Abstract: The invention relates to a peel detection label that is a laminate including a support, a pattern layer formed in a part of the surface of the support, and a pressure-sensitive adhesive laminate having at least a low modulus layer (X), a high modulus layer (Y) and a pressure-sensitive adhesive layer (Z) in that order, in which the low modulus layer (X) has a surface in contact with the support and the pattern layer and a surface in contact with the high modulus layer (Y), and satisfies the following requirement (1): Requirement (1): when the pressure-sensitive adhesive layer (Z) of the peel detection label is attached to an adherend and then the peel detection label is peeled off from the adherend, the maximum vertical tensile stress applied to an element of the low modulus layer (X) that is located closest to the support is 0.19 MPa or more when analyzed by a finite element method using Abaqus.

Abstract: The present invention addresses the problem of providing a method and a reagent for measuring the uptake capacity of a lipoprotein with higher accuracy. This problem is solved by preparing a lipoprotein incorporating a labeled sterol, by mixing the lipoprotein in a sample and the labeled sterol in the presence of a surfactant having no cyclic structure, and measuring the uptake capacity of the labeled sterol of the lipoprotein.

Abstract: Disclosed is a method for acquiring information on an analyte, comprising the steps of: bringing a polypeptide that is the analyte into contact with a capture substance that binds to the polypeptide to form a complex comprising the polypeptide and the capture substance; bonding the capture substance in the complex to a first solid phase to immobilize the complex onto the first solid phase; collecting the first solid phase having the complex immobilized on the first solid phase; releasing the complex from the collected first solid phase, and then bonding the capture substance in the released complex to a second solid phase to immobilize the complex onto the second solid phase; and acquiring information on the polypeptide from the complex immobilized on the second solid phase, wherein a capture substance that binds to at least one of the first solid phase and the second solid phase binds to a C-terminal region of the polypeptide.

Abstract: Provided is a monoclonal antibody or antigen-binding fragment thereof which binds to a peptide consisting of 51st to 110th amino acid sequence or a peptide consisting of 201st to 267th amino acid sequence of an amino acid sequence of SEQ ID NO: 1, and is capable of binding to high-density lipoproteins of (1) to (3) below; (1) high-density lipoprotein that is oxidatively modified, (2) high-density lipoprotein that is not oxidatively modified, and (3) high-density lipoprotein incorporating labeled cholesterol.

Abstract: A protective film forming film 1 is provided in which the product of the breaking stress (MPa) measured at a measurement temperature of 0° C. and the breaking strain (unit: %) measured at a measurement temperature of 0° C. in at least one of the protective film forming film 1 and a protective film formed from the protective film forming film 1 is in a range of 1 MPa·% to 250 MPa·%. According to such a protective film forming film 1, the protective film forming film 1 or the protective film formed from the protective film forming film 1 can be suitably divided in an expanding process performed on a workpiece when the workpiece is divided to obtain a work product.

Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.

Abstract: A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.

Abstract: A protective film-forming composite sheet 10 comprises a pressure sensitive adhesive sheet 16 in which a pressure sensitive adhesive layer 12 is provided on a base material 11, a protective film-forming film 13, and a release film 14. When ? (mN/25 mm) represents the maximum peel force between the protective film-forming film 13 and the release film 14; ? (mN/25 mm) represents the minimum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13; and ? (mN/25 mm) represents the maximum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13, the following relationships (1) to (3) hold for ?, ?, and ?; ??70??(1) ?/??0.50??(2) ??2000??(3).

Abstract: A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm? [N/(2 mm×2 mm)] or more and 50 N/2 mm? [N/(2 mm×2 mm)] or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.

Abstract: A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.

Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Abstract: A protective film forming film 1 is provided in which the product of the breaking stress (MPa) measured at a measurement temperature of 0° C. and the breaking strain (unit: %) measured at a measurement temperature of 0° C. in at least one of the protective film forming film 1 and a protective film formed from the protective film forming film 1 is in a range of 1 MPa·% to 250 MPa·%. According to such a protective film forming film 1, the protective film forming film 1 or the protective film formed from the protective film forming film 1 can be suitably divided in an expanding process performed on a workpiece when the workpiece is divided to obtain a work product.

Abstract: A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm? or more and 50 N/2 mm? or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.

Abstract: A composite sheet 1 for forming a protective film which includes: a pressure sensitive adhesive sheet 2 obtained by laminating a pressure sensitive adhesive layer 22 on one surface of a base material 21; a protective film-forming film 3 laminated on the pressure sensitive adhesive layer 22 side of the pressure sensitive adhesive sheet 2; and a pressure sensitive adhesive layer 4 for jigs, the layer being laminated on a peripheral portion on the opposite side of the pressure sensitive adhesive sheet 2 side of the protective film-forming film 3, wherein a thickness of the pressure sensitive adhesive layer 22 of the pressure sensitive adhesive sheet 2 is from 1 to 8 ?m. According to the composite sheet 1 for forming a protective film, it is possible to effectively suppress loosening of the sheet 1 in the heating step and the cooling step, and the dicing and picking up processes can also be performed satisfactorily.

Abstract: A composite sheet (1) for forming a protective film which is provided with an adhesive sheet (2) formed by laminating an adhesive layer (22) on one surface of a base material (21), and a protective-film forming film (3) laminated on the adhesive layer (22) side of the adhesive sheet (2), wherein the adhesive sheet (2) does not have a through hole penetrating the adhesive sheet (2) in the thickness direction, and the light transmittance at a wavelength of 532 nm of the adhesive sheet (2), measured using an integrating sphere, is from 25 to 85%.

Abstract: A composite sheet (1) for forming a protective film, including an adhesive sheet (2) formed by laminating an adhesive layer (22) on one surface of a base material (21), and a protective-film forming film (3) laminated on the adhesive layer (22) side of the adhesive sheet (2), wherein the adhesive sheet (2) does not have a through hole penetrating through the adhesive sheet (2) in the thickness direction, and the light transmittance of the adhesive sheet (2) at a wavelength of 532 nm which is measured using an integrating sphere is from 75 to 85%. According to this composite sheet (1) for forming a protective film, while using an adhesive sheet having no through holes, it is still possible to suppress the generation of a gas reservoir between the adhesive sheet and the protective-film forming film (protective film) when laser printing is performed on the protective-film forming film (protective film).

Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having a reactive double bond group, and a filler (C) having a reactive double bond group on a surface thereof. The acrylic polymer (A) has a weight average molecular weight of 500,000 or more, and the heat curable resin (B) comprises an epoxy resin and a heat curing agent, in which at least one of the epoxy resin and the heat curing agent has the reactive double bond group.

Abstract: A protective film-forming composite sheet 10 comprises a pressure sensitive adhesive sheet 16 in which a pressure sensitive adhesive layer 12 is provided on a base material 11, a protective film-forming film 13, and a release film 14. When ? (mN/25 mm) represents the maximum peel force between the protective film-forming film 13 and the release film 14; ? (mN/25 mm) represents the minimum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13; and ? (mN/25 mm) represents the maximum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13, the following relationships (1) to (3) hold for ?, ?, and ?; ??70??(1) ?/??0.50??(2) ??2000??(3).

Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.