Abstract: The invention provides a marking method in which marking is performed on a protective film formed on a work with a high accuracy while suppressing a warpage and, also, a sheet for both protective film forming and dicing which is advantageously used in the method. The marking method comprises irradiating laser light to a laminated structure comprising a support film tensely supported by a ring frame, a protective film releasably laminated on the support film and a work fixed to the protective film, wherein the protective film is irradiated laser light from a side of the support film, to thereby mark the protective film.

Abstract: Disclosed herein is a hardenable pressure-sensitive adhesive sheet enabling production of a semiconductor device of high reliability while preventing the occurrence of package cracking and other failure; and a process for producing a semiconductor device with the use of the hardenable pressure-sensitive adhesive sheet. There is provided a hardenable pressure-sensitive adhesive sheet having a hardenable pressure-sensitive adhesive layer comprising a pressure-sensitive component (A) and an epoxy resin (B), wherein the hardenable pressure-sensitive adhesive layer after thermal curing has a storage modulus of 1.0×107 Pa or below at 100° C. and 1.0×105 Pa or above at 160° C.