: The present invention discloses a series circuit and a computing device, including: a power supply terminal for providing voltage for a plurality of chips disposed on the computing device; a ground terminal disposed at one end of each of the plurality of chips relative to the power supply terminal; and a first connection line for separately connecting a first predetermined number of chips of the plurality of chips in series, wherein a communication line is connected between adjacent chips of the first predetermined number of chips, a portion of the communication line is connected to a target connection point, which is disposed on the first connection line and adapted to the adjacent chips, via a second connection line, and the voltage at the target connection point is greater than or equal to the minimum voltage required for communication between the adjacent chips.